• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 한국컴퓨터정보학회논문지
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• 제21권11호
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• pp.59-64
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• 2016

In this paper, we design and implement an Application based on android platform, which can control arduino Prime Smart Car using Bluetooth communication. This Application consist of Bluetooth communication module, manual mode module, and line-tracer mode module. In the Bluetooth communication module, it checks the on/off status of Smartphone Bluetooth. If Bluetooth status is off, it activates Bluetooth, selects the corresponding device from Bluetooth device list, and connects with a pair. In order to reduce coding time, we implements Bluetooth communication using inherited class from android Bluetooth package. In the manual mode module, it implements six direction moving button and stop button, which can control arduino Prime Smart Car. In the line-tracer mode module, it implements Prime Smart Car with self-driving function using TCRT5000 sensor. And moving button and stop button is disabled.

• 한국정밀공학회지
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• 제23권7호
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• pp.130-137
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• 2006

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact test-redesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• 대한수학회논문집
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• 제19권4호
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• pp.619-637
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• 2004

In this paper, a left module over an associative ring with identity is defined to be openly semiprimitive (strongly semiprimitive, respectively) by the zero intersection of all maximal open fully invariant submodules (all maximal open submodules which are fully invariant, respectively) of it. For any projective module, the openly semiprimitivity of the projective module is an equivalent condition of the semiprimitivity of endomorphism ring of the projective module and the strongly semiprimitivity of the projective module is an equivalent condition of the endomorphism ring of the projective module being a sub direct product of a set of subdivisions of division rings.

• 대한수학회보
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• 제51권3호
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• pp.613-619
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• 2014

It is well known that a direct sum of CLS-modules is not, in general, a CLS-module. It is proved that if $M=M_1{\oplus}M_2$, where $M_1$ and $M_2$ are CLS-modules such that $M_1$ and $M_2$ are relatively ojective (or $M_1$ is $M_2$-ejective), then M is a CLS-module and some known results are generalized.

• 대한수학회보
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• 제45권3호
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• pp.445-456
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• 2008

Let M be a right R-module, G an ordered group and ${\sigma}$ a map from G into the group of automorphisms of R. The conditions under which the Malcev-Neumann module M* ((G)) is a PS module and a p.q.Baer module are investigated in this paper. It is shown that: (1) If $M_R$ is a reduced ${\sigma}$-compatible module, then the Malcev-Neumann module M* ((G)) over a PS-module is also a PS-module; (2) If $M_R$ is a faithful ${\sigma}$-compatible module, then the Malcev-Neumann module M* ((G)) is a p.q.Baer module if and only if the right annihilator of any G-indexed family of cyclic submodules of M in R is generated by an idempotent of R.

• 멤브레인
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• 제18권1호
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• pp.1-6
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• 2008

아크릴 폐수를 응집-여과-중화의 전처리 공정에 적용하여 막오염 인자를 최소화 한 후 UF/RO 공정에 적용하였다. 막의 형태 및 종류에 따라 한외여과 및 역삼투 모듈을 조합을 이루어 전처리 수를 온도 및 압력변화에 따라 적용하여 분리 특성을 고찰하였다. 투과 플럭스는 모듈 set 1의 UF모듈보다 모듈 set 4의 UF모듈의 투과량이 약 $2{\sim}3$배 더 많이 배출됨을 확인하였다. 최종적인 투과량은 관형모듈과 조합을 이룬 모듈 set 2와 모듈 set 3이 좋은 결과를 나타내었다. 모든 UF 모듈에서 TDS, T-N 및 COD의 제거 효율은 온도 및 압력변화에 영향을 받지 않고 제거 효율 또한 낮음을 알 수 있었다. RO모듈에서 TDS, T-N 및 COD가 우수한 제거 효율을 보였다. 아크릴 폐수의 최종적인 수질결과는 공장폐수의 배출 허용기준을 만족하였고, 막모듈 조합은 폐수의 재활용 가능성을 확인할 수 있었다.

• 한국기계가공학회지
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• 제10권4호
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• pp.109-114
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• 2011

An impeller is difficult to machine because of severe collision due to the complex shape, overlapping and twisted shape that form impeller blades. So, most CAM software companies have developed CAM module for manufacturing impeller in addition to their CAM software. But it is not still easy for inexperienced users to machine impellers. The purpose of this paper is the development of automatic CAM module for manufacturing impeller(E-ICAM) which is based on visual basic language and it is used CATIA graphical environment in order to be easily machining impellers. Automatic CAM module for manufacturing of impellers generates tool path, and proposes recommended cutting condition according to the material of stock and tool. In addition, it has also included a post processor for 5-axis control machining. Therefore the user can easily machine impellers using this automation module.

• 한국IT서비스학회지
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• 제6권3호
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• pp.195-207
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• 2007

This study describes the design and implementation of web based collaborative learning system to improve interactivity among learners. Based on suggestions from previous studies, the system is composed of three main parts : the community module, the learning module, and the administrative module. The study participants were 254 university students from two different institutions. They were divided into 43 groups and asked to complete an online TOEIC preparation module using the learning system over 4 weeks. Survey data were collected at three points from each participant-before and 3 weeks after the beginning of the online module and at the completion of the module. The result indicates that the usage of this system is positively related to the learners' collaborative learning activities, the level of sense of community, and learner satisfaction both at the individual and group levels.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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• pp.171-174
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• 2003

In this paper, a Learning module for a reconfigurable neural network processor(ERNIE) was proposed for an On-chip learning. The existing reconfigurable neural network processor(ERNIE) has a much better performance than the software program but it doesn't support On-chip learning function. A learning module which is based on Back Propagation algorithm was designed for a help of this weak point. A pipeline structure let the learning module be able to update the weights rapidly and continuously. It was tested with five types of alphabet font to evaluate learning module. It compared with C programed neural network model on PC in calculation speed and correctness of recognition. As a result of this experiment, it can be found that the neural network processor(ERNIE) with learning module decrease the neural network training time efficiently at the same recognition rate compared with software computing based neural network model. This On-chip learning module showed that the reconfigurable neural network processor(ERNIE) could be a evolvable neural network processor which can fine the optimal configuration of network by itself.