• 플랜트 저널
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• 제5권2호
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• pp.50-55
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• 2009

Promoting policy to involve plant EPC companies for package deal has been studied to acquire overseas energy resources. The effectiveness of the package deal with the plant EPC companies has not been successful because the participation of the plant EPC companies is very rare. It is difficult for the plant EPC companies to join the package deal due to the lack of the fully responsible organization to support the plant EPC companies participating in a package deal. The followings are suggested as the ways to promote the participation of the plant EPC companies for package deal in this study; 1) financial support of the government for plant EPC companies 2) political support of the government for plant EPC companies 3) specialization of the advanced countries for public-private cooperation.

• 만화애니메이션 연구
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• 통권45호
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• pp.283-298
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• 2016

기술과 품질의 차이가 하루가 다르게 좁혀지고 있는 현대의 자유시장경제하에서 제품의 차별화를 위한 마케팅 전략은 더욱더 격화되는 디자인 경쟁에 의해 좌우되고 있다. 그 중에서도 제품의 외형을 통해 소비자에게 시각적으로 닿게 되는 패키지디자인은 가격이나 기능에 앞서 브랜드이미지에 영향을 미치는 직접적 커뮤니케이션이다. 패키지디자인은 제품을 포장, 운반, 보관하고 적재하는 기본 기능만이 아니라 효과적인 비주얼 이미지로 소구력을 높여 브랜드이미지를 각인시키고 구매결정을 이끈다. 최근의 패키지디자인은 캐릭터를 적극 활용하고 있는데 단지 캐릭터의 이미지만을 사용하는 것이 아니라 캐릭터의 형태가 패키지의 물적 구조와 융합된 입체적인 디자인으로 2차적 재미와 효과를 주고 있다. 이렇게 캐릭터를 잘 활용한 패키지디자인은 그 자체로 강력한 마케팅 수단이자 가치 있는 디자인 자산이며, 캐릭터를 활용하는 방식에 따라 그 부가가치는 더욱 증대될 수 있다. 위트 있는 아이디어로 판매 뿐 아니라 브랜드이미지 향상에 기여하는 캐릭터패키지는 대기업 뿐 아니라 다양한 제품군에서 효과적으로 사용할 수 있는 마케팅수단이다. 특히 지역단위를 넘어선 판매와 홍보에 절실한 지자체별 관광상품에 잘 활용한다면 단지 구매동기만을 유발시킬 뿐 아니라 패키지 자체가 관광자원이 되는 일석이조의 효과를 누릴 수 있다. 본 연구는 그 실례로 전북 전주의 한 지역브랜드를 마케팅하는 수단으로써 캐릭터패키지를 제안하여, 자체캐릭터를 개발하고 이를 패키지의 입체적 형태로 디자인하는 캐릭터패키지를 기획, 제작하였다. 그리고 이런 일련의 과정을 통해, 기존 브랜드의 이미지를 재정립하거나 강화하기 위한 브랜드마케팅 전략으로서의 패키지디자인을 제시하고자 한다.

• Transactions on Electrical and Electronic Materials
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• 제18권2호
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• pp.59-61
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• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• International journal of advanced smart convergence
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• 제9권3호
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• pp.145-152
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• 2020

When conducting a health screening, it is important to select the most appropriate hospitals for the screening items. There are various packages in the screening hospitals, and the screening items and price are very different for each package. In this paper, we provide a method of recommending the screening packages in consideration of the customer's preferences such as screening items and minimum matching ratio. First, after collecting package information of hospitals, information such as basic items and optional items in the package are extracted. Then, we determine whether the client's screening items exist in the basic item or optional item of the package and calculate the matching rate of the package. Finally, we recommend screening packages with the lowest price while meeting the minimum matching rate suggested by the client. For performance analysis, we implement a prototype for recommending screening packages and provide the experimental results. The performance analysis shows that the proposed approach provides a real-time response time and recommends appropriate packages.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 한국전기전자재료학회논문지
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• 제18권6호
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• pp.506-509
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• 2005

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

• 천문학논총
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• 제30권2호
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• pp.675-677
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• 2015

A data simulator and reduction package for the Devasthal Optical Telescope Integral Field Spectrograph (DOTIFS) has been developed. Since data reduction for the Integral Field Spectrograph (IFS) requires complicated procedures due to the complex nature of the integral spectrograph, common reduction procedures are usually not directly applicable for such an instrument. Therefore, the development of an optimized package for the DOTIFS is required. The data simulator observes artificial object and simulates CCD images for the instrument considering various effects; e.g. atmosphere, sky background, transmission, spectrograph optics aberration, and detector noise. The data reduction package has been developed based on the outcomes from the DOTIFS data simulator. The reduction package includes the entire processes for the reduction; pre-processing, flat-fielding, and sky subtraction. It generates 3D data cubes as a final product, which users can use for science directly.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부A
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• pp.204-207
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• 1998

This paper presents a software development technique for EMS applications. The definite client-server configuration is proposed and EMS software package is developed. The developed EMS software package consists of AGC(Automatic Generation Control). Economic Dispatch. State Estimator. Contingency Analysis Simulator and Database Applications. In order to integrate each of the developed modules, EMS Network Server is developed. The proposed package is tested with a sample system. It is expected that the developed package can be easily applicable to the practical system.

• Communications for Statistical Applications and Methods
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• 제28권6호
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• pp.673-679
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• 2021

The moment calculation in a truncated multivariate normal distribution is a long-standing problem in statistical computation. Recently, Kan and Robotti (2017) developed an algorithm able to calculate all orders of moment under different types of truncation. This result was implemented in an R package MomTrunc by Galarza et al. (2021); however, it is difficult to use the package in practical statistical problems because the computational burden increases exponentially as the order of the moment or the dimension of the random vector increases. Meanwhile, Lee (2021) presented an efficient numerical method in both accuracy and computational burden using Gauss-Hermit quadrature. This article introduces trunmnt implementation of Lee's work as an R package. The Package is believed to be useful for moment calculations in most practical statistical problems.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.