• 무역상무연구
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• 제50권
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• pp.277-308
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• 2011

Korea's economy has shown recovery since the global financial crisis in 2008. In the year 2010, Korea's export volume reached US D 467.4 billion and Korea is one of the main producer of IT equipment, electronics, ship-buildings, chemicals and automobiles. In particular, IT industry is one of the largest portion in Korea's export industries. The reason of the performance is that we develop innovative products to overseas markets and continued it. Also, there has been export support or promotion scheme in Korea. In this study, We need to evaluate the current system of export support and derive future challenges. This article has been studied to investigate relationship between export promotion and export performance. So, We classify export promotion program into 7 group(IT package, Market pioneers, Overseas exhibition, consultation invited buyers, International IT market research, Small Business IT export counseling center, Overseas marketing online) and the export performance was considered as the dependent variable. So the result are as follows. Factors on IT package, Market pioneers, overseas exhibition, International IT market research have been identified as influencing. and consultation invited buyers, Small Business IT export counseling center and Overseas marketing online have been identified as unimportant factor. So, We have to develop those Factors(IT package, Market pioneers, overseas exhibition, International IT market research) in the direction of strengthening the development of export support scheme.

• 대한기계학회논문집
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• 제18권3호
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• pp.729-737
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• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• 농촌계획
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• 제18권4호
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• pp.141-152
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• 2012

Recently the package design for agricultural product of farm stay is great interests for increasing the income of farmers and villages as it may fulfill the sensible needs of consumers who experience rural culture and farm stay. This paper presents the status of the package design for agricultural product of farm stay and proposed improvements to the package design as following; 1)to diversify the packaging capacity, 2)to develop the cultural products to applicate the traditional crafts technique, 3)to provide institutional strategies for presenting the identity of farm or village, 4)to develop the education program about package design. We sampled fifty pilot farms or villages, analyse the package design of them and questionnaire surveyed farmers and managers in order to find problems and suggest improvements.

• 전자공학회논문지D
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• 제35D권4호
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• pp.61-70
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• 1998

The electrical performance of a package is extremely important for high speed digital system operations. CSP(chip scale package) is known to have better electrical performance than the convnetional packages. In this paper, the electrical performance of the BLP(bottom leaded plastic) package, a kind of CSP, has been alayzed by both simulation and real measurement. The electrical perfdormance of a BLP was compared with that of the conventioanl TSOP(thin small outline package). The leadinductanceand lead capacitance were used for the comparison purposes. The new BLP design provides much better electrical performance that TSOP package. It has about 40% favorable parameter values.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• 한국식품영양과학회지
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• 제15권1호
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• pp.39-44
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• 1986

Kacdugi fermented in the subatomospheric pressure(350mmHg) and polyethylene film package to improve the quality and to investigate the effect of fermentative control at $25^{\circ}C$. Brix degree, acidity, vitamin C content and number of total microbe and Lactobacilli was determined and also, the edible period of kacdugi was checked up by sensory assessment. The increasing rate of brix degree during kacdugi fermentation was high in the subatomospheric pressure, but decreased at the last period of fermentation as same tendency to the control, and it was preferably increased at the last period of fermentation in the polyethylene film package. However, the acidity was higher in the control than sbuatomospheric pressure but it was low in the polyethylene film package. Vitamin C content was high in the control at beginning and middle period of fermentation but high in sbuatomospheric pressure, and was low in the polyethylene film package at the last period of fermentation. The number of Lactobacilli was more in the subatomospheric pressure and polyethylene film package than the control, but it was suddenly incressed for the total microbe in the polyethylene film package at last period of fermentation. The edible periods of kacdugi by the sensory assessment of sour flavor, hardness and complex flavor was second days in the control. third days in the polyethylene film package, and fifth days in the subatomospheric pressure after soaking.

• 한국군사과학기술학회지
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• 제23권6호
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

• 대한전기학회논문지:전력기술부문A
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• 제53권2호
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• pp.111-120
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• 2004

This paper presents an application of Unified Modeling Language(UML) software technique for developing transmission pricing evaluation package. Also, this paper describes a transmission pricing algorithm applicable to a large-scale power system. The usage-based transmission pricing mechanism is very complex since it requires power flow analysis, fault current analysis, sensitivity evaluation of a transmission line, penalty factors calculation, transmission asset databases, and cost allocation rules, etc. For the efficient and flexible development of the transmission pricing package, a UML. approach is applied, which is composed of a use-case diagram, interaction diagram, class diagram, and package diagram using Rational Rose Unified Process(RUP). The designed transmission pricing package can be efficiently modified and reused as the market environments evolves since it is designed by Object-Oriented Programming(OOP).

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.151-154
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• 1999

In this paper, we showed parasitic effects in the millimeter wave package, and proposed a suppression method of parasitic effects using Si lossy layer. From CB-CPW used as a transmission line of the MIMIC package, PPL mode is generated and this causes the parasitic effects considered from this paper. Parasitic effects caused by PPL mode such as resonance, radiation, and crosstalk in the single and multi-chip package ran affect to the performance of MIMIC seriously. To suppress these parasitic effects, we adapted Si lossy layer $\rho$ . The PPL mode can be suppressed by the lossy layer, and it eliminates the parasitic effects. It is expected that showed results ran be used as luxurious data for design MIMICs and various types of millimeter wave applications.

• Asian-Australasian Journal of Animal Sciences
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• 제16권11호
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• pp.1695-1700
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• 2003

A total of 30 pork loin sections were utilized to evaluate the effects of FIR ceramic sheet in PE and vacuum package on preserving the quality of chilled pork stored at 4 and $0^{\circ}C$. Based on meat color, results indicated that pork loin packaged in ceramic sheet and control treatment showed that the samples of the control treatment tended to darken gradually in comparison with the samples at 0 day, but FIR treatment had few changes. Among the total plate counts of sliced loin in PE and loin in vacuum package under different storage times at 4 and $0^{\circ}C$, results showed that FIR ceramic sheet package treatment had lower total plate counts and significant differences (p<0.05). In VBN value, both treatments tended to rise high with the increasing of storage time, but the FIR treatment was significantly lower (p<0.05) than the control treatment. Its results had a corresponding relationship with the total plate counts. Regarding the drip loss of sliced loin in PE and loin in vacuum package, it showed that FIR ceramic sheet package treatment had lower drip loss and significant differences (p<0.01). These results showed that the use of FIR ceramic sheet package, including PE and vacuum package, is an effective method of maintaining the quality of meat.