• 제목/요약/키워드: IT Package

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A Study on the Influence of Package Design of Female Cosmetics on Purchasing Preference (여성 화장품 용기디자인이 구매성향에 미치는 영향에 관한 연구)

  • Lee Jae-Ha;Kim Je-Jun
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.27 no.3
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    • pp.52-58
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    • 2004
  • This study investigated the influence of package design of female cosmetics on the purchasing preferences of view The subjects of this study were the consumers of female cosmetics from their twenties to the forties, and were 195 consumers who dropped into beauty counters to buy their cosmetics. With this study, it can be said that package design Is an effective factor on purchasing of female cosmetics. In general, most consumers prefer to practical and useful package design. But the younger consumers tend to be more influenced by luxury and expensive package design than an elderly consumers on purchasing cosmetics. And it made a little difference in purchasing preferences by academic background.

Thermal Performance Analysis for Cu Block and Dense Via-cluster Design of Organic Substrate in Package-On-Package

  • Lim, HoJeong;Jung, GyuIk;Kim, JiHyun;Fuentes, Ruben
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.91-95
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    • 2017
  • Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler (열전 냉각기를 포함하는 볼로미터 패키지의 SPICE 등가 모델링)

  • Han, Chang Suk;Park, Seung Man;Kim, Nam-Hwan;Han, Seungoh
    • Journal of Sensor Science and Technology
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    • v.22 no.1
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    • pp.44-48
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    • 2013
  • For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

A Study on the Satisfaction of Visual Elements of Package Design for Carbonated Beverage Based on Emotional Experience Theory (감성경험 이론에 기반한 탄산음료 패키지 디자인 시각요소의 만족도에 관한 연구)

  • Zhang, Shang-Shang;Jang, Chung-Gun
    • Journal of the Korea Convergence Society
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    • v.13 no.4
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    • pp.271-278
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    • 2022
  • Carbonated drinks are a kind of drink that is popular in our daily lives and are sold mainly among young people. There are many brands of carbonated drinks currently on sale, and most of them emphasize the distinction of texture, and brand images and packages have further commercialized package design as a whole. It is necessary to increase the emotional experience of soda package design, which can increase the added value of the brand. Sensibility is the most common psychological experience in humans and is the subjective experience and feeling of things. By combining the emotional experience with the package design of carbonated drinks, it provides more emotional user experience while purchasing carbonated drinks, realizing diversification of product package designs and satisfying consumers' emotional needs. This paper first examines the package design of carbonated drinks, I hope it will be an implication if you increase the emotional experience of soda package design.

A New CMOS IC Package Design Methodology Based on the Analysis of Switching Characteristics (CMOS IC 패키지의 스위치 특성 해석 및 최적설계)

  • 박영준;어영선
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.1141-1144
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    • 1998
  • A new design methodology for the shortchannel CMOS IC-package is presented. It is developed by representing the package inductance with an effective lumpedinductance. The worst case maximum-simultaneous-switching noise (SSN) and gate propagation delay due to the package are modeled in terms of driver geometry, the maximum number of simultaneous switching drivers, and the effective inductance. The SSN variations according to load capacitances are investigated with this model. The package design techniques based on the proposed guidelines are verified by performing HSPICE simulations with the $0.35\mu\textrm{m}$ CMOS model parameters.

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Estimate on related to Chip Set and the other Various Parameter in Electronic Plastic Package (반도체 패키지의 칩셋과 다른 설계변수와의 연관성 평가)

  • Kwon, Yong-Su
    • Journal of the Korean Society of Industry Convergence
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    • v.2 no.2
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    • pp.131-137
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    • 1999
  • Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

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Measuring the Factor Influencing Tourist Preferences for Leaf Mustard Kimchi (관광객의 갓김치에 대한 선호도에 미치는 영향요인 평가)

  • Jeong, Hang-Jin;Kang, Jong-Heon
    • Journal of the Korean Society of Food Culture
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    • v.21 no.4
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    • pp.414-419
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    • 2006
  • The purpose of this study was to measure the factor influencing tourist preferences for leaf mustard iimchi. Among 250 questionnaires, 230 questionnaires were utilized for the analysis. Frequencies, conjoint model, max. utility model, BTL model, Logit model, K-means cluster analysis, and one-way ANOVA analysis were used for this study. The findings from this study were as follows. First, the Pearson's R and Kendall's tau statistics showed that the model fitted the data well. Second, it was found that total respondents and three clusters regarded taste and price as the very important factor. Third, it was found that the first cluster most preferred product with light red color, plain package, and mild taste sold at a cheap price in factory. The second cluster most preferred product with light red color, plain package, and moderately pungent taste sold at a expensive price in factory. The third cluster most preferred product with dark red color, shaped package, and highly pungent taste sold at a cheap price in factory. Fourth, it was found that the first cluster most preferred simulation product with light red color, shaped package, and mild taste sold at a cheap price in factory. The second cluster most preferred simulation product with light red color, shaped package, and moderately pungent taste sold at a cheap price in factory. The third clutter most preferred simulation product with dark red color, shaped package, and highly pungent taste sold at a cheap price in factory.

The Process of PBL Package Development (PBL 패캐지(Learning Package) 개발절차 모형에 관한 연구)

  • Lee, Woo-Sook;Park, Mee-Young
    • The Journal of Korean Academic Society of Nursing Education
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    • v.7 no.1
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    • pp.126-142
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    • 2001
  • Although a call for the implementation of PBL in nursing education is getting increased, it has not been actively implemented as it could be. The main reason for this situation seems to be the lack of well designed learning packages. Well designed PBL packages can be the core factor for the successful implementation of PBL. However, this seems to be the hardest task for teachers wanting to implement PBL. Therefore, the purpose of this study is to develop a systematic framework of PBL package development process and provide the examples of its application. This framework of the process of PBL package development includes thirteen steps. First of all, the team needs to decide a topic to be explored in the package and then clusters concepts related to the topic. Second, the team selects a real situation and writes it as a story. Third, knowledge, skills, and attitudes that practitioners need to know to deal with the situation will be explored. Fourth, learning objectives will be written. The next, the team will check if the situation includes multidisciplinary concepts and content. Sixth, the story will be divided into several parts. Seventh, part 1 will be written. Eighth, clinical documents related to part 1 need to be prepared. Ninth, the team will write a suggested approach for students. Then, they need to prepare a tutor's guide for part 1. Eleventh, the team will prepare a list of reading materials and plan for lectures and clinical laboratory sessions. Twelfth, they will write part 2 ~ part N following the steps from the seventh to the eleventh. The last step is evaluating the package and amending it as needed. These thirteen steps are very detailed and easy to follow for beginners. It is expected that this framework will contribute to accelerate the implementation of PBL in nursing education.

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Comparison Analysis on Package Design Elements of Low-Price Cosmetic Contents in Korea and China (한·중 저가 화장품 콘텐츠의 패키지 디자인요소 비교 분석)

  • Wang, Xlaohui;Park, Youngsim;Kim, Cheeyong;Lee, Changkeun
    • Journal of Korea Multimedia Society
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    • v.19 no.8
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    • pp.1553-1563
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    • 2016
  • Thesedays, not only a quality of a product but also a design of it plays an important role. Throughout this analysis, I would like to discuss how a design of package works in the cosmetics with the fact that low cost cosmetics sales better than high cost cosmetics. In this research, there are five samples each for Korean and Chinese low-costed cosmetics to yield a result about an element of package design. Based on that result, there was an survey about two different package design followed by the research problems. Throughout research, an attention and familiarity of package which was considered of characteristics of China was more effective on Chinese consumers. In order to activate the content market of cosmetics, it is utilized to manufacture taking into account the maximum of the design elements in the package design is a conclusion that affect the time of purchase. In this paper, one in which I hope to help in the development of being utilized as a basis article content market industry for pre-market research foray into the Chinese market is South Korean cosmetics.

Optimal Design for Cushioning Package of a Heavy Electronic Product using Mechanical Drop Analysis (낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계)

  • 금대현;김원진;김성대;박상후
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2003.11a
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    • pp.677-683
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    • 2003
  • Generally, heavy electronic products undergo many different types of shocks in transporting from a manufacturer to customers. Cushioning package materials are used to protect electronic products from severe shock environments. Since the mass distributions of heavy electronic products are usually unbalanced and complex, it is very difficult to design a cushioning package with haying high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning material for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning material for a large-sized refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study, the optimal shape of cushioning material, which has high cushioning performance and minimized volume, was obtained from the drop analysis and a optimization process. From free drop tests of a refrigerator, it was identified that the cushioning performance of the optimal package were improved up to 16 % and the volume of it was reduced in a range of 22 %.

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