• 대한설비공학회지:설비저널
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• 제19권2호
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• pp.67-81
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• 1990

The objective of this is to develop a practical software package to calculate annual energy consumption of HVAC (Heating Ventilating, and Air Conditioning) System in a building. It can quickly estimate loads and energy consumption, and have a function of economic analysis through the estimation of operating cost. Techniques of save energy consumption used in a building are necessary from the stage of design process to operation. The single most significant task is on HVAC Systems. Their installation costs, and related operating costs have enormous influence upon initial and maintenance costs. HVAC designers and engineers now have a wide variety of software choices available, but only a few of them have been developed in this country and no source program has been disclosed. Neither load culculation nor estimation of energy consumption is systematically made by the domestic HVAC design firms. Even though computer improved over the years with a trend of large scale load calculation and system selection through simulaion, the utilization of software nowadays does not make good progress due to lack of working environment. Therefore, it is necessary to develop a practical software package with which load calculation can be made with ease and kind manner. This study concerns the development of a software package which makes it possible to design HVAC system and save energy consumption in operation. The algorithm used in this program is a Modified Bin Method widely known as a simplified energy analysis means.

• Communications for Statistical Applications and Methods
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• 제31권2호
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• pp.179-189
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• 2024

In multivariate regression with a high-dimensional response Y ∈ ℝ^r and a relatively low-dimensional predictor X ∈ ℝ^p (where r ≥ 2), the statistical analysis of such data presents significant challenges due to the exponential increase in the number of parameters as the dimension of the response grows. Most existing dimension reduction techniques primarily focus on reducing the dimension of the predictors (X), not the dimension of the response variable (Y). Yoo and Cook (2008) introduced a response dimension reduction method that preserves information about the conditional mean E(Y | X). Building upon this foundational work, Yoo (2018) proposed two semi-parametric methods, principal response reduction (PRR) and principal fitted response reduction (PFRR), then expanded these methods to unstructured principal fitted response reduction (UPFRR) (Yoo, 2019). This paper reviews these four response dimension reduction methodologies mentioned above. In addition, it introduces the implementation of the mbrdr package in R. The mbrdr is a unique tool in the R community, as it is specifically designed for response dimension reduction, setting it apart from existing dimension reduction packages that focus solely on predictors.

• 정보처리학회논문지B
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• 제9B권2호
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• pp.245-254
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• 2002

머신비전을 이용한 IC 패키지 마킹검사 시스템은 입력영상으로부터 검사할 요소들의 위치를 식별하고, 추출된 요소들을 학습된 표준 패턴과 비교하여 마킹의 불량 여부를 판단한다. 본 논문에서는 검사 대상 IC 패키지의 위치 판별, 마킹문자 추출, 핀원딤플 검출과 같은 일련의 작업들에 적합한 적응적 다단계 이진화 방법과 마킹문자의 국소적인 오류검출은 물론 잡영에 강건한 정합단위의 동적 선택 방법을 제안한다. 제안하는 이진화 방법은 이진화 대상 영역과 명도 값의 범위를 제한하여 Otsu의 이진화 알고리즘을 적용함으로써 특정 응용에 적응적인 이진화가 가능하다. 정합단위의 동적 선택 방법은 문자추출 및 배치분석에 대한 결과에 따라 정합단위를 선택한다. 그러므로 문자추출 및 배치분석 과정에서 발생하는 예기치 못한 부적절한 상황에서도 가능한 범위내에서 최소의 정합단위를 선택할 수 있다. 제안된 방법을 구현하여 8종의 IC 패키지, 총 280개의 영상에 대하여 실험한 결과, IC 패키지와 핀원딤플의 검출율은 100%였으며, 마킹상태에 대한 판정은 98.8%의 정확도를 나타내어 제안된 방법이 효과적임을 확인할 수 있었다.

• 센서학회지
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• 제16권5호
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• Journal of Welding and Joining
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• 제17권1호
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• 한국의상디자인학회지
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• 제13권4호
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• pp.153-165
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• 2011

The purpose of this study is to take into consideration the package products of wedding miniature dress. The method of the research was mainly focused on precedent research data and general references. Furthermore the data on wedding dresses was mainly collected from internet sites. Ai; reflection customer's demands, more personal and distinctive design was planned reflecting trend in the sector of wedding dress. The results of the research is the following. First, the first consideration for designing product in wedding miniature was designed with the focus on what consumers are easy to make and on brilliance when having made. 8 pairs for barbie miniature and 2 pairs for ball joints were designed. Among these things, it designed colorfully with 6 pairs for wedding dress and 4 pairs for shooting, which are used in the right size. Second, as a result of seeing consumers' response by up-loading totally 10 pieces of miniature clothes on wedding miniature. com site, and were the most popular products. The aim is to suggest package product based on these two works. The design-based pattern, the fabric of being used, lace material, beads, and several trimmings are offered to 2 wedding miniature package products. Consumers can make own collection with a handicraft-based feeling by using this.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.1209-1214
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• 2009

Various automatic temperature control systems have been used widely in Korea for the conservation of heating energy and the enhancement of thermal comfort in residential buildings. But the heating control performance for automatic temperature control systems extensively vary with the design and operational conditions of the heating system, the climate condition and others. It was introduced in this study a numerical calculation program package to analyze heating control characteristics of the automatic temperature control system. This package is able to analyze the room air temperature, return water temperature, supplied heating flux and flow rate, and so on. One the other hand, the simulation results were verified by comparing with the field test results.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.153-154
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• 2008

This paper presents a window-based software package for the education and training for the reduction of power system by using locational marginal price (LMP), clustering, and similarity indices of each bus. The developed package consists of three modules: 1) the LMP module, 2) the Clustering module and 3) the Reduction module. Each module has a separated and interactive interface window. First of all, LMPs are created in the LMP module, and then the Clustering module carries out clustering based on the results of the LMP module. Finally, groups created in this Clustering module are reduced by using the similarity indices of each bus. The developed package displays a variety of tables for results of the LMPs of base network, voltages, phases and power flow of reduced network so that the user can easily understand the reduction of network. To demonstrate the performance of the developed package, it is tested for the IEEE 39-bus power system.

• 유통과학연구
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• 제12권12호
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• pp.27-41
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• 2014

Purpose - This study examines various reservation service components that would increase customers' brand attachment and loyalty, while discussing how reservation service components would affect the customer behaviors. Research design, data, and methodology - This study theoretically analyzed the hotel package product reservation system, the customer expectations, the brand attachment, and the brand loyalty, while reviewing previous studies. Results - This study analyzed the distribution channels of the hotel package products from various angles and, as for more extensive research, the study explained the different results caused by each different reservation system type that may be preferred by each individual customer. Conclusions - It was confirmed that, of the hotel reservation service components, the convenience factors, the reliability factors, the information factors, and the other factors other than the human factors, have a significant influence on the customer expectations. Further, the study also revealed that the customer expectation has an important effect on the brand attachment. In addition, the study improved the prevailing understanding on the relation between the brand attachment and the brand loyalty.