• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1565-1568
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• 2003

The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.

• 한국전기전자재료학회논문지
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• 제20권5호
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• pp.415-420
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• 2007

Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• 대한의용생체공학회:학술대회논문집
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• 대한의용생체공학회 1993년도 춘계학술대회
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• pp.66-69
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• 1993

We have developed a software package for the analysis of electric field distribution in human body. It includes the graphical finite element mesh generator, linear system of equations solver using sparse matrix and vector technique, and post-processor for the display of the results. This software package can be used in various research areas of biomedical engineering where we inject current or apply voltage to human body. The software package was developed on Macintosh II computer and the size of the model is only limited by the main memory.

• 한국식품저장유통학회지
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• 제5권2호
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• pp.144-149
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• 1998

The purpose of this study was to reveal consumer attitudes about package colors of Korean traditional floods. The housewives preferred pale purple blue for soy sediment, red purple for soy soup, yellow for vinegar, red for power sediment. For the background color of each package, consumers tended to like similar color with color of the content, but did not show any bias for the lesser color of it. The statistically significant correlations between populational difference and package colors were not found.

• 한국산학기술학회논문지
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• 제7권6호
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• pp.1134-1141
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• 2006

자바는 실행 플랫폼에 독립적이고 모바일 분야(J2ME)로부터 엔터프라이즈 환경(J2EE)에 이르는 다양하고도 일관된 솔루션을 제공하여 이기종 분산 애플리케이션 환경을 위해 적합한 개발 도구로 평가받고 있다. 본 연구에서는 자바 애플리케이션을 개발할 때 필요로 하는 접근제어 모듈을 자바 패키지 형태로 구현하여 제공함으로써 애플리케이션의 개발 기간을 단축시키고 시스템 관리자들이 보다 편리하게 접근제어 관리를 할 수 있도록 하였다. 구현된 모듈은 역할기반 접근제어(RBAC) 모델을 기초로 하고 자바 패키지 및 접근제어 관리도구를 포함한다.

• 대한기계학회논문집A
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• 제28권10호
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• pp.1590-1597
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• 2004

Three methods of design sensitivity analysis for structures such as numerical method, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis can provide very exact result, it is difficult to implement into practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable fur most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate in nonlinear design sensitivity analysis because its computational cost depends on the number of design variables and large numerical errors can be included. Thus the semi-analytical method is more suitable for complicated design problems. Moreover, semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure fur the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and the computational technique is proposed for evaluating the partial differentiation of internal nodal force, so called pseudo-load. Numerical examples coupled with commercial finite element package are shown to verify usefulness of proposed semi-analytical sensitivity analysis procedure and computational technique for pseudo-load.

• 천문학회보
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• 제43권1호
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• pp.67.3-68
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• 2018

We plan to automatize the operation of Kyung Hee Astronomical Observatory (KHAO) 76 cm Telescope by adapting KAOS30 (KHU Automatic Observing Software for McDonald 30 inch Telescope). The software is developed to improve the efficiency of the observation system for monitoring transients and variable sources. It has installed and operated at McDonald 30 inch telescope since 2017 August. KAOS76 (KHU Automatic Observing Software for KHAO 76 cm Telescope) consists of four packages: Telescope Control Package (TCP), Data Acquisition Package (DAP), Auto Focus Package (AFP), and Script Mode Package (SMP). Most of the packages can be configured by minimized modifications of the codes because it includes common libraries for FLI instruments and also ASCOM standard. TCP, DAP, and AFP control astronomical devices. SMP supports automatic observing in a script mode. TCP of KAOS76 can communicate with the TCS via ASCOM. Also, KAOS76 has an extra function to compensate the misalignment of the polar axis. In this poster, we show the current status of the observing system with KAOS76.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.15-22
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• 2019

In these days, importance of the power electronic devices and modules keeps increasing due to electric vehicles and energy saving requirements. However, current silicon-based power devices showed several limitations. Therefore, wide band gap (WBG) semiconductors such as SiC, GaN, and $Ga_2O_3$ have been developed to replace the silicon power devices. WBG devices show superior performances in terms of device operation in harsh environments such as higher temperatures, voltages and switching speed than silicon-based technology. In power devices, the reliability of the devices and module package is the critically important to guarantee the normal operation and lifetime of the devices. In this paper, we reviewed the recent trends of the power devices based on WBG semiconductors as well as expected future technology. We also presented an overview of the recent package module and fabrication technologies such as direct bonded copper and active metal brazing technology. In addition, the recent heat management technologies of the power modules, which should be improved due to the increased power density in high temperature environments, are described.

• 한국항공운항학회지
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• 제29권3호
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• pp.44-51
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• 2021

PIP is an abbreviation of 'Performance Improvement Package', which is a package that can improve performance by applying some design changes to existing aircraft. Boeing provides PIP applicable to B777-200, and Airbus provides PIP applicable to A350-900 as standard. PIP provided by Boeing and Airbus is a separate task, but it is expected to reduce fuel consumption by reducing drag through aerodynamic improvements. The PIP applied to the A350-900 includes work such as increasing Winglet Height and re-twisting Outboard Wing. This study is to verify the effect of PIP application of the A350-900 aircraft and use it as basic data for economic analysis. The aerodynamic improvement studies and expected effects of the PIP application were examined, and the actual flight data of the PIP-applied and the non-applied aircraft were compared to confirm the PIP application effect. This paper provides empirical results for the aviation industry on the PIP application efficiency as a method of improving fuel efficiency and reducing carbon emission.