• Title/Summary/Keyword: ICP magnetron sputtering

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Deposition of IGZO thin film using DC and ICP at magnetron sputtering system

  • Lee, C.H.;Kim, K.N.;Kim, T.H.;Lee, S.M.;Bae, J.W.;Yeom, G.Y.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.05a
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    • pp.95-95
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    • 2015
  • IGZO (Indium Gallium Zinc Oxide) 물질은 기존에 사용되던 Amorphous Silicon에 비해 전자 이동도가 더욱 빠르기 때문에 차세대 디스플레이 재료로서 각광받고 있으며, 이러한 빠른 전자 이동도는 디스플레이 소자에 있어서 매우 중요한 요소 중 하나이다. 이를 향상시키기 위하여 본 연구에서는 ICP(inductively coupled plasma) antenna를 이용하여 rf power와 requency를 변화함으로써 박막 증착 시 발생되는 플라즈마의 특성을 조절하여, 박막의 특성을 조절하고자 했다. 이렇게 증착된 IGZO 박막은 Hall Effect Measurement를 이용하여 전기적 특성을 분석하였으며, XPS(x-ray photoelectron spectroscopy)를 이용하여 박막의 조성을 분석하였다.

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The effect of hydrogen on microstructure of nc-Si:H thin films deposited by ICP-assisted magnetron sputtering (유도결합 플라즈마가 결합된 마그네트론 스퍼터링에 의해 합성된 미세결정질 실리콘 박막의 미세구조에 미치는 수소의 영향)

  • Sin, Gyeong-Sik;Choe, In-Sik;Choe, Yun-Seok;Han, Jeon-Geon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.351-352
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    • 2012
  • 유도결합 플라즈마(ICP)가 결합된 마그네트론 스퍼터링법으로 수소와 알곤의 혼합비율에 따라 기판 가열 없이 유리기판 위에 실리콘 박막을 증착하였다. 수소 유량에 따른 실리콘 박막의 미세구조 변화는 XRD, Raman spectroscopy, FT-IR 등의 분석을 통해 확인하였다. 수소 유량이 증가할수록 박막의 증착률은 감소하였으며, 수소 혼합비율이 60% 이상일 때 비정질 실리콘이 미세결정질 실리콘으로 전이되는 것을 확인하였다.

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Relationship between inductively coupled plasma and crystal structure, mechanical and electrical properties of MoN coatings (유도결합 플라즈마 파워에 따른 MoN 코팅막의 결정구조 및 기계·전기적 특성 변화)

  • Jang, Hoon;Chun, Sung-Yong
    • Journal of Surface Science and Engineering
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    • v.55 no.2
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    • pp.77-83
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    • 2022
  • Nanocrystalline MoN coatings were prepared by inductively coupled plasma magnetron sputtering (ICPMS) changing the plasma power from 0 W to 200 W. The properties of the coatings were analyzed by x-ray diffraction, field emission scanning electron microscopy, atomic force microscopy, nanoindentation tester and semiconductor characterization system. As the ICP power increases, the crystal structure of the MoN coatings changed from a mixed phase of γ-Mo2N and α-Mo to a single phase γ-Mo2N. MoN coatings deposited by ICPMS at 200 W showed the most compact microstructure with the highest nanoindentation hardness of 27.1 GPa. The electrical resistivity of the coatings decreased from 691.6 μΩ cm to 325.9 μΩ cm as the ICP power increased.

Structural properties and field-emission characteristics of CNTs grown on Ni and Invar catalysts employing an ICP-CVD method (ICP-CVD 방법을 이용하여 Ni 및 Invar 촉매 위에 성장시킨 탄소나노튜브의 구조적 물성 및 전계방출 특성)

  • Hong, Seong-Tae;Kim, Jong-Pil;Park, Chang-Kyun;Uhm, Hyun-Seok;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.1597-1599
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    • 2004
  • Carbon nanotubes (CNTs) are grown on the TiN-coated silicon substrate by varying the thickness of Ni and Invar426 catalyst layers at 600$^{\circ}C$ using an inductively coupled plasma-chemical vapor deposition (ICP-CVD). The Ni and Invar426 catalysts are formed using an RF magnetron sputtering system with various deposition periods. Characterization using various techniques, such as FESEM, HRTEM, and Raman spectroscopy, shows that the physical dimension as well as the crystal quality of grown CNTs are strongly changed by the kind and thickness of catalyst materials. It is also seen that Ni catalysts would be more desirable for vertical-alignment of CNTs compared with Invar426 catalysts. However, the CNTs using Invar426 catalysts display much better electron emission capabilities than those using Ni catalysts. The physical reason for all the measured data obtained are discussed to establish the relationship between structural properties and field-emissive properties of CNTs.

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Effects of catalyst pretreatment on structural and field emissive properties of carbon nanotubes synthesized by ICP-CVD method (ICP-CVD 방법으로 합성된 탄소 나노튜브의 구조적 물성 및 전계방출 특성에 촉매의 전처리 공정이 미치는 영향)

  • Hong, Seong-Tae;Park, Chang-Kyun;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2005.07c
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    • pp.1862-1864
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    • 2005
  • Carbon nanotubes [CNTs] are grown on TiN-coated Si substrates at $700^{\circ}C$ by inductively coupled plasma-chemical vapor deposition (ICP-CVD). Pre-treatment of Ni catalysts has been performed using an RF magnetron sputtering system. Structural properties and field-emission characteristics of the CNTs grown are analyzed in terms of the RF power applied and the treatment time used in the pre-treatment process. The characterization using various techniques, such as FE-SEM, AFM, and Raman spectroscopy, show that the physical dimension as well as the crystal quality of CNTs are changed by pre-treatment of Ni catalysts. It is also seen that Ni catalysts with proper grain size and uniform surface roughness may produce much better electron emission. The physical reason for all the measured data obtained are discussed to establish the relationship between the structural property and the electron emission characteristic of CNTs.

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Hard TiN Coating by Magnetron-ICP P $I^3$D

  • Nikiforov, S.A.;Kim, G.H.;Rim, G.H.;Urm, K.W.;Lee, S.H.
    • Journal of Surface Science and Engineering
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    • v.34 no.5
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    • pp.414-420
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    • 2001
  • A 30-kV plasma immersion ion implantation setup (P $I^3$) has been equipped with a self-developed 6'-magnetron to perform hard coatings with enhanced adhesion by P $I^3$D(P $I^3$ assisted deposition) process. Using ICP source with immersed Ti antenna and reactive magnetron sputtering of Ti target in $N_2$/Ar ambient gas mixture, the TiN films were prepared on Si substrates at different pulse bias and ion-to-atom arrival ratio ( $J_{i}$ $J_{Me}$ ). Prior to TiN film formation the nitrogen implantation was performed followed by deposition of Ti buffer layer under A $r^{+}$ irradiation. Films grown at $J_{i}$ $J_{Me}$ =0.003 and $V_{pulse}$=-20kV showed columnar grain morphology and (200) preferred orientation while those prepared at $J_{i}$ $J_{Me}$ =0.08 and $V_{pulse}$=-5 kV had dense and eqiaxed structure with (111) and (220) main peaks. X-ray diffraction patterns revealed some amount of $Ti_{x}$ $N_{y}$ in the films. The maximum microhardness of $H_{v}$ =35 GN/ $M^2$ was at the pulse bias of -5 kV. The P $I^3$D technique was applied to enhance wear properties of commercial tools of HSS (SKH51) and WC-Co alloy (P30). The specimens were 25-kV PII nitrogen implanted to the dose 4.10$^{17}$ c $m^{-2}$ and then coated with 4-$\mu\textrm{m}$ TiN film on $Ti_{x}$ $N_{y}$ buffer layer. Wear resistance was compared by measuring weight loss under sliding test (6-mm $Al_2$ $O_3$ counter ball, 500-gf applied load). After 30000 cycles at 500 rpm the untreated P30 specimen lost 3.10$^{-4}$ g, and HSS specimens lost 9.10$^{-4}$ g after 40000 cycles while quite zero losses were demonstrated by TiN coated specimens.s.

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Effects of ICP Power on the Properties of TiCrN Films (유도결합플라즈마의 전력이 TiCrN 코팅층에 미치는 영향)

  • Cha, B.C.;Kim, J.H.;Lee, B.S.;Kim, S.K.;Kim, D.W.;Kim, D.;You, Y.Z.
    • Journal of the Korean Society for Heat Treatment
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    • v.22 no.5
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    • pp.307-311
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    • 2009
  • In this study, TiCrN films were deposited on STS 316 Land Si (100) wafer by inductively coupled plasma (ICP) assisted D.C. magnetron sputtering. The effect R.F. power for ICP discharge on the mechanical properties of TiCrN films was investigated. XRD, XPS and FE-SEM were used for the structure analysis. Also the Micro-Knoop hardness tester and profilometer were used for measuring hardness of coatings and film stress respectively. As increasing the R.F. power for ICP discharge, thickness of coating was decreased from 1633 nm to 1288 nm but hardness was increased about $Hk_{5g}$ 4200 at 400 W. All of the XRD patterns showed (111), (200) and (220) peaks of TiCrN films. Surface morphology was studied using the profilometer. FE-SEM was used to know morphology and cross-section of the films. Structure of the films was changed dense as increased ICP power.

Control of Copper Thin Film Characteristics by using Pulsed DC Power Magnetron Sputter System (Pulsed DC Power Magnetron Sputter System을 사용한 Copper 박막 특성 조절)

  • Kim, Do-Han;Lee, Su-Jeong;Kim, Tae-Hyeong;Lee, Won-O;Yeom, Won-Gyun;Kim, Gyeong-Nam;Yeom, Geun-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.107-107
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    • 2017
  • 전자제품의 성능이 향상됨에 따라서 전자제품에 사용되는 부품의 고집적화가 필연적으로 요구되고 있으며, 고집적화 된 전자제품의 방열(heat dissipation)에 관한 문제점이 대두되고 있다. 방열은 전자기기의 성능과 수명을 유지하는데 있어서 중요한 문제 중 하나로서 방열 효과를 높이기 위해 다양한 연구 개발이 진행 중이다. 방열에 사용되는 소재로는 Cu가 있으며, 저렴한 가격과 상대적으로 높은 방열 효율을 가지는 장점이 있다. Cu는 전기 도금 증착 방법을 사용하여왔으나, 전기도금 방식으로 증착된 Cu 방열판은 제품에 열이 축적될 경우 Cu와 substrate 사이의 residual stress로 인해 박리나 뒤틀림 현상 등이 발생하여 high power를 사용하는 device의 방열 소재로 사용하기에는 개선해야 할 문제점이 있다. 이러한 문제점을 극복하기 위한 방법으로 magnetron sputter 증착 방법이 있으며, magnetron sputter은 대면적화가 용이하고, 다양한 물질의 증착이 가능한 장점으로 인해 hard coating 또는 thin film 증착과 같은 공정에 사용되고 있다. 특히 증착된 film의 특성을 조절하기 위해서 magnetron sputter에 pulse 또는 ICP (inductively coupled plasma) assisted 등을 적용하여 plasma 특성을 조절하는 방법 등에 관한 연구가 보고되고 있다. 본 연구에서는 pulsed magnetron sputtering 방식을 이용하여 증착된 Cu film 특성 변화를 확인하였다. 다양한 pulsing frequency와 pulsing duty ratio 조건에서, Si substrate 위에 증착된 Cu film과의 residual stress 변화를 측정하였다. Pulse duty ratio가 90% 에서 60%로 감소함에 따라서 Cu film의 residual stress가 감소하였고, pulsing frequency가 증가함에 따라 Cu film의 residual stress가 감소하는 것을 확인하였다. 증착 조건에 따른 plasma의 특성 분석을 위하여 oscilloscope를 이용하여 voltage와 current를 측정하였고, Plasma Sampling Mass spectrometer 를 이용하여 ion energy의 변화를 측정하였다. 이를 통해 plasma 특성 변화가 증착된 Cu film에 미치는 영향과 residual stress의 변화에 대한 연관성에 대하여 확인할 수 있었다.

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Influence of Inductive Coupled Plasma Treatment and SnO2 Deposition on the Properties of Polycarbonate (유도결합플라즈마 표면 처리 및 SnO2 증착에 따른 폴리카보네이트 특성 연구)

  • Eom, Tae-Young;Choi, Dong-Hyuk;Son, Dong-Il;Eom, Tae-Yong;Kim, Daeil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.3
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    • pp.156-159
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    • 2018
  • Inductively coupled plasma (ICP) treatment with argon and a mixture of argon and oxygen gases has been used to modify the surface of polycarbonate (PC) substrates. The results showed that the surface contact angle was inversely proportional to the plasma discharge power and that the mixed-gas plasma (gas flow 10:10 sccm, discharge power 60 W) decreased the surface contact angle as low as $18.3^{\circ}$, indicating a large increase in the surface hydrophilicity. In addition, $SnO_2$ thin films deposited on the PC substrate effectively enhanced the ICP plasma treatment, and could also enhance the usefulness of PC in the inner parts of automobiles.

The influence of post-treatment using hydrogen ion bombardment on microstructures and field-emission properties of carbon nanotubes (수소 이온 충돌을 이용한 후처리가 탄소 나노튜브의 구조적 물성 및 전계방출 특성에 미치는 영향)

  • Yun, Sung-Jun;Park, Chang-Kyun;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1444-1445
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    • 2006
  • Carbon nanotubes (CNTs) are grown on TiN-Coated silicon substrates at $700^{\circ}C$ using an ICP-CVD method. Ni catalysts for CNT growth are formed using an RF magnetron sputtering system. Post-treatment using hydrogen ions has been performed in the ICP reactor by varying the treatment period. The characterization using various techniques, such as FESEM, HRTEM, and Raman spectroscopy, show that the physical dimension as well as the crystal quality of CNTs are changed by the post-treatment process. It is also seen that the hydrogen ion-bombardment may change the surface structure of CNTs, which may lead to produce better electron emission properties. The physical reason for all the measured data obtained are discussed to establish the relationship between the structural property and the electron emission characteristic of CNTs.

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