• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.419-421
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• 1996

We propose the digitized pressure sensor and the interface circuit to read directly the pressure signal in the digital form. The interface circuit has the control clock, comparator, and bit value decision circuit. The digitized sensor and interface circuit are integrated on the one chip using the post processing after IC fabrication. The dimension of the fabricated digitized pressure sensor is $3{\times}6{\times}1mm^3$.

• 연구논문집
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• s.22
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• pp.85-96
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• 1992

A mass flow controller(MFC) is commonly used in the semiconductor industries to control the flow rate of various process gases. The measurement and precise control of the of flow rate the gas are the key for a succesful IC fabrication. To eventually design a reliable MFC, a pre-proto type MFC was built and its flow characteristics were investigated. Most of the functional components of the pre-proto type were built for the present study, but the remainder were adopted from a commercial unit. The flow control characteristics were compared with that of a standard MFC. Major dimensions of an MFC for 0-10 SLM capacity were suggested.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.509-512
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• 2004

This paper proposed a new solid State Relay(SSR) structure that can replace the conventional SSR as a power IC. The photodiode arrays, the main part of this structure, were designed and integrated in the same power It chip with the output parts, LDMOSFET and BJT, on a SOI substrate. The fabrication of this input part shared the same output LDMOSFET fabrication processs, except the additional deposition of Silicon nitride($Si_3N_4$) for the photo-detection part. According to LED illumination intensites and photo detecting areas, we could obtain voltage of 0.49V ${\~}$0.52V and current of 5.5uA ${\~}$ 108uA respectively from the fabricated unit photodiode. The maximum value of the voltage and the current we could obtain from the photodiode array were 3.58V and 24.4uA respectively, and the voltage was enough to operate the output LDMOSFET

• Journal of Internet Computing and Services
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• v.21 no.2
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• pp.109-119
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• 2020

The FPGAs are semiconductors that can be redesigned after initial fabrication. It is used in various embedded systems such as signal processing, automotive industry, defense and military systems. However, as the complexity of hardware design increases and the design and manufacturing process globalizes, there is a growing concern about hardware trojan inserted into hardware. Many detection methods have been proposed to mitigate this threat. However, existing methods are mostly targeted at IC chips, therefore it is difficult to apply to FPGAs that have different components from IC chips, and there are few detection studies targeting FPGA chips. In this paper, we propose a method to detect hardware trojan by learning the static features of hardware trojan in LUT-level netlist of FPGA using machine learning.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.12
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• pp.5832-5837
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• 2011

In this paper, we designed a thermal shutdown block for LED applications using a 1 ${\mu}m$ CMOS process. The proposed thermal shutdown protection circuit has been designed with a shut-off temperature of $120^{\circ}C$ and a restart temperature of $90^{\circ}C$ which are suitable conditions for LED driver IC. Also, we got SPICE simulation results of the circuit about process variation of the semiconductor fabrication. From simulation data, process variation rate of the proposed circuit are within 7 % which are good results compared with conventional BJT current mirror type circuit. Finally, we confirmed that the thermal shutdown circuit has good thermal protection function within a LED driver IC.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.55 no.1
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• pp.26-30
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• 2006

For the purpose of developing capacitive humidity sensor having interdigital electrodes, interdigital electrode was modeled and simulated to obtain capacitance and sensitivity as a function of geometric parameters like the structural gap and thickness. For the development of ASIC, switched capacitor signal processing circuits for capacitive humidity sensor were designed and simulated by Cadence using $0.25{\mu}m$ CMOS process parameters. The signal processing circuits are composed of amplifier for voltage gain control, and clock generator for sensor driving and switch control. The characteristics of the fabricated sensors are; 1) sensitivity is 9fF/%R.H., 2) temperature coefficient of offset(TCO) is $0.4%R.H./^{\circ}C$, 3) nonlinearity is 1.2%FS, 4) hysteresis is 1.5%FS in humidity range of $3%R.H.{\sim}98%R.H.$. The response time is 50 seconds in adsorption and 70 seconds in desorption. Fabricated process used in this capacitive humidity sensor having interdigital electrode are just as similar as conventional IC process technology. Therefore this can be easily mass produced with low cost, simple circuit and utilized in many applications for both industrial and environmental measurement and control system, such as monitoring system of environment, automobile, displayer, IC process room, and laboratory etc.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.1
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• pp.27-30
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• 2004

In this paper, a new small size Lateral Trench Electrode Power MOSFET is proposed. This new structure, called "LTEMOSFET"(Lateral Trench Electrode Power MOSFET), is based on the conventional MOSFET. The entire electrode of LTEMOSFET is placed in trench oxide. The forward blocking voltage of the proposed LTEMOSFET is improved by 1.6 times with that of the conventional MOSFET. The forward blocking voltage of LTEMOSFET is 250V. At the same size, a increase of the forward blocking voltage of about 1.6 times relative to the conventional MOSFET is observed by using TMA-MEDICI which is used for analyzing device characteristics. Because the electrodes of the proposed device are formed in trench oxide, the electric field in the device are crowded to trench oxide. We observed that the characteristics of the proposed device was improved by using TMA-MEDICI and that the fabrication of the proposed device is possible by using TMA-TSUPREM4.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.7
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• pp.176-184
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• 1996

To overcome the drawbacks of conventional LDMOSFETs, we propose RESURF EDMOSFETs which can be adapted in varous circuit applications, be driven without charge pumping circuity and thowe threshold voltage can be adjusted. The devices have the diffused drift region formed by a high tmperature process before the gate oxidaton. After the polysilicon gate electrode formation, a fraction of the drift region around the gate edge is opened for supplemental self-aligned ion implantation to obtain self-aligned drift region. This leads to a shorter gate length and desirable drift region junction contour under the gate edge for minimum specific-on-resistance. In additon, a and maximize the breakdown voltage. Also, by biasing the metal field plate, we can reduce the specific-on-resistance further. The devices are optimized by using the TSUPREM-4 process simulator and the MEDICI device simulator. The optimized devices have the breakdwon voltage and the specific-on-resistance of 101.5V and 1.14m${\Omega}{\cdot}cm^{2}$, respectively for n-channel RESURF EDMOSFET, and 98V and 2.75m.ohm..cm$^{2}$ respectively for p-channel RESURF EDMOSFET. To check the validity of the simulations, we fabricated n-channel EDMOSFETs and confirmed the measured breakdown voltage of 97V and the specific-on-resistance of 1.28m${\Omega}{\cdot}cm^{2}$. These results are superior to those of any other reported power devices for smart power IC applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.67-73
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• 2002

The development of high performance HTS wire is a key factor for various electrical applications of coils and cables. The purpose of this paper is to review and consider the main manufacturing technologies of HTS wire and its current status. A lot of efforts have been focused on the optimization of PIT parameters for Bi-2223/Ag wire. According to this, long Bi-2223 wires having Ic of 130 A were recently produced and their mass production has been underway in US. The current status performance of Bi-2223 wire is supposed to be used in power transmission cable because of its lower self-field property. Y-123 second generation conductor is extensively being developed throughout the world and many fabrication processes are competed with each other. 30 m-long Y-123 wire with Ic of 0.8 MA/$\textrm{cm}^2$ was recently fabricated using IBAD and PLD techniques in Japan. This result offers promise of scalable processing of practical multi-layer coated conductor.