• Asian Journal of Business Environment
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• v.9 no.2
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• pp.5-15
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• 2019

Purpose - The present study endeavours to investigate the impact of intellectual capital (IC) and its components on corporate sustainable growth in India. In addition, this study aims to find out the most influential component of IC on corporate sustainable growth in India. Research design, data, and methodology - A sample size of top 139 NSE listed non-financial companies over a time period of five years has been used in this monograph. The impact of intellectual capital and its components on corporate sustainable growth has been examined using the longitudinal data analysis technique. Results - The findings of this study bring to light that intellectual capital (IC) as measured by the M-VAIC model demonstrates a significant impact on corporate sustainable growth. Considerably, the results also reveal that almost all the explanatory variables viz. Physical Capital, Relational Capital, Innovation Capital, and Process Capital exercise notable influence in explaining corporate sustainable growth. Moreover, the results demonstrate Innovation Capital (controlling the effect of Physical Capital) represents the most influential component of IC on corporate sustainable growth. Conclusions - The research findings show that in the Indian context, both physical capital, and IC (overall), as well as its components, play a crucial role to explain corporate sustainable growth.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.861-863
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• 2003

In this work, the preparations and characteristics of capacitors and inductors for RF IC as a integrated devices are investigated. These kinds of capacitors and inductors can be applicable to the passive components utilized in voltage controlled oscillator(VCO), low noise amplifier(LAN), mixer and synthesizer for mobile telecommunication of radio frequency band(900 MHz to 2.2GHz), and in a library of monolithic microwave integrated circuit(MMIC). The results show that these inductors and capacitors array for RF IC may be applicable to the RF IC passive components for mobile telecommunication.

• Computational Structural Engineering
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• v.35 no.2
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• pp.26-33
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• 2022

• Journal of Contemporary Eastern Asia
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• v.22 no.1
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• pp.1-25
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• 2023

The aim of this study is to answer the straightforward question of whether the implementation of IC has fueled non-interest incomes of banks or not. By utilizing the data of 26 domestic banks in Vietnam and employing the value-added intellectual coefficient model (VAIC) as the measure of IC efficiency, our empirical evidence manifests that IC plays a vital role in fostering non-interest incomes of banks. When dividing VAIC into different components, we find that structure capital employed (SCE) is the most important component to enhance the expansion of these incomes compared with other components including capital employed efficiency (CEE), human capital efficiency (HCE). These findings remain unchanged through some robustness tests performed. While the main driver of IC and SCE, CEE component becomes a substantial advantage to increase non-interest incomes in large banks. Meanwhile, the degree of impact of SCE is higher in small banks compared with large ones. Overall, this study would provide a deep insight into the role of IC in the transformation into non-interest income activities of banks in an emerging country, and therefore our findings would be useful for both scholars and policy-makers in Vietnam, where has undergone the period of major reforms in banking system.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.381-384
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• 2005

Driver IC is one of the key components on the LCD monitor and LCD/TV. The function of the driver IC is to transfer and forward the input signals to LCD panel module. Inside driver IC, there are several operating units which process the input signals and generate the appropriate size and resolution to the LCD panel module. LCD panel module will display these input signals. However, there are some difficulties which driver IC designer, LCD monitor and LCD/TV maker will face. Thus, this article addresses the function and difficulties on driver IC.

• Journal of the Korean Society of Safety
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• v.15 no.4
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• pp.8-14
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• 2000

The remaining life estimation for the aged components in power plants as well as chemical plants are very important because mechanical properties of the components are degraded with time of service exposure in the high temperature. Since it is difficult to take specimens from the operating components to evaluate mechanical properties of components, accelerated aging technique are needed to estimate and analyse the material degradation. In the this study, test materials with 4 different degradation levels were prepared by isothermal aging heat treatment at $630^{\circ}C$. And tensile test, $k_{IC}$ test, hardness test and Scanning Electron Microscope analysis were performed in order to evaluate the degradation of 1Cr-1Mo-0.25V steels.

• International Journal of Computer Science & Network Security
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• v.21 no.6
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• pp.7-10
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• 2021

The article analyzes and concretizes the understanding of the differences between the concepts of competence / competence according to the criterion general - personal. Based on the identified characteristics of competence (completed personal quality, activity character, educational result, successful implementation of professional and educational activities), the concept of competence as an integrative dynamic quality of a person, manifested in effective activity in a specific area, is defined. The structure of the IC has been substantiated, including motivational and value; information technology; communicative and reflective components. The content of the named IC components is disclosed. The article analyzes the essence of the characteristics of basic concepts (competence / competence), consideration of information competence in the research of famous scientists in order to concretize the studied phenomenon; concretization of the identified pedagogical conditions in educational process.

• ETRI Journal
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• v.38 no.4
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• pp.645-653
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• 2016

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.