• Electronics and Telecommunications Trends
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• v.39 no.3
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• pp.98-106
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• 2024

Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.

• Journal of Korea Technology Innovation Society
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• v.5 no.1
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• pp.1-15
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• 2002

This study reviews the new Perspectives of science and technology Policy based on "the innovation system ap-proach" . It examines the theories of innovation and the economic rationale of government intervention of the in-novation system approach and compares them with those of traditional nee-classical approach. It also examines the basic theme of science and technology Policy of "the innovation system approach" It argues that the enhancement of innovating capability, the transformation of innovation system coping with changing technological and econom-ic environments, and the policy learning of the government and innovators are very important and peculiar sub-jects of the science and technology Policy based on "the innovation system approach".ovation system approach".uot;.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.487-490
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• 2011

As international standards of ICT were recently recognized as a essential strategy to penetrate into global markets in advance, the competition for international standardization among advanced countries and companies has been intensified. Also, the convergence of ICT and other industry as well as that of ICT and broadcasting has caused the expansion of range and importance in standardization. It is necessary to set up the strategy of standardization on essential technology and implement it systematically in order to take leading position in global market of IC in smart information society of the 21th century. Therefore, in this paper, I'll suggest constructive strategies of standardization through analyzing the trend and environment of IC standardization.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• v.9 no.2
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• pp.71-80
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• 2014

Standard Industrial classification is a key factor of technology spillover effect. It is the result of the empirical study that is the IC(industrial classification) which influences the technology spillover effect by way of interaction term, or moderating effect combing independent variables and moderators. As relatively high technology industry is more important than the low counterpart in R&D management system. And the result of the study says that Government should support SME's considering the IC moderating effect and different subsidies which is appropriated to the SME's IC(industrial classification). This way of Government subsidy will improve the efficiency of industrial policy effect of SME's.

• Journal of Digital Convergence
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• v.11 no.4
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• pp.221-227
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• 2013

RFID is an automatic identification technology that can control a range of information via IC chips and radio communication. Also known as electronic tags, smart tags or electronic labels, RFID technology enables embedding the overall process from production to sales in an ultra-small IC chip and tracking down such information using radio frequencies. Currently, RFID-based application and development is in progress in such fields as health care, national defense, logistics and security. RFID structure consists of a reader that reads tag information, a tag that provides information and the database that manages data. Yet, the wireless section between the reader and the tag is vulnerable to security issues. To sort out the vulnerability, studies on security protocols have been conducted actively. However, due to difficulties in implementation, most suggestions are concerned with theorem proving, which is prone to vulnerability found by other investigators later on, ending up in many troubles with applicability in practice. To experimentally test the security of the protocol proposed here, the formal verification tool, CasperFDR was used. To sum up, the proposed protocol was found to be secure against diverse attacks. That is, the proposed protocol meets the safety standard against new types of attacks and ensures security when applied to real tags in the future.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.121-124
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• 2009

전 세계적인 에너지 절약 정책에 대응하여 새로운 고효율 LED 및 드라이버 IC의 출시가 활발하다. 단색 또는 칼라 LED를 사용하여 경관조명, 무대조명, 음악분수 등에 많이 활용되는데 다양한 전압 및 LED 구동 방식 등에 따라 LED의 수명과 비용이 달라질 수 있다. 또한 LED의 밝기 및 색상 등을 조절하여 멋진 연출을 위해 마이크로컨트롤러의 사용이 필수적이고, 다수의 장치를 함께 연동하는 경우에는 이들을 통신으로 연결하여 사용하는데, 본 논문에서 조명 장치에 표준으로 많이 사용하는 DMX512 통신 프로토콜, 몇 가지 정전류 구동 방식에 대해서 살펴보고, 저가격의 마이크로컨트롤러를 사용하여 DMX512 수신 장치를 구현해 보았다.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.372-373
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• 2006

전력산업의 환경변화에 따라 수요자의 정보를 기반으로 한 수요관리기법의 프로그램들이 많이 개발되고 있다. 이에 따라 수요자의 부하패턴 정보 분석이 중요한 역할을 하며, 또한 분석결과를 이용한 변동 요금의 설계는 수요관리프로그램의 성패를 좌우할 만한 핵심요소로 등장하고 있다. 본 논문에서는 선진국에서 실시하고 있는 수요관리 프로그램에 적용되고 있는 변동 요금제의 현황을 조사 분석하였다. 분석결과는 수요자 중심의 신 수요관리프로그램의 개발의 정책 결정 및 설계에 주요 역할을 할 것으로 판단된다.

• Electronics and Telecommunications Trends
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• v.4 no.2
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• pp.22-42
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• 1989

세계 정보통신산업의 최근 큰 변화가 있었는데, 무역정책측면에서는 미국의 종합무역법확정 및 발효, 지역주의의 확대가 특징적으로 나타났으며 기술개발측면은 신기술 개발촉진, 국제간 생산 이전가속, 지적소유권 문제의 확산, 그리고 국제조직측면으로는 전기통신의 표준화, 신기술의 국제적 표준화, 국제 ISDN서비스 논의의 진전등이 환경변화 요인으로 지적되고 있다. 정보통신산업의 산업별 성장은 전체적으로 1987년이후 증가속도가 둔화되고 있으며, 특히 통신기기와 컴퓨터분야의 성장율이 저하되고 있다. 그러나 부품산업은 IC와 반도체의 수요확대에 힘입어 평균수준을 기록하고 있다. 국가별로 볼때 특징적인 것은 미국, 일본, 유럽 등 주요 선진국들에 비해 한국, 대만 등 신흥 공업국들의 성장속도가 빠르게 진행되고 있으며 시장점유율도 두드러지게 확대되고 있는 것으로 분석되었다.

• Journal of Digital Convergence
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• v.15 no.10
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• pp.571-577
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• 2017

This study aimed at evaluating the potential of makgeolli, which is widely consumed as beverage, as a functional cosmetic ingredient, based on analyses on its antioxidant activity and tyrosinase activity inhibitory effect. The sample was extracted by concentrating the suspension obtained after adding MeOH (3 L) to the residue of a commercial makgeolli and then adding EtOAc (3 L) to the concentrate, which was subjected to fractionation. The upper layer of the fractions was used as the final sample. In MTT assay assessments, no cytotoxicity was observed at a concentration range of 10 to $1,000{\mu}g/mL$; the antioxidant activity of the extract showed a concentration-dependent tendency and it had a high activity with an $EC_{50}$ of 7.008 mg/mL. Also, in a tyrosinase activity inhibitory effect assessment, the extract showed an $IC_{50}$ value of 39.22 mg/mL. These results confirmed that this sample has potential as a functional cosmetic ingredient.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.05a
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• pp.845-848
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• 2009

Power semiconductor devices are semiconductor devices used as switches or rectifiers in power electronics circuits. Theyare also caleed power devices or when used in integrated circuits, called power ICs. Some common power devices are the power diode, thyristor, power MOSFET and IGBT (insulated gate bipolar transistor). A power diode or MOSFET operates on similar principles to its low-power counterpart, but is able to carry a larger amount of current and typically is able to support a larger reverse-bias voltage in the off-state. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. With this structure, one of the connections of the device is located on the bottom of the semiconductor.