• Steel and Composite Structures
• /
• v.22 no.6
• /
• pp.1445-1463
• /
• 2016

The effects of moisture and temperature on buckling of laminated composite cylindrical shell panels are investigated both numerically and experimentally. A quadratic isoparametric eight-noded shell element is used in the present analysis. First order shear deformation theory is used in the present finite element formulation for buckling analysis of shell panels subjected to hygrothermal loading. A program is developed using MATLAB for parametric study on the buckling of shell panels under hygrothermal field. Benchmark results on the critical loads of hygrothermally treated woven fiber glass/epoxy laminated composite cylindrical shell panels are obtained experimentally by using universal testing machine INSTRON 8862. The effects of curvature, lamination sequences, number of layers and aspect ratios on buckling of laminated composite cylindrical curved panels subjected to hygrothermal loading are considered. The results are presented showing the reduction in buckling load of laminated composite shells with the increase in temperature and moisture concentrations.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.1
• /
• pp.51-59
• /
• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Structural Engineering and Mechanics
• /
• v.67 no.2
• /
• pp.165-173
• /
• 2018

A simple predicted model using a modified Shear-lag method was used to represent the moisture absorption effect on the stiffness degradation for $[0/90]_{2s}$ composite laminates with transverse cracks and under flexural loading. Good agreement is obtained by comparing the prediction model and experimental data published by Smith and Ogin (2000). The material properties of the composite are affected by the variation of temperature and moisture absorption. The transient and non-uniform moisture concentration distribution give rise to the transient elastic moduli of cracked composite laminates. The hygrothermal effect is taken into account to assess the changes in the normalised axial and flexural modulus due to transverse crack. The obtained results represent well the dependence of the stiffness properties degradation on the cracks density, moisture absorption and operational temperature. The composite laminate with transverse crack loaded in axial tension is more affected by the hygrothermal condition than the one under flexural loading. Through this theoretical study, we hope to contribute to the understanding of the moisture absorption on the composite materials with matrix cracking.

• Journal of the Korean Society of Propulsion Engineers
• /
• v.17 no.2
• /
• pp.31-38
• /
• 2013

This research analyzed the acoustic emission signals collected from the pin loading tests and investigated the effect of hygrothermal exposure on the fracture behavior of the pin-jointed carbon fiber/epoxy composites. The composite specimens include: the Base specimen that has not been exposed to any environments, the RT specimen that has been immersed in room temperature water, and the HT specimen that has been immersed in high temperature water. According to the pin loading test, the RT and the HT specimens showed 2.2% and 13% decreases in the bearing strength compared to the Base specimen, respectively. The analysis of the acoustic emission signals showed different fracture acceleration points for three types of the specimens. Furthermore, for the RT and the HT specimens, the event from the matrix crack signals in the composites decreased. This shows the effect of the hygrothermal conditions on the acoustic emission signals. Additionally, upon investigating the fracture behaviors of the pin-jointed composites, the exposing specimens to hygrothermal environments decreases the interfacial characteristics of the composites.

• Structural Engineering and Mechanics
• /
• v.65 no.3
• /
• pp.275-290
• /
• 2018

The hygrothermal stresses in sandwich plate with composite faces due to through the thickness gradient temperature and (or) moisture content are investigated. The layer-wise theory is employed for formulation of the problem. The formulation is derived for sandwich plate with general layer stacking, subjected to uniform and non-uniform temperature and moisture content through the thickness of the plate. The governing equations are solved for free edge conditions and 3D stresses are investigated. The out of plane stresses are obtained by equilibrium equations of elasticity and by the constitutive law and the results for especial case are compared with the predictions of a 3D finite element solution in order to study the accuracy of results. The three-dimensional stresses especially the free edge effect on the distribution of the stresses is studied in various sandwich plates and the effect of uniform and non-uniform thermal and hygroscopic loading is investigated.

• Journal of Mechanical Science and Technology
• /
• v.18 no.3
• /
• pp.357-369
• /
• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Structural Engineering and Mechanics
• /
• v.89 no.3
• /
• pp.265-281
• /
• 2024

The sound radiation responses of multi-layer composite plates subjected to harmonic mechanical excitation in hygrothermal environment is numerically investigated. A homogenized micromechanical finite element (FE) based on the higher-order mid-plane kinematics replicating quadratic function as well as the through the thickness stretching effect together with the indirect boundary element (IBE) scheme has been first time employed. The isoparametric Lagrangian element (ten degrees of freedom per node) is used for discretization to attain the hygro-thermo-elastic natural frequencies and the modes of the plate via Hamilton's principle. The effective material properties under combined hygrothermal loading are considered via a micromechanical model. An IBE method is then implemented to attain structure-surrounding coupling and the Helmholtz wave equation is solved to compute the sound radiation responses. The effectiveness of the model is tested by converging it with the similar analytical/numerical results as well as the experimentally acquired data. The present scheme is further hold out for solving diverse numerical illustrations. The results revealed the relevance of the current higher-order FE-IBE micromechanical model in realistic estimation of hygro-thermo-acoustic responses. The geometrical parameters, volume fraction of fiber, layup, and support conditions alongside the hygrothermal load is found to have significant influence on the vibroacoustic characteristics.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2012.05a
• /
• pp.411-413
• /
• 2012

This study has been investigated about hygrothermal environmental effects on the pin-joined carbon/epoxy composites through acoustic emission technique. The specimens were classified as three types for pin loading test : Base (before immersion), RT (room temperature immersion), HT ($75^{\circ}C$ immersion). As a results, the bearing strength of RT specimens was weakly decreased than that of base specimens. The bearing strength of HT specimens was greatly decreased than that of Base and RT specimens due to effects of simultaneous moisture and higher temperature. Also, the results from cumulative hit of acoustic emission indicated that AE events induced by matrix cracks of HT specimens was lower than that of base specimens.

• Coupled systems mechanics
• /
• v.12 no.2
• /
• pp.151-165
• /
• 2023

In this study, a simple method for the determination of the shear correction factor for composites beam with a rectangular cross section is presented. The plane stress elasticity assumption is used after simplifications of the expression of the stress distribution in the beam. The different fiber orientation angle and volume fraction are considered in this work. The studied structure is subjected to various loading type (thermal and hygrothermal). The numerical results obtained show that there is a dependence of the shear coefficient on the orientation of the fibers. The evolution of the shear correction factors depends not only on the orientation of the fibers and also on the volume fraction and the environment. the advantage of this developed formula of the shear correction factor is to obtain more precise results and to consider several parameters influencing this factor which are neglected if the latter is constant.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.4
• /
• pp.1347-1355
• /
• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.