• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.252-257
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• 1994

A non-uniform finite-difference Thin Film Transistor Simulation Program (TFTSP) has been developed for hydrogenated amorphous silicon TFTs. TFTSP was developed to remove as many of simplifying assumptions as possible and to provide flexibility in the modeling of TFTs so that different model assumptions may be analyzed and compared. In order to insure its usefulness and versatility as an analytic and design tool it is important for the code to satisfy a number of conditions. However, at the beginning stage of the program development, this paper shows that the code can compute the static terminal characteristics of a-Si:H TFTs under a wide range of bias conditions to allow for comparison of the model with experiment. Some of those comparisons include transfer characteristics and I-V characteristics. TFTSP will be refined to conveniently model the performances of TFTs of different designs and to analyze many anomalous behaviors and factors of a-Si:H TFTs.

• Journal of the Korean Vacuum Society
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• v.21 no.1
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• pp.29-35
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• 2012

The Hydrogenated silicon nitride (SiNx:H) using plasma enhanced chemical vapor deposition is widely used in photovoltaic industry as an antireflection coating and passivation layer. In the high temperature firing process, the $SiN_x:H$ film should not change the properties for its use as high quality surface layer in crystalline silicon solar cells. Initially PECVD-$SiN_x:H$ film trends were investigated by varying the deposition parameters (temperature, electrode gap, RF power, gas flow rate etc.) to optimize the process parameter conditions. Then by varying gas ratios ($NH_3/SiH_4$), the hydrogenated silicon nitride films were analyzed for its optical, electrical, chemical and surface passivation properties. The $SiN_x:H$ films of refractive indices 1.90~2.20 were obtained. The film deposited with the gas ratio of 3.6 (Refractive index=1.98) showed the best properties in after firing process condition. The single crystalline silicon solar cells fabricated according to optimized gas ratio (R=3.6) condition on large area substrate of size $156{\times}156mm$ (Pseudo square) was found to have the conversion efficiency as high as 17.2%. Optimized hydrogenated silicon nitride surface layer and high efficiency crystalline silicon solar cells fabrication sequence has also been explained in this study.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.136-136
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.31-31
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• 1999

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.9
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• pp.1615-1622
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• 2008

We have fabricated the poly-silicon thin film transistor(TFT) which has the LDD-region with graded spacer. The devices of n-channel poly-si TFT's hydrogenated by $H_2$ and $H_2$/plasma processes were fabricated for the devices reliability. We have biased the devices under the gate voltage stress conditions of maximum leakage current. The parametric characteristics caused by gate voltage stress conditions in hydrogenated devices are investigated by measuring/analyzing the drain current, leakage current, threshold voltage($V_{th}$), sub-threshold slope(S) and transconductance($G_m$) values. As a analyzed results of characteristics parameters, the degradation characteristics in hydrogenated n-channel polysilicon TFT's are mainly caused by the enhancement of dangling bonds at the poly-Si/$SiO_2$ interface and the poly-Si grain boundary due to dissolution of Si-H bonds. The structure of novel proposed poly-Si TFT's are the simplicities of the fabrication process steps and the decrease of leakage current by reduced lateral electric field near the drain region.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1701-1703
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• 2006

Here we describe a novel driving scheme in the form of negative AC bias stress (NAC) to compensate shift in the threshold voltage for hydrogenated amorphous silicon (${\alpha}$-Si:H) thin film transistor (TFT) for AMOLED applications. This scheme preserves the threshold voltage shift of ${\alpha}$-Si:H TFT for infinitely long duration of time(>30,000 hours) and thereby overall performance, without using any additional TFTs for compensation. We briefly describe about the possible driving schemes in order to implement for real time AMOLED applications. We attribute most of the results based on concept of plugging holes and electrons across the interface of the gate insulator in a controlled manner.

• Journal of the Optical Society of Korea
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• v.17 no.5
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• pp.433-440
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• 2013

We present an experimental and numerical study of spectral profiles of effective group indices of hydrogenated amorphous silicon (a-Si:H) waveguides and of their chromatic-dispersion effect on the four-wave-mixing (FWM) signal generation. The a-Si:H waveguides of 220-nm thickness and three different widths of 400, 450 and 500 nm were fabricated by using the conventional CMOS device processes on a $2-{\mu}m$ thick $SiO_2$ bottom layer deposited on 8-inch Si wafers. Mach-Zehnder interferometers (MZIs) were formed with the a-Si:H waveguides, and used for precise measurement of the effective group indices and thus for determination of the spectral profile of the waveguides' chromatic dispersion. The wavelength ranges for the FWM-signal generation were about 45, 75 and 55 nm for the 400-, 450- and 500-nm-wide waveguides, respectively, at the pump wavelength of 1532 nm. A widest wavelength range for the efficient FWM process was observed with the 450-nm-wide waveguide having a zero-dispersion near the pump wavelength.

• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.96-100
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• 1997

Hydrogenated amorphous carbon films were deposited on silicon substrates by using an RF PECVD. The hydrogen/methane ratio was varied from 50% to 88% to study the effect of hytdrogen in the film on the tribological properties. The friction and wear behaviors of the deposited films were investigated by ball-on-disk type wear tester. FT-IR spectra were used to characterize the structure of the films. Tribological properties of carbon films were correlated with their structure such as ratio of "polymer-like" stretching type and that of sp2 bonding. The result showed that the annealing caused a decrease in the amount of wear of contacted $Si_3N_4$ balls and a increase in the coefficient of friction. Possible explanation for annealing effect was discussed by the hydrogen desorption.esorption.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.135.1-135.1
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• 2014

Silicon nanoparticles can be synthesized in a standard radio-frequency glow discharge system at low temperature (${\sim}200^{\circ}C$). Plasma synthesis of silicon nanoparticles, initially a side effect of powder formation, has become over the years an exciting field of research which has opened the way to new opportunities in the field of materials deposition and their application to optoelectronic devices. Hydrogenated polymorphous silicon (pm-Si:H) has a peculiar microstructure, namely a small volume fraction of plasma synthesized silicon nanoparticles embedded in an amorphous matrix, which originates from the unique deposition mechanism. Detailed discussion on plasma synthesis of silicon nanoparticles, growth mechanism and photovoltaic application of pm-Si:H will be presented.

• Korean Journal of Materials Research
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• v.8 no.4
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• pp.359-361
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• 1998

Visible photoluminescence(PU was observed from hydrogenated amorphous silicon deposited on silicon(a-Si : H/Si) using electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR- PECVD) with silane ($SiH_{4}$) gas as the reactant source. The PL spectra from a-Si : H/Si were very similar to those from porous silicon. Hydrogen contents of samples annealed under oxygen atmosphere for 2minutes at $500^{\circ}C$ by rapid thermal annealing were reduced to 1~2%, and the samples did not show visible PL, indicating that hydrogen has a very important role in the PL process of a- Si : H/Si. As the thickness of deposited a-Si : H film increased, PL intensity decreased. The visi¬ble PL from a-Si: H deposited on Si by ECR-PECVD with $SiH_{4}$ . is suggested to be from silicon hydrides formed at the interface between the Si substrate and the deposited a-Si : H film during the deposition.