• Korean Chemical Engineering Research
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• 제46권2호
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• pp.310-315
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• 2008

실란커플링제인 glycidoxypropyl trimethoxysilane(GPTMS)과 vinyltriethoxysilane(VTES)을 출발물질로 하여 sol-gel 법에 의해 유-무기 혼성 용액을 제조하였다. 이 용액에 spiropyran계 광 변색 염료를 ethylacetate에 용해시킨 용액을 혼합하여 광 변색 코팅 용액을 제조하였다. 그 후 기재인 polycarbonate 시트에 스핀 코팅 시키고 $100^{\circ}C$에서 2 h 동안 열 경화시켜 광 변색성을 갖는 하드 코팅 막을 제조하였다. 코팅 막은 UV 광을 조사함에 의해 투명색으로부터 푸른색으로 변했다가 다시 투명색으로 변하는 가역적인 색변화를 보여주었다. 이때 코팅 막의 소색속도 및 연필경도는 코팅 용액 중의 GPTMS의 mol비가 증가됨에 따라 증가하였다.

• Korean Chemical Engineering Research
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• 제46권1호
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• pp.112-117
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• 2008

1:1로 몰 비가 조절된 glycidoxypropyl trimethoxysilane(GPTMS)과 methyl triethoxysilane(MTES)을 출발물질로 하여 sol-gel법에 의해 유-무기 혼성 용액을 제조하였다. 이 용액에 spiropyran계 광 변색 염료를 ethylacetate(EA)에 용해시킨 용액을 혼합하여 광 변색 코팅 용액을 제조하였다. 그 후 기재인 polycarbonate 시트에 스핀 코팅 시키고 $100^{\circ}C$에서 2 h 동안 열 경화 시켜 광 변색 코팅 막을 제조하였다. 코팅 막은 UV 광을 조사함에 의해 가역적인 색변화를 보여주었다. 이때 코팅 막의 소색속도는 코팅 용액 중의 EA의 첨가량이 증가됨에 따라 증가하였다.

• 한국전기전자재료학회논문지
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• 제33권4호
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• pp.286-290
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• 2020

The formation of inorganic thin films in low-temperature solution processes is necessary for a wide range of commercial applications of organic electronic devices. Aluminum oxide thin films can be utilized as barrier films that prevent the deterioration of an electronic device due to moisture and oxygen in the air. In addition, they can be used as the gate insulating layers of a thin film transistor. In this study, aluminum oxide thin film were formed using two methods simultaneously, a thermal process and the DUV process, and the properties of the thin films were compared. The result of converting aluminum nitrate hydrate to aluminum oxide through a hybrid process using a thermal treatment and DUV was confirmed by XPS measurements. A film-based a-IGZO TFT was fabricated using the formed inorganic thin film as a gate insulating film to confirm its properties.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.126-126
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• 2012

In past decades, the themal inkjet (TIJ) printer has been widely used as one of the most well-known digital printing technology due to its low cost, and high printing quality. Since the printing speed of TIJ printers are much slower than that of laser printers, however, there has been intensive efforts to raise the printing speed of TIJ printers. One of the most plausible methods to raise the printing speed of TIJ printers is to adopt a page-wide array TIJ printhead. To accomplish this goal, the high efficiency inkjet heating resistor films should be developed to settle the high power consumption problem of a page-wide array TIJ printhead. In this study, we investigated noble metal based multicomponent thin film resistor films prepared by atomic layer deposition (ALD) for a high efficiency inkjet printhead. Design concept, preparation, material properties of noble metal based multicomponent thin films will be discussed in terms of mutlfunctionality.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2005년도 High Temperature Superconductivity Vol.XV
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• pp.96-96
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• 2005

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.422-422
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• 2009

Photocurable inorganic-organic hybrid materials were prepared from colloidal-silica nanoparticles synthesized through the solgel process and using acryl resin. The synthesized colloidal-silica nanoparticles had uniform diameters of around 20 nm, and they were organically modified, using methyl and methacryl functional silanes, for efficient hybridization with acryl resin. The organically modified and stabilized colloidal-silica nanoparticles could be homogeneously hybridized with aeryl resin without phase separation. The successfully fabricated hybrid materials exhibit efficient photocurability and simple film formation due to the photopolymerization of the organically modified colloidal-silica nanoparticles and acryl resin upon UV exposure. The fabricated hybrid films exhibit an excellent optical transmission of above 90% in the visible region as well as an enhanced surface smoothness of around 1 nm RMS roughness. In addition, the hybrid films exhibit improved thermal and mechanical characteristics, much better than those of acryl resin. More importantly, these photocurable hybrid materials fabricated through the synergistic combination of colloidal-silica nanoparticles with acryl resin are candidates for optical and electrical applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.81-81
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• 2009

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.135-135
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• 2016

Recently flexible electrode materials have attracted attention in various electrical devices. In general, copper(Cu) is widely used electrical conductive material. However, Cu film showed drastically reduction of electrical conductivities under an applied tensile strain of 10%. These poor mechanical characteristics of Cu have difficulty applying in flexible electronic applications. In this study, mechanical flexibilities of Cu thin film were improved by hybridization with carbon nanotubes(CNTs) and laser sintering. First, thin carbon nanotube films were fabricated on a flexible polyethylene terephthalate(PET) substrate by using ultrasonic spray coating of CNT dispersed solution. After then, physically connected CNT-Cu NPs films were formed by utilizing ultrasonic spray coating of Cu nanoparticles dispersed solution on prepared CNT thin films. Finally, CNT-Cu thin films were firmly connected by laser sintering. Therefore, electrical stabilities under mechanical stress of CNT-Cu hybrid thin films were compared with Cu thin films fabricated under same conditions to confirm improvement of mechanical flexibilities by hybridization of CNT and Cu NPs.

• Macromolecular Research
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• 제16권6호
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• pp.503-509
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• 2008

A series of colorless polyimide (PI) nanocomposite films were synthesized from 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFDB) with various organoclay contents by solution intercalation polymerization to poly(amic acid)s, followed by thermal imidization. The variation with the organoclay content of the thermomechanical properties, morphology, and optical transparency of the hybrids was examined at organoclay loadings ranging from 0 to 1.0 wt%. The hybrid films showed high optical transparency and almost no color, with cut-off wavelengths ranging from 352 and 356 nm and very low $b^*$ values of 1.19-1.77. The hybrid PI films showed good thermal properties with a glass transition temperature of $280-287^{\circ}C$. Most films did not show any significant thermal decomposition below $490^{\circ}C$. The addition of only a small amount of organoclay was sufficient to improve the tensile properties of the PI films with maximum enhancement being observed at 0.25 wt% organoclay. Moreover, these PI hybrids also had low coefficients of thermal expansion (CTE).

• 대한전자공학회논문지SD
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• 제42권6호
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• pp.17-22
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• 2005

유무기 하이브리드 SiOC 박막은 차세대 유력한 저유전상수를 갖는 박막이다. SiOC 박막의 결합구조는 FTIR 분석기를 이용하여 화학적 이동이 일어나는 것을 확인하여 분석하였다. 유기화학분야에서의 일반적인 화학적 이동은 red shift에 해당하지만, 하이브리드 타입의 SiOC 박막은 red shift 뿐만 아니라 특이한 경우에 해당하는 blue shift도 관찰되었다. 화학적 이동의 원인은 전기음성도가 큰 원소가 주변에 존재하는 수소결합사이의 상호작용 때문인데, SiOC 박막에서 blue shift는 전자를 많이 포함하는 메틸그룹이 증가함으로 생기는 기공을 만드는 원인을 제공한다. SiOC 박막의 결합구조 역시 2가지 유형의 화학적 이동에 따라서 cross-link 구조와 case-link 구조의 두 가지 유형으로 나타난다. 유량비와 증착할 때 주어지는 열에너지에 따라서 두 가지 결합구조를 나타낸다. cross-link 구조와 cross-link breakage 구조는 박막의 유전상수가 낮아지는 원인 서로 다르며 화학적 물리적인 특성 또한 다르게 나타나는 것을 증명하고 있다. Si-O-C cross-link 구조는 red shift의 원인이 된 수소결합에 의한 원자사이의 길이가 길어지는 효과에 의해 표면접착력이 개선되며, 유전상수 역시 감소하였다.