• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.79-87
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• 2011

In this paper, suggested is a hybrid-type visual alignment system to align mask and panel in 3-D space, where mask and panel are to be controlled independently by two individual positioning mechanisms in order to compensate for spatial misalignments. In the hybrid visual alignment system, the below 4-PPR parallel mechanism provides in-plain motions to pattern mask like the other conventional alignment systems while the above 4-RPS parallel mechanism is to move glass panel to achieve a complete spatial alignment. For the control of the hybrid alignment system, first, inverse kinematic solutions for the parallel mechanisms are given to determine the driving distance of each active joint, and also an efficient way to determine the spatial alignment error is developed by exploiting three in-plane cameras.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.3
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• pp.433-439
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• 2018

In this paper, a SDINS(strapdown inertial navigation system) rapid initial alignment technique with adaptive time delay compensation is proposed. The proposed method consists of two steps. In first step, misalignment and data latency are estimated by conducting pre-transfer alignment. Then, hybrid alignment is designed to rapidly find the misalignment changes induced by pyro-shock. To improve the performance of hybrid alignment, adaptive time delay compensation method is suggested. We verify the performance improvement of the proposed alignment scheme comparing with the conventional transfer alignment method by van test. The test result shows that the proposed alignment technique improves alignment performance.

• MALSORI
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• v.68
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• pp.95-114
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• 2008

The recent growing popularity of statistical methods in machine translation requires much more large parallel corpora. A Korean-English parallel corpus, however, is not yet enoughly available, little research on this subject is being conducted. In this paper we present a hybrid method of aligning sentences for Korean-English parallel corpora. We use bilingual news wire web pages, reading comprehension materials for English learners, computer-related technical documents and help files of localized software for building a Korean-English parallel corpus. Our hybrid method combines sentence-length based and word-correspondence based methods. We show the results of experimentation and evaluate them. Alignment results from using a full translation model are very encouraging, especially when we apply alignment results to an SMT system: 0.66% for BLEU score and 9.94% for NIST score improvement compared to the previous method.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.154-159
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• 2005

The next generation of optical storage systems requires higher numerical aperture (NA) objective lenses and shorter wavelength laser in order to improve the unit areal density. A blu-ray technology satisfies a miniaturization and a high capacity which are the requirements of the portable device. In this paper, we analyze the optical performance of hybrid micro lens and do active alignment. The hybrid micro lens is manufactured by using a wafer based fabrication technology. Optical components of hybrid micro lens are evaluated. The measurement of the optical power, the spot size and the wavefront error awe performed to evaluate the hybrid micro lens with NA 0.85. Using the measured data, we estimate if the performance of hybrid micro lens corresponds to the designed performance. After the performance of hybrid micro lens is evaluated, the integrated optical pickup and the hybrid micro lens are assembled by active alignment using UV curing and the optical performance of SFFOP is satisfied with BD specifications.

• Transactions of the Society of Information Storage Systems
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• v.2 no.1
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• pp.79-84
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• 2006

The next generation of optical storage systems requires higher numerical aperture(NA) objective lenses and shorter wavelength laser in order to improve the unit areal density. A blu-ray technology satisfies a miniaturization and a high capacity which are the requirements of the portable device. In this paper, we analyze the optical performance of hybrid micro lens and do active alignment. The hybrid micro lens is manufactured by using a wafer based fabrication technology. Optical components of hybrid micro lens are evaluated. The measurement of the optical power, the spot size and the wavefront error are performed to evaluate the hybrid micro lens with NA 0.85. Using the measured data, we estimate if the performance of hybrid micro lens corresponds to the designed performance. After the performance of hybrid micro lens is evaluated. the integrated optical pickup and the hybrid micro lens are assembled by active alignment using UV curing and the optical performance of SFFOP is satisfied with BD specifications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.663-664
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• 2010

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.623-624
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• 2009

Here we report a photo polymerization-induced hybrid alignment of a nematic liquid crystal cell which can be applied for a roll to roll fabrication process. Predominant polymerization in the vicinity of UV incident front induced a diffusion of monomers toward front slide and anisotropic polymer network was formed parallel to the polarization direction of the UV light. This induced planar alignment of liquid crystals at the front slide. Simultaneously, homeotropic alignment was induced at the bottom slide as the polymers are phase-separated from a bottom slide.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• v.1
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• pp.115-120
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• 2006

This article propose a new idea of developing a hybrid scheme to achieve faster INS alignment with higher accuracy using a novel procedure to estimate the initial attitude angles that combines a Kalman filter and Adaptive Neuro-Fuzzy Inference System architecture. A tactical grade inertial measurement unit was applied to verify the performance of proposed scheme in this study. The preliminary results indicated the outstanding improvements in both time consumption for fine alignment process and accuracy of estimated attitude angles, especially in heading angles. In general, the improvement in terms of time consumption and the accuracy of estimated attitude estimated accuracy reached 80% and 70% respectively during alignment process after compensating the attitude angles estimated by an extended Kalman filter with 15 states using proposed approach. It is worth mentioned that the proposed approach can be implemented in general real time navigation applications.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.119-124
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• 2021

In a situation where Moore's law, which states that the performance of semiconductor integrated circuits doubles every two years, is showing a limit from a certain point, and it is difficult to increase the performance due to the limitations of exposure technology.In this study, a wafer hybrid method that can increase the degree of integration Various research on bonding technology is currently in progress. In this study, in order to achieve rotational precision between wafers in wafer hybrid bonding technology, modeling of θ_z alignment stage and VCM actuator modeling used for rotational alignment, magnetic field analysis and desgin, control, and evaluation are performed. The system of this study was controlled by VCM actuator, capactive sensor, and dspace, and the working range was ±7200 arcsec, and the in-position and resoultion were ±0.01 arcsec. The results of this study confirmed that safety and precise control are possible, and it is expected to be applied to the process to increase the integration.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.142-147
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• 2022

After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.