• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.4 s.181
• /
• pp.162-167
• /
• 2006

Hot embossing lithography(HEL) has the production advantage of comparatively few process step, simple operation, a relatively low cost for embossing tools(Si), and high replication accuracy for small features. In this paper, we considered the nano-molding characteristic according to molding parameters(temperature, pressure, times, etc) and induced a optimal molding condition using HEL. High precision nano-patter master with various shapes were designed and manufactured using the DRIE(Deep Reactive ion Etching), LPCVD(Low Pressure Chemical Vapor Deposition) and thermal oxidation process, and we investigated the molding characteristic of DVD and Blu-ray nickel stamp. We induced flow behaviors of polymer, rheology by shapes and sizes of the pattern through various molding experiments. Finally, with achieving nano-structure molding with high aspect ratio, we will secure a basic technology about the molding of large-area nano-pattern media.

• Journal of the Korean Vacuum Society
• /
• v.13 no.1
• /
• pp.34-38
• /
• 2004

Hot embossing master is indispensable for the fabrication of polymeric optical waveguides using hot embossing technology. Sidewall roughness of silicon master is directly related to optical loss of optical waveguides In this paper, a silicon master was fabricated by using a deep-RIE process. Additionally, thermal oxidation followed by oxide removal was carried out to minimize etched Si sidewall roughness. Thermal oxidation and oxide removal were performed with $H_2O_2$ atmosphere at $1050^{\circ}C$ and $NH_4$F:HF=6:l BOE, respectively, for the oxide thickness of 400$\AA$, 1000$\AA$, 3000$\AA$, 4500$\AA$, 5600$\AA$ and 6200$\AA$. The sidewall roughness was characterized by SEM and SPM-AFH measurements. We found that the roughness was improved from 12nm (RMS) to 6nm (RMS) for the scalloped sidewall and from 162nm (RMS) to 39nm (RMS) for the vertical striation sidewall, respectively.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.10a
• /
• pp.217-220
• /
• 2009

This paper presents fabrication method of nano-structured PMMA substrates as well as evaluations of their optical transmittance. For anti-reflective surface, surface coating method had been conventionally used. However, it requires high cost, complicated process and post-processing times. In this study, we suggested the fabrication method of anti-reflective surface by the hot embossing process. Using the nano patterned master fabricated by anodic aluminum oxidation process. Anodic aluminum oxide(AAO) is widely used as templates or a molds for various applications such as carbon nano tube (CNT), nano rod and nano dots. Anodic aluminum oxidation process provides highly ordered regular nano-structures on the large area, while conventional pattering methods such as E-beam and FIB can fabricate arbitrary nano-structures on small area. We fabricated a porous alumina hole array with various inter-pore distance and pore diameter. In order to replicate nano-structures using alumina nano hole array patterns, we have carried out hot-embossing process with PMMA substrates. Finally the nano-structured PMMA substrates were fabricated and their optical transmittances were measured in order to evaluate the charateristivs of anti-reflection. Anti-reflective structure can be applied to various displays and automobile components.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.1
• /
• pp.62-67
• /
• 2016

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

• Polymer(Korea)
• /
• v.26 no.4
• /
• pp.462-467
• /
• 2002

Blends of polymethylmethacrylate (PMMA) with polyvinylidenefluoride (PVDF) were prepared by melt mixing and investigated for optical waveguide devices by using hot embossing process. The glass transition temperatures ($T_g$) of the blends were decreased with increasing PVDF contents. However, the crystalline of PMMA/PVDF blends was not appeared by DSC and XRD due to miscibility between PMMA and PVDF. Shear viscosities and refractive indices of the blends were decreased with increasing PVDF contents. Optical transmittances and absorption losses of the blends were improved with increasing PVDF contents. This is due to a decreasing of polarizability of molecules by fluorine molecule in the PVDF.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2007.06a
• /
• pp.279-280
• /
• 2007

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.12
• /
• pp.1106-1110
• /
• 2005

We fabricated (110) silicon hard master by using anisotropic wet etching for embossing. The etching chemical for the silicon wafer was a TMAH $25\%$ solution. The anisotropic wet etching produces a smooth sidewall surface and the surface roughness of the fabricated master is about 3 nm. After spin coating an organic-inorganic sol-gel hybrid material on a silicon substrate, we employed hot embossing technique operated at a low pressure and temperature to form patterns on the silicon substrate by using the fabricated master. We successfully fabricated the multi-mode planar optical waveguides showing low propagation loss of 0.4 dB/cm. The surface roughness of embossed patterns was uniform for more than 10 times of the embossing processes with a single hydrophobic surface treatment of the silicon hard master.

• Journal of the Korean Ceramic Society
• /
• v.42 no.10 s.281
• /
• pp.645-648
• /
• 2005

To fabricate a (100) silicon hard master, we used anisotropic wet etching for the embossing. The etching chemical for the sili­con wafer was a TMAH 25$\%$ solution. The anisotropic wet etching produces a smooth sidewall surface inclined at 54.7°, and the surface roughness of the fabricated master is about 1 nm. After spin coating an organic-inorganic sol-gel hybrid resin on a silicon substrate, we used the fabricated master to form patterns on the silicon substrate. Thus, we successfully obtained patterns via the hot embossing technique with the (100) silicon hard master. Moreover, by using a single hydrophobic surface treatment of the master, we succeeded in achieving uniform surface roughness of the embossed patterns for more than ten embossments.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.05a
• /
• pp.397-400
• /
• 2009

When the metal sheet is subjected to the housing surface for fitting and insulating from harsh surroundings like fluid ingression or hot steam, both strength and formability have to be equally considered. In this regard, the main aim of this study is to design an apparatus of cost-effectively producing flexible fluted band with increasing the formability of embossed stainless steel sheet, which is utilized as a thermal insulation metal for housing ship engine exhauster. Designed to fabricate a maximum sheet width of 700 mm, this new apparatus consists of upper roll made of hard urethane and the female-etched lower roll made of SKD11, have a producing capacity up to 1-meter homogeneously embossed sheet for just 60 seconds. This machine is devised for the maximum operating efficiency from original sheet handling to machine setting. The embossing properties are characterized by 3-D profiling. After embossing plain metal sheet, both yield strength and elongation properties are improved simultaneously, indicating the effectiveness of the newly designed apparatus.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1825-1828
• /
• 2008

A simple method for the fabrication of porous nano-master for antireflective surface is presented. In conventional fabrication methods for antireflective surface, coating method with low refractive index has usually been used. However, it is required to have high cost and long times for mass production. In this paper, we suggested the fabrication method of antireflective surface by the hot embossing process using the porous nano patterned master on silicon wafer fabricated by low-temperature anodic aluminum oxidation. Through multi-AAO and etching processes, nano patterned master with high aspect ratio was fabricated at the large area. Pore diameter and inter-pore distance are about 150nm and from 150 to 200nm. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.