• Title/Summary/Keyword: Hole-filling

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Real-time Virtual-viewpoint Image Synthesis Algorithm Using Kinect Camera

  • Lee, Gyu-Cheol;Yoo, Jisang
    • Journal of Electrical Engineering and Technology
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    • v.9 no.3
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    • pp.1016-1022
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    • 2014
  • Kinect is a motion sensing camera released by Microsoft in November 2010 for the Xbox360 that is used to produce depth and color images. Because Kinect uses an infrared pattern, it generates holes and noises around an object's boundaries in the obtained images. The flickering phenomenon and unmatched edges also occur. In this paper, we propose a real time virtual-view video synthesis algorithm which results in a high quality virtual view by solving these problems stated above. The experimental results show that the proposed algorithm performs much better than the conventional algorithms.

Patent Trend Report for PCB Parallel Build-up (PCB일괄적층에 관한 특허동향분석)

  • Jeong, In-Seong;Lee, Young-Uk
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.14-15
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    • 2006
  • Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.

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A Study on the Automatic Elimination of Free Edge for Sheet Metal Forming Analysis (박판성형해석을 위한 자동 프리에지 제거에 관한 연구)

  • 유동진
    • Transactions of Materials Processing
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    • v.13 no.7
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    • pp.614-622
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    • 2004
  • A new approach for the automatic elimination of free edges in the finite element model for the analysis of sheet metal forming processes is presented. In general, the raw finite element model constructed from an automatic mesh generator is not well suited for the direct use in the downstream forming analysis due to the many free edges which requires tedious time consuming interactive graphic operations of the users. In the present study, a general method for the automatic elimination of free edges is proposed by introducing a CAD/CAE hybrid method. In the method a trimmed parametric surface is generated to fill the holes which are orginated from the free edges by using the one step elastic finite element analysis. In addition, mesh generation algorithm is suggested which can be used in the general trimmed surface. In order to verify the validity of the proposed method, various examples including actual automobile sheet metal parts are given and discussed.

A Study on Explosive Hazardous Areas in Hydrogen Handling Facility (수소 취급설비의 폭발위험장소에 관한 연구)

  • PYO, DON-YOUNG;LIM, OCK-TAECK
    • Transactions of the Korean hydrogen and new energy society
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    • v.30 no.1
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    • pp.29-34
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    • 2019
  • Safety of hydrogen handling facilities is needed as supply of hydrogen cars has been expanded recently. In this study, the adequacy of safety regulations of hydrogen handling facilities and the risk of damage with hydrogen leakage were studied. The range of explosion hazard location of the hydrogen filling plant was investigated using the computational fluid dynamics (CFD) method, Explosive hazardous area is influenced by leakage type, hole size and sectional area. When the conditions of KS standard are applied, range explosive hazardous area is expanded 7.05 m, maximum. It is about 7 times larger than exceptional standard of hydrogen station. Meanwhile, distance from leakage point to 25% LEL of hydrogen is investigated 1.6 m. Considering the shape of charging hose, regulation of hydrogen station is appropriate.

Hole Filling Technique for Depth Map using Color Image Pixel Clustering (컬러 영상 화소 분류를 이용한 깊이 영상의 홀을 채우는 기법)

  • Lee, Geon-Won;Han, Jong-Ki
    • Proceedings of the Korean Society of Broadcast Engineers Conference
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    • 2020.07a
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    • pp.55-57
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    • 2020
  • 실감미디어의 수요가 높아짐에 따라, 실감 미디어 컨텐츠 제작에 반드시 필요한 깊이영상에 대한 중요성이 커지고 있다. 다시점 영상으로부터 계산된 깊이 영상은 물체 주위와 배경 영역에 홀을 가지고 있다. 이러한 깊이영상에서의 홀을 채울 때, 이에 대응하는 컬러영상의 색상 특성을 고려하는 방법을 제안한다. 본 논문에서는 컬러 영상의 화소들을 색상 유사성을 이용하여 클래스로 분류하고, 홀의 깊이정보를 예측할 때 같은 클래스의 유효한 깊이값 만을 사용하는 방법을 소개한다. 제안하는 방법을 사용하면 깊이영상의 홀을 효율적으로 채워 넣을 수 있다. 실감미디어 제작에 있어 제안하는 방법을 사용한다면, 사실감 있는 깊이 정보를 얻을 수 있다.

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Strength Characteristics of Improved Dredged Clay for Urgent Recovery of Ground Subsidence (함몰지반 긴급복구를 위한 개량준설점토의 강도 특성)

  • Oh, Sewook;Baek, Seungju;Bang, Seongtaek
    • Journal of the Korean GEO-environmental Society
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    • v.20 no.5
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    • pp.31-38
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    • 2019
  • Recently, there has been an increasing number of ground subsidence (sink-hole) in the downtown areas, and in such a case, it is important to minimize accidents and passages through prompt recovery. With respect to the present recovery method for ground subsidence, the methods of applying the back filling after excavating the ground subsidence or using the grouting injected materials to restore the ground are mostly used, but there has been few studies on materials used for recovering the ground subsidence. Therefore, in order to clarify the characteristics of back filling materials used in the ground subsidence, this study uses the environment-friendly hardening agent to improve the dredged clay, and then, the mixture ratio of hardening agent and mixture ratio of decomposed granite soil is changed to cure for 3, 7, 14 and 28 days to analyze the intensity characteristics of the unconfined compression, and it was compared with the unconfined compression intensity for the previously used cement, a hardening agent. In order to evaluate the characteristics of intensity on the back filling materials, the C.B.R test was carried out, and for the review on whether the back filling materials influence on corrosion of water and sewer pipes and others, the soil non-resistance test was carried out. As a result of the test, for the case of the recovery work of the ground subsidence that requires urgency, it is considered as prudent if the hardening agents of 12% are integrated to cure for 3 days or longer, and for not having the influence on the corrosion of the gas tube or water pipes, it is proposed to mix for 30% or more of the decomposed granite soil. Door model test were conducted To confirm the bearing capacity characteristics of the solidified layer.

View Synthesis Error Removal for Comfortable 3D Video Systems (편안한 3차원 비디오 시스템을 위한 영상 합성 오류 제거)

  • Lee, Cheon;Ho, Yo-Sung
    • Smart Media Journal
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    • v.1 no.3
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    • pp.36-42
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    • 2012
  • Recently, the smart applications, such as smart phone and smart TV, become a hot issue in IT consumer markets. In particular, the smart TV provides 3D video services, hence efficient coding methods for 3D video data are required. Three-dimensional (3D) video involves stereoscopic or multi-view images to provide depth experience through 3D display systems. Binocular cues are perceived by rendering proper viewpoint images obtained at slightly different view angles. Since the number of viewpoints of the multi-view video is limited, 3D display devices should generate arbitrary viewpoint images using available adjacent view images. In this paper, after we explain a view synthesis method briefly, we propose a new algorithm to compensate view synthesis errors around object boundaries. We describe a 3D warping technique exploiting the depth map for viewpoint shifting and a hole filling method using multi-view images. Then, we propose an algorithm to remove boundary noises that are generated due to mismatches of object edges in the color and depth images. The proposed method reduces annoying boundary noises near object edges by replacing erroneous textures with alternative textures from the other reference image. Using the proposed method, we can generate perceptually inproved images for 3D video systems.

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Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with $75{\mu}m$ Cu Via ($75{\mu}m$ Cu via가 형성된 3D 스택 패키지용 interconnection 공정 및 접합부의 전기적 특성)

  • Lee Kwang-Yong;Oh Teck-Su;Won Hye-Jin;Lee Jae-Ho;Oh Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.111-119
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    • 2005
  • Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

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Bending behavior of squared cutout nanobeams incorporating surface stress effects

  • Eltaher, Mohamed A;Abdelrahman, Alaa A.
    • Steel and Composite Structures
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    • v.36 no.2
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    • pp.143-161
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    • 2020
  • In nanosized structures as the surface area to the bulk volume ratio increases the classical continuum mechanics approaches fails to investigate the mechanical behavior of such structures. In perforated nanobeam structures, more decrease in the bulk volume is obtained due to perforation process thus nonclassical continuum approaches should be employed for reliable investigation of the mechanical behavior these structures. This article introduces an analytical methodology to investigate the size dependent, surface energy, and perforation impacts on the nonclassical bending behavior of regularly squared cutout nanobeam structures for the first time. To do this, geometrical model for both bulk and surface characteristics is developed for regularly squared perforated nanobeams. Based on the proposed geometrical model, the nonclassical Gurtin-Murdoch surface elasticity model is adopted and modified to incorporate the surface energy effects in perforated nanobeams. To investigate the effect of shear deformation associated with cutout process, both Euler-Bernoulli and Timoshenko beams theories are developed. Mathematical model for perforated nanobeam structure including surface energy effects are derived in comprehensive procedure and nonclassical boundary conditions are presented. Closed forms for the nonclassical bending and rotational displacements are derived for both theories considering all classical and nonclassical kinematics and kinetics boundary conditions. Additionally, both uniformly distributed and concentrated loads are considered. The developed methodology is verified and compared with the available results and an excellent agreement is noticed. Both classical and nonclassical bending profiles for both thin and thick perforated nanobeams are investigated. Numerical results are obtained to illustrate effects of beam filling ratio, the number of hole rows through the cross section, surface material characteristics, beam slenderness ratio as well as the boundary and loading conditions on the non-classical bending behavior of perforated nanobeams in the presence of surface effects. It is found that, the surface residual stress has more significant effect on the bending deflection compared with the corresponding effect of the surface elasticity, Es. The obtained results are supportive for the design, analysis and manufacturing of perforated nanobeams.

An Analysis of Screen Printing using Solder Paste (솔더 페이스트를 이용한 스크린 프린팅 공정 해석)

  • Seo, Won-Sang;Min, Byung-Wook;Kim, Jong-Ho;Lee, Nak-Kyu;Kim, Jong-Bong
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.1
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    • pp.47-53
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    • 2010
  • In this study, analyses on the stencil printing using solder paste were carried out. The key design parameters in the stencil printing process are printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of physical properties of solder paste such as viscosity, surface tension, and contact angle on the stencil printing process were investigated. The analyses were performed for simple geometry and boundary conditions. In the analysis, solder paste was pushed into a stencil hole by pressure instead of printer pad. Considering the geometry and computational efficiency, axisymmetric analyses were adopted. A commercial software (COMSOL), which is well known in the area of micro-fluids analysis, was used. From the results, it was shown that viscosity of solder paste had an effect on the filling speed, while surface tension and contact angle had an effect on the filling shape.