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An Analysis of Screen Printing using Solder Paste  

Seo, Won-Sang (Graduate School of NID Fusion Tech., Seoul National Univ. of Tech.)
Min, Byung-Wook (Graduate School of NID Fusion Tech., Seoul National Univ. of Tech.)
Kim, Jong-Ho (Dept. of Product Design and Manufac. Eng., Seoul National Univ. of Tech.)
Lee, Nak-Kyu (Dept. of Manufac. Convergence Tech., Korea Institute of Industrial Tech.)
Kim, Jong-Bong (Dept. of Automotive Eng., Seoul National Univ. of Tech.)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 47-53 More about this Journal
Abstract
In this study, analyses on the stencil printing using solder paste were carried out. The key design parameters in the stencil printing process are printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of physical properties of solder paste such as viscosity, surface tension, and contact angle on the stencil printing process were investigated. The analyses were performed for simple geometry and boundary conditions. In the analysis, solder paste was pushed into a stencil hole by pressure instead of printer pad. Considering the geometry and computational efficiency, axisymmetric analyses were adopted. A commercial software (COMSOL), which is well known in the area of micro-fluids analysis, was used. From the results, it was shown that viscosity of solder paste had an effect on the filling speed, while surface tension and contact angle had an effect on the filling shape.
Keywords
Solder paste; Screen printing; Viscosity; Contact angle; Surface tension;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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