• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.355-356
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• 2008

• 방사선산업학회지
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• 제8권3호
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• pp.147-153
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• 2014

This paper describes a large area CMOS image sensor module Implementation using the precision align inspection program. This work is needed because wafer cutting system does not always have high precision. The program check more than 8 point of sensor edges and align sensors with moving table. The size of a $2{\times}1$ butted CMOS image sensor module which except for the size of PCB is $170mm{\times}170mm$. And the pixel size is $55{\mu}m{\times}55{\mu}m$ and the number of pixels is $3,072{\times}3,072$. The gap between the two CMOS image sensor module was arranged in less than one pixel size.

• 한국정밀공학회지
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• 제21권7호
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• pp.124-129
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• 2004

Recently, the demand for the optical cable is rapidly growing because the number of internee user increases and high speed internet data transmission is required. But the present optical cable winding systems has some serious problems such as pile-up and collapse of cable usually near the flange of the bobbin in the process of the cable winding. To reduce the pile-up collapse in a cable winding systems, a new guiding system is developed for a high-speed self-align cable winding. First of all, the winding mechanism was analyzed and synchronization logics for the motions of winding, traversing, and the guiding were created. A prototype cable winding systems was manufactured to validate the new guiding system and the suggested logic. Experiment results showed that the winding system with the developed guiding system outperformed the system without the guiding system in reducing pile-up and collapse in the high-speed winding.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.108-112
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• 2023

Precision manufacturing technology is rapidly developing due to the extreme miniaturization of semiconductor processes to comply with Moore's Law. Accurate and precise alignment, which is one of the key elements of the semiconductor pre-process and post-process, is very important in the semiconductor process. The center detection of wafer align marks plays a key role in improving yield by reducing defects and research on accurate detection methods for this is necessary. Methods for accurate alignment using traditional image sensors can cause problems due to changes in image brightness and noise. To solve this problem, engineers must go directly into the line and perform maintenance work. This paper emphasizes that the development of AI technology can provide innovative solutions in the semiconductor process as high-resolution image and image processing technology also develops. This study proposes a new wafer center detection method through variable thresholding. And this study introduces a method for detecting the center that is less sensitive to the brightness of LEDs by utilizing a high-performance object detection model such as YOLOv8 without relying on existing algorithms. Through this, we aim to enable precise wafer focus detection using artificial intelligence.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.559-560
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• 2006

Fiber optic connector, ferrule, is a device to connect and align fiber optics cable on fiber-optic communication system. In general $ZrO_2$ ceramic ferrule is manufactured by grinding process because the demands precision is very high. For the precision grinding machining, it is very important that structure of co-axial ferrule grinding system is optimized. In this paper, Structural analysis was performed to analyze bed and frame structure of co-axial grinding machine. Deformation and modal analysis for natural frequency was performed using ANSYS design space program to analyze structural characteristics. New improved model of bed and frame structure was proposed based on initial basic model. Therefore, we estimated the structural characteristics precision co-axial grinding machining system.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.478-482
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• 2002

Recently, the demand for the optical cable is rapidly glowing because the number of internet user increases and high speed internet data transmission is required. To meet this demand, it is necessary to have a sufficient manufacturing capability for mass and high-quality production. But the present optical cable winding system has some serious problems such that the optical cable of radius (6 mm -40 mm) is often piled up and collapsed usually at the edge of the bobbin in the process of the cable winding. It is often necessary to have an additional operator in order to adjust the cable, which causes the productivity decrease. In order to improve a performance of cable winding system which deals with relatively thick cable( radius : 6 mm -40 mm ), we developed a new guiding system for a high-speed self-align cable winding. First of all, the winding mechanism was analyzed. Synchronization logics for the motions of winding, traversing, and the guiding were created and implemented by using the PLC and guiding system controller in a prototype cable winding system manufactured in the CILS( Computer Integrated Large scale System ) lab. An experimental verification was carried out to validate the logic. Results showed that the winding system with the developed guiding system outperformed in reducing pile-up and collapse in the high-speed winding(up to 300 mm/s) compared with the system without the guiding system.

• 한국생산제조학회지
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• 제20권6호
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• pp.756-760
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• 2011

This paper proposed an alignment stage driven by piezo actuators for alignment process of a contact-type lithography. Among contact-type lithography processes, an UV-curable nanoimprint process is an unique process to be able to align patterns on upper and lower layers. An alignment stage of the UV-curable nanoimprint process requires nano-level resolution as well as high stiffness to overcome friction force due to contact moving. In this paper, the alignment stage consists of a compliant mechanism using flexure hinges, piezo actuators for high force generation, and capacitive sensors for high-resolution measurement. The compliant mechanism is implemented by four prismatic-prismatic compliant chains for two degree-of-freedom translations. The compliant mechanism is composed of flexure hinges with high stiffness, and it is directly actuated by the piezo actuators which increases the stiffness of the mechanism, also. The performance of the ultra-precision stage is demonstrated by experiments.

• Journal of Mechanical Science and Technology
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• 제19권4호
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• pp.968-975
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• 2005

The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process, so this imposes high cost on manufacturing. In this paper, we have developed the in-situ auto-aligning precision meso-punching system to investigate the burr formation mechanism and ultimately minimize burr. Firstly, we introduced the punch-die contact sensing method to align the punch and the die at initial state prior to the punching process. Secondly, by using the low-price semi-con­ductor laser, burr formed on the edges is measured intermittently during the punching process. We could, finally, make burr on the sheet metal uniformized and minimized by controlling of the precision X - Y table, $1\;{\mu}m$ resolution, and measuring burr height by semiconductor laser. Experimental results show the validity of our system for pursuing the burr-free punched elements.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.631-632
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• 2006

The assembly of camera lens modules fur the mobile phone has not been automated so far. They are still assembled manually because of high precision of all parts and hard-to-recognize lens by vision camera. In addition, the very short life cycle of the camera phone lens requires flexible and intelligent automation. This study proposes a fast and accurate identification system of the parts by distributing the camera for 4 degree of freedom assembly robot system. Single or multi-cameras can be installed according to the part's image capture and processing mode. It has an agile structure which enables adaptation with the minimal job change. The framework is proposed and the experimental result is shown to prove the effectiveness.

• 한국정밀공학회지
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• 제18권11호
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• pp.138-147
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• 2001

Alignment systems are frequently used under various semiconductor manufacturing environment. Particularly in PDP(Plasma Display Panel) manufacturing process, the alignment system is applied to the combining and sealing processes of the upper and lower glass panels of PDP, where these processes are performed in the vacuum chamber of high vacuum and high temperature. In this paper, the XYΘ-alignment stage is developed to align PDP panels. Because of high vacuum and high temperature environment, the alignment chamber has been designed to isolate the inner part of the alignment chamber from the outer environment of high vacuum and high temperature, in which every part of the alignment stage is inserted. As it is difficult to attach feedback sensors to the alignment stage in the alignment chamber, the alignment stage is implemented with the open loop algorithm, where the parallel link structure has been designed using step-motors and ball-screws for structural simplicity. The kinematic analysis is performed to drive the parallel link structure, based on the experiments of actuation-compensation of the alignment stage. For the error compensation, the hyperpatch model has been used to model the errors. From the experiments, the positional accuracy of the alignment stage can be improved significantly.