• 제목/요약/키워드: High-$T_{c}$

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Sinter forging으로 제조한 Y-BA-Cu-O/Ag 고온 초전도 복합체의 미세조직과 특성 (A Study on the Microstructure and Properties of Y-BA-Cu-O/Ag composite High $T_{c}$ Superconductor prepared by Sinter-forging Process)

  • 박종현;김병철;송진태
    • 한국재료학회지
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    • 제4권1호
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    • pp.37-43
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    • 1994
  • Y-BA-Cu-O계 고온초전도체의 미세조직을 가공과 열처리로써 제어하여 조직의 배향화와 치밀화를 기하여 높은 임계전류밀도($J_c$)를 갖는 초전도체의 개발을 목적으로sinter forging법으로 Y-BA-Cu-O/Ag 고온초전도복합체를 제조하였다. sinter forging을 통하여 고온 초전도체의 미세조직의 texture화를 가져왔으며, 이 경우 (123)결정립의 C축 방위가 단일축의 압축방향으로 배향화 되었다. 한편, texture의 orientation facter는 고온일수록, 압력이 클수록 크고, 조직의 배향화도 뚜렷하였으며 그에 따라 $J_c$역시 증가하였다. 이러한 결과로 미루어 결정의 배향도는 $J_c$를 좌우하는 중요한 변수라고 사려되었다. 또한 sinter forging 시킨Y-MA-Cu-O/Ag 복합체의 on set온도는 sinter forging온도에 크게 의존치 않았으나, 고온일수록 off set 온도($T_c\;^{zero}$)가 다소 떨어졌다. 한편, 첨가된 Ag는 주고(123)결정입계에 존재하였으며, 이들이 (123)결정립간의 결합을 촉진시켜 임계전류밀도를 크게 향상시켰으며, Y-BA-Cu-O/Ag 복합체의 $J_c$는 2,000 A/$\textrm{cm}^2$ 이상이었다.

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온도변화에 따른 GaAs MESFET의 주파수 특성에 관한 연구 (A Study on Frequency Response of GaAs MESFET with different Temperatures)

  • 정태오;박지홍;안형근;한득영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.550-553
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    • 2001
  • In this study, unity current gain frequency f$\_$T/ of GaAs MESFET is predicted with different temperatures up to 400 $^{\circ}C$. Temperature dependence parameters of the device including intrinsic carrier concentration n$\_$i/ effective mass, depletion width are considered to be temperature dependent. Small signal parameters such as gate-source, gate dran capacitances C$\_$gs/ C$\_$gd/ are correlated with transconductance g$\_$m/ to predict the unity current gain frequency. The extrinsic capacitance which plays an important roles in high frequency region has been taken into consideration in evaluating total capacitance by using elliptic integral through the substrate. From the results, f$\_$T/ decreases as the temperature increases due to the increase of small signal capacitances and the mobility degradation. Finally the extrinsic elements of capacitances have been proved to be critical in deciding f$\_$T/ which are originated from the design rule of the device.

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Prediction of the Effective Concrete Strength for Column-Slab Connections

  • Lee, Joo-Ha;Lee, Seung-Hoon;Sohn, Yu-Shin;Yoon, Young-Soo
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2009년도 춘계 학술대회 제21권1호
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    • pp.577-578
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    • 2009
  • For cases where the column concrete strength exceeds 1.4 times the slab concrete strength, the KCI Code requires that either: puddled high-strength concrete(HSC) be used in the slab, or the use of vertical dowels and spirals through the joint, or the use of an effective concrete strength in the joint. This paper studies on the third strategy. A prediction model of the effective concrete strength for interior columns was proposed using an analogy of brick and mortar in brick masonry. The proposed prediction model is verified by comparison with experimental results and various design equations.

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플라스틱 IC 패키지의 습열 파괴 해석 (Hygrothermal Cracking Analysis of Plastic IC Package)

  • 이강용;양지혁
    • 한국정밀공학회지
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    • 제15권1호
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    • pp.51-59
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    • 1998
  • The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

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열하중하에 있는 IC 패키지의 점탄성 파괴해석 (Visco-Elastic Fracture Analysis of IC Package under Thermal Loading)

  • 이강용;양지혁
    • 한국정밀공학회지
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    • 제15권1호
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    • pp.43-50
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    • 1998
  • The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

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다공성 미디어를 충진한 혐기-호기 반응조를 이용한 하수고도처리에 관한 연구 (Advanced Wastewater Treatment Using Anoxic-Aerobic Reactor Filled with Porous Media)

  • 김동하
    • 상하수도학회지
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    • 제21권1호
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    • pp.83-89
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    • 2007
  • A biological anoxic-aerobic reactor filled with porous media was operated in lab scale for the advanced wastewater treatment. The experiments were conducted for 6 months with three HRTs (4, 6, 8hr) and temperature of $23{\sim}25^{\circ}C$. Some other experimental conditions were as follows; nitrification reactor (MLSS 4,500mg/L, DO 3.3mg/L, $23{\sim}28^{\circ}C$), denitrification reactor(MLSS 8,000mg/L, ORP -100mV, Temp.$19{\sim}23^{\circ}C$). Average removal efficiencies of SS, $BOD_5$, $COD_{Cr}$, T-N, and T-P were 97.8%, 95.5%, 94.5%, 80.2%, and 60.6%, respectively. The reactor filled with porosity media showed stable removal capacity for organics and nutrients. Fast and complete nitrification and denitrification were accomplished. Maintaining high MLSS with porous media in the nitrification and denitrification reactor appears to enhance the nitrogen removal process. For the higher T-P removal, some coagulant addition process will be needed.

지상파 DMB 수신용 SoC 설계 및 구현 (Design and Implementation of the SoC for Terrestrial DMB Receiver)

  • 구본태;이주현;최민석;이석호;김진규;김성민;박기혁;김덕환;권영수;엄낙웅
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.669-670
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    • 2006
  • This paper describes the functions and design technology of the T-DMB (Terrestrial Digital Multimedia Broadcasting) receiver. T-DMB is a novel broadcasting media that can provide high-quality video and audio services. In this paper, we will describe the VLSI implementation of RF, Baseband and Multimedia Chip for T-DMB Receiver. The designed DMB SoC has low power consumption and has been implemented using a standard-cell library in 0.18um CMOS technology.

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공동주택 전용 갱폼 자동 인양 시스템 개발 (Development of Automated Gangform Climbing System for Apartment Housing)

  • 이정호;김순영
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2019년도 추계 학술논문 발표대회
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    • pp.114-115
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    • 2019
  • Gangform is used as exterior wall forms in the most of apartments. Existing system forms developed for high-rise building, RCS and ACS, are too heavy and over-designed to be applied to general apartments, leading to higher costs. A more simplified rail Gangform(R/GF) is also used, but it depends entirely on T/C for the lift like Gangform. The T/C's legal inactivity time for moving Gangform and materials has increased, and the higher allowances have to be paid for overtime work, thus causing to the cost increase and time delay. Therefore, this study aims to develop an automated Gangform climbing system that can be used universally and economically in apartment houses. The use of the development system is expected to improve the safety of Gangform operations and reduce the workload on T/C.

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Optimization of Luffing-Tower Crane Location in Tall Building Construction

  • Lee, Dongmin;Lim, Hyunsu;Cho, Hunhee;Kang, Kyung-In
    • 국제학술발표논문집
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    • The 6th International Conference on Construction Engineering and Project Management
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    • pp.420-424
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    • 2015
  • The luffing-tower crane (T/C) is a key facility used in the vertical and horizontal transportation of materials in a tall building construction. Locating the crane in an optimal position is an essential task in the initial stages of construction planning. This paper proposes a new optimization model to locate the luffing T/C in the optimal position to minimize the transportation time. An optimization algorithm, the Harmony Search (HS) algorithm, was used and the results show that HS has high performance characteristics to solve the optimization problem in a short period of time. In a case study, the proposed model offered a better position for T/C than the previous heuristic approach.

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연화 제1광산에서의 유비철석의 산상과 배태 조건 (Mode of Occurrences and Depositional Conditions of Arsenopyrite from the Yeonhwa 1 Mine, Korea)

  • Lee, Young-Up;Chung, Jae-Il
    • 한국광물학회지
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    • 제16권1호
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    • pp.1-17
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    • 2003
  • 유비철석 + 황철석 + 육방정계 자류철석으로 구성되는“삼종동시접촉”을 수반하는 유비철석의 화학조성은 광화작용의 II단계에서 유용한 지온계를 제공한다. 연구에 따르면 이 지온계는 황분압 f($S_2$)=$10^{-9.5}$ 기압하에서, 지온 T = $330^{\circ}C$에서 형성된 것으로 밝혀졌다. 황철석 -육방정계 자류철석 완충곡선에서는 이 두 변수가 T= $315∼345^{\circ}C$와 f( $S_2$)=$10^{-1}$0.5/∼$10^{-9}$ 기압에 해당됨을 보여 준다. 이지역에서 산출되는 안티모니를 포함하는 자류철석(Ic)는 무게 퍼센트가 4.95∼8.91에 달하는 상대적인 높은 간을 보이며, 철은 과다한 반면 양이온은 결핍되는 현상을 보인다. 자류철석에서 이러한 높은 안티모니 함량은 단일 입자내에서는 처음 알려진 것이다. 이러한 높은 안티모니 함량이 자류철석 Ic를 지온계로서 작용할 수 없게 만들었다. 광화작용 III단계에서의 4쌍의 자류철석과 섬아연석의 전자현미분석 결과는 T : $310∼340^{\circ}C$와 f(S2)=$10^{ }$$∼10^{-9}$ / atm을 보이며, 이 값은 Fe-As-S 계에서 추정된 값과 일치한다...