• Korean Journal of Materials Research
• /
• v.4 no.1
• /
• pp.37-43
• /
• 1994

Y-Ra-Cu-0 oxide superconductors were fabricated by the sinter-forging method to make the critical current density improve through controlling of microstructure and crystal texture. The grain alignment of oxide superconductor was formed by the sinter-forging process and it's c-axis orientation was parallel to the press direction.The orientation factor of texture increased with sinking temperature and pressure, and also grain alignment was improved by the addition of Ag. As for the sinterforged Y-Ba-Cu-O/Ag sample, the $T_c$(on-set) was not almost varied with the sinter-forging temperature, but $T_c\;^{zero}$ decreased more or less at high sinter-forging temperatures. In addition, it was observed that added-Ag was mainly distributed along the grain boundar~es in the (123) matrix, resulting in the densification of microstructure. From these results, i t was thought that the improvement of $J_c$ over 2000A/$\textrm{cm}^2$ was attributed to the texture, densification of microstructure, and (123) grain growth due to the Ag addition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.550-553
• /
• 2001

In this study, unity current gain frequency f$\_$T/ of GaAs MESFET is predicted with different temperatures up to 400 $^{\circ}C$. Temperature dependence parameters of the device including intrinsic carrier concentration n$\_$i/ effective mass, depletion width are considered to be temperature dependent. Small signal parameters such as gate-source, gate dran capacitances C$\_$gs/ C$\_$gd/ are correlated with transconductance g$\_$m/ to predict the unity current gain frequency. The extrinsic capacitance which plays an important roles in high frequency region has been taken into consideration in evaluating total capacitance by using elliptic integral through the substrate. From the results, f$\_$T/ decreases as the temperature increases due to the increase of small signal capacitances and the mobility degradation. Finally the extrinsic elements of capacitances have been proved to be critical in deciding f$\_$T/ which are originated from the design rule of the device.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2009.05a
• /
• pp.577-578
• /
• 2009

For cases where the column concrete strength exceeds 1.4 times the slab concrete strength, the KCI Code requires that either: puddled high-strength concrete(HSC) be used in the slab, or the use of vertical dowels and spirals through the joint, or the use of an effective concrete strength in the joint. This paper studies on the third strategy. A prediction model of the effective concrete strength for interior columns was proposed using an analogy of brick and mortar in brick masonry. The proposed prediction model is verified by comparison with experimental results and various design equations.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.1
• /
• pp.51-59
• /
• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.1
• /
• pp.43-50
• /
• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Journal of Korean Society of Water and Wastewater
• /
• v.21 no.1
• /
• pp.83-89
• /
• 2007

A biological anoxic-aerobic reactor filled with porous media was operated in lab scale for the advanced wastewater treatment. The experiments were conducted for 6 months with three HRTs (4, 6, 8hr) and temperature of $23{\sim}25^{\circ}C$. Some other experimental conditions were as follows; nitrification reactor (MLSS 4,500mg/L, DO 3.3mg/L, $23{\sim}28^{\circ}C$), denitrification reactor(MLSS 8,000mg/L, ORP -100mV, Temp.$19{\sim}23^{\circ}C$). Average removal efficiencies of SS, $BOD_5$, $COD_{Cr}$, T-N, and T-P were 97.8%, 95.5%, 94.5%, 80.2%, and 60.6%, respectively. The reactor filled with porosity media showed stable removal capacity for organics and nutrients. Fast and complete nitrification and denitrification were accomplished. Maintaining high MLSS with porous media in the nitrification and denitrification reactor appears to enhance the nitrogen removal process. For the higher T-P removal, some coagulant addition process will be needed.

• Proceedings of the IEEK Conference
• /
• 2006.06a
• /
• pp.669-670
• /
• 2006

This paper describes the functions and design technology of the T-DMB (Terrestrial Digital Multimedia Broadcasting) receiver. T-DMB is a novel broadcasting media that can provide high-quality video and audio services. In this paper, we will describe the VLSI implementation of RF, Baseband and Multimedia Chip for T-DMB Receiver. The designed DMB SoC has low power consumption and has been implemented using a standard-cell library in 0.18um CMOS technology.

• Proceedings of the Korean Institute of Building Construction Conference
• /
• 2019.11a
• /
• pp.114-115
• /
• 2019

Gangform is used as exterior wall forms in the most of apartments. Existing system forms developed for high-rise building, RCS and ACS, are too heavy and over-designed to be applied to general apartments, leading to higher costs. A more simplified rail Gangform(R/GF) is also used, but it depends entirely on T/C for the lift like Gangform. The T/C's legal inactivity time for moving Gangform and materials has increased, and the higher allowances have to be paid for overtime work, thus causing to the cost increase and time delay. Therefore, this study aims to develop an automated Gangform climbing system that can be used universally and economically in apartment houses. The use of the development system is expected to improve the safety of Gangform operations and reduce the workload on T/C.

• International conference on construction engineering and project management
• /
• 2015.10a
• /
• pp.420-424
• /
• 2015

The luffing-tower crane (T/C) is a key facility used in the vertical and horizontal transportation of materials in a tall building construction. Locating the crane in an optimal position is an essential task in the initial stages of construction planning. This paper proposes a new optimization model to locate the luffing T/C in the optimal position to minimize the transportation time. An optimization algorithm, the Harmony Search (HS) algorithm, was used and the results show that HS has high performance characteristics to solve the optimization problem in a short period of time. In a case study, the proposed model offered a better position for T/C than the previous heuristic approach.

• Journal of the Mineralogical Society of Korea
• /
• v.16 no.1
• /
• pp.1-17
• /
• 2003

The chemical composition of the arsenopyrite Ib adjoining“triple mutual contact”arsenopyrite + pyrite + hexagonal pyrrhotite may serve as a useful geothermometer in Stage II. In this study it corresponds to temperature T=33$0^{\circ}C$ and f( $S_2$)=10$^{-9.5}$ atm. And the pyrite-hexagonal pyrrhotite buffer curve indicates the probable range of the two variables; T= 315∼345$^{\circ}C$, and f( $S_2$)=10$^{-1}$0.5/∼10$^{-9}$ atm. The present antimony-bearing arsenopyrite (arsenopyrite Ic) is characterized by relatively high content of antimony, ranging from 4.95 to 8.91 percent Sb by weight and excess of iron and deficiency of anions are evident. Such a high antimonian arsenopyrite has never been known within single grain. But being the high content of antimony as in the arsenopyrite Ic, it does not serve as a geothermometer. The results of microprobe analyses for four pairs of asenopyrite and sphalerite in Stage III indicate the temperature range from 310 to 34$0^{\circ}C$, and sulphur fugacity range from 10$^{-10}$ ∼10$^{-9}$ atm. These values seem to correspond with those inferred from the Fe-As-S system.m..