• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.163-163
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• 2010

기존 LED의 접합온도 및 열저항은 PKG 단계에서 측정 가능 하였다. PKG에서의 접합온도 측정방식과 같은 방법으로 C사의 1W High Power LED XP2 20개를 직렬 연결하여 모듈을 구성한 20W 가로등 모듈에 대하여 접합온도를 측정 하였다. 측정결과 20W 가로등 모듈의 접합온도는 약 $61^{\circ}C$로 나타났다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.274-277
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• 1996

This paper describes the realization of the full-color to the degree of nearest white light by compounding high brightness Red, Green and Blue LEDs with appropriate proportional index. Once these three colors; red, green and blue are mixed, they are genearlly additive mixing and produce white light color contrasted to negative mixing. The luminous efficiency is defined as the product of the efficiency(lm/w), which indicates the degree of perceptual response by the human eye to unit energy(W) of light emitted by an active display devises and as the conversion efficiency of the device from electric power consumed to optical energy produced. We will deduce the each number of LEDs theoretically and design several shapes of LED displays for the full-color. Finally theoretical predictions will be compared with the measured data with different type of display designs.

• Proceedings of the KIPE Conference
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• 2013.07a
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• pp.415-416
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• 2013

본 논문은 LED구동회로 동작 시 전류와 광 출력의 변동폭을 최소화를 요구하는 LED 조명광원의 특성을 고려하여 소프트 스위칭을 할 수 있는 2차 공진 제안 회로로서 일반 인덕터의 정현적 전류와 콘덴서의 정현적 전압에 의해 이루어지는 특성을 반영하여 1차 공진회로에서 전압을 잡고 부하에 직렬로 인덕터를 삽입하는 회로를 구성함으로써 2차 공진회로를 구성할 수 있다. 따라서 본 논문에서 제안된 공진회로는 PISM을 이용한 시뮬레이션과 실험을 통해 제안된 알고리즘의 타당성과 우수성을 검증하였다.

• Proceedings of the KIPE Conference
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• 2007.07a
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• pp.244-246
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• 2007

The LCD backlight technique using light-emitting diode(LED) has been studied in the recent backlight market. The white light is need for LCD backlight and it is generally implemented by combining the RGB-LEDs to obtain the high brightness. However, RGB-LEDs have different color characteristics for the current and temperature variations, which results in the color shift problem. The color shift characteristics of RGB-LEDs for the current and temperature variations are investigated in this paper. This result can be used to control the color of backlight system using RGB-LEDs.

• Proceedings of the KIPE Conference
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• 2012.07a
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• pp.246-247
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• 2012

역률개선용 AC/DC Flyback 컨버터의 경우 우수한 역률을 획득할 수 있으나 코어손실이 크고 효율이 낮으며 반면 Forward 컨버터의 경우 코어손실이 작아 높은 효율을 획득할 수 있으나 Dead zone이 존재하여 고역률 획득이 어려운 단점을 갖는다. 따라서 본 논문에서는 Forward 컨버터와 Flyback 컨버터의 장점을 동시에 구현할 수 있는 고효율 및 고역률 Balanced forward-flyback 컨버터를 제안한다. 제안된 컨버터는 스위치 온 시 Forward 컨버터로 동작하며 스위치 오프 시 트랜스포머 자화인덕터 리셋을 위해 Flyback 컨버터로 동작하므로 고역률 및 고효율 획득이 가능하며 Forward 및 Flyback 컨버터가 다루는 에너지량이 전류평형 캐패시터에 의해 항상 절반씩 배분되므로 AC입력전압의 크기에 관계없이 항상 고효율 획득이 가능하다. 제안된 회로의 타당성 검증을 위해 이론적 분석결과와 24W급 LED 조명 회로에 적용한 실험결과를 제시한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.1
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• pp.44-49
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• 2021

Recently, infrared (IR) and near-infrared (NIR) light-emitting diodes (LEDs) were widely used for home medical applications owing to its low output power and wide exposed area for curing. For deep penetration of the light under the skin, multiple LEDs with wavelengths of 700~10,000 nm were located on a flexible printed circuit board. When multiple wavelengths of LEDs were soldered on a circuit board, the lifetime of LED module highly depends on LEDs with a short lifetime. The mean time to failure (MTTF) was able to calculate with the experimental results under high temperature and the Arrhenius model. The results of this study could help companies to approve the warranty of LED modules and its product.

• Proceedings of the KIEE Conference
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• 1988.11a
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• pp.224-228
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• 1988

Extensive development work which was carried out by Gold Star Cable Co., Ltd. has led to the optimal design, manufacture and test of fully engineered cable system for 345 kV self- contained oil filled (OF) underground cable. Details of design criteria and of tests are given. development of 345kV OF cable results in sucessful operations for ultra-high voltage power transmission requirement.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.115-116
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• 2012

The demand for flexible electronic systems such as wearable computers, E-paper, and flexible displays has increased due to their advantages of excellent portability, conformal contact with curved surfaces, light weight, and human friendly interfaces over present rigid electronic systems. This seminar introduces three recent progresses that can extend the application of high performance flexible inorganic electronics. The first part of this seminar will introduce a RRAM with a one transistor-one memristor (1T-1M) arrays on flexible substrates. Flexible memory is an essential part of electronics for data processing, storage, and radio frequency (RF) communication and thus a key element to realize such flexible electronic systems. Although several emerging memory technologies, including resistive switching memory, have been proposed, the cell-to-cell interference issue has to be overcome for flexible and high performance nonvolatile memory applications. The cell-to-cell interference between neighbouring memory cells occurs due to leakage current paths through adjacent low resistance state cells and induces not only unnecessary power consumption but also a misreading problem, a fatal obstacle in memory operation. To fabricate a fully functional flexible memory and prevent these unwanted effects, we integrated high performance flexible single crystal silicon transistors with an amorphous titanium oxide (a-TiO2) based memristor to control the logic state of memory. The $8{\times}8$ NOR type 1T-1M RRAM demonstrated the first random access memory operation on flexible substrates by controlling each memory unit cell independently. The second part of the seminar will discuss the flexible GaN LED on LCP substrates for implantable biosensor. Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness compared to conventional incandescent lamps and OLED. However, due to the brittle property of bulk inorganic semiconductor materials, III-V LED limits its applications in the field of high performance flexible electronics. This seminar introduces the first flexible and implantable GaN LED on plastic substrates that is transferred from bulk GaN on Si substrates. The superb properties of the flexible GaN thin film in terms of its wide band gap and high efficiency enable the dramatic extension of not only consumer electronic applications but also the biosensing scale. The flexible white LEDs are demonstrated for the feasibility of using a white light source for future flexible BLU devices. Finally a water-resist and a biocompatible PTFE-coated flexible LED biosensor can detect PSA at a detection limit of 1 ng/mL. These results show that the nitride-based flexible LED can be used as the future flexible display technology and a type of implantable LED biosensor for a therapy tool. The final part of this seminar will introduce a highly efficient and printable BaTiO3 thin film nanogenerator on plastic substrates. Energy harvesting technologies converting external biomechanical energy sources (such as heart beat, blood flow, muscle stretching and animal movements) into electrical energy is recently a highly demanding issue in the materials science community. Herein, we describe procedure suitable for generating and printing a lead-free microstructured BaTiO3 thin film nanogenerator on plastic substrates to overcome limitations appeared in conventional flexible ferroelectric devices. Flexible BaTiO3 thin film nanogenerator was fabricated and the piezoelectric properties and mechanically stability of ferroelectric devices were characterized. From the results, we demonstrate the highly efficient and stable performance of BaTiO3 thin film nanogenerator.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.303-304
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• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.

• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.13-19
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• 2012

Thermal performance of an impinging cooling module for 150 W class high power LEDs have been investigated numerically and experimentally. Parametric studies were performed to compare the effect of several design parameters such as nozzle number, nozzle spacing, coolant flow rate, and impinging distance. The experiments were also carried out in order to validate the numerical results and the comparison between the experimental and numerical results showed good agreement. It is found that the overall thermal resistance of impinging cooling module strongly depends on the nozzle number, nozzle spacing, flow rate, and impinging distance. This results showed the optimized operating condition when number of nozzles is 25, nozzles spacing is 4mm, flow rate is 2.70 lpm, distance between nozzles and impinging surface is 2 mm.