• Journal of the Korean Society of Industry Convergence
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• v.25 no.6_3
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• pp.1239-1246
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• 2022

This paper introduces the effect of grease on the degradation characteristics of bearings used as key components of packaging equipment and automation systems. Bearings parts are installed to fix and support the rotating body of the system, and performance degradation of the bearings has a great effect on the life of the system too. When bearings are used in various devices and systems, the grease is applied to reduce friction and improve fatigue life. Determining the type of lubricant (grease) is important because it has a great influence on the operating environment and lifespan and ensures long lifespan of systems and facilities. However, studies that simultaneously compared and analyzed the change in mechanical degradation characteristics and the comparison of chemical degradation characteristics according to grease types under actual operating conditions are insufficient. In this paper, three types of small harmonic drive, high-load reducer, and low-load reducer grease used in power transmission joint modules are experimentally selected and finally injected into ball bearings with a load (19,500N) to improve bearing durability. Degradation characteristics were tested by attaching to test equipment. At this time, after the durability test under the same load conditions, the mechanical degradation characteristics, that is temperature, vibration according to the three greases types. In addition, the chemical degradation characteristics of the corresponding grease was compared to present the results of mutual correlation analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.4
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• pp.447-451
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• 2015

The objective of this study is to predict the structural characteristics of a heat exchanger mounted on an aircraft engine using finite element analysis. The plastic fracture and life of the heat exchanger were estimated by a thermo-mechanical analysis. Tensile tests were conducted under high temperature conditions (700, 800, 900, 1000 K) using five specimens to obtain the mechanical properties of the Inconel 625 tubes. To assess the structural characteristics of the heat exchanger, the full and partial models were applied under the operating conditions given by the thermo-mechanical and inertial load. As a result, the case, tubesheet, flange, and mounting components have a reasonable safety margin to the allowable stress assuming a fatigue strength of Inconel 625 of 10000 cycles under 1000 K.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.1
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• pp.71-81
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• 2009

Die steel for plastic molding were used as mold material of automobile parts and electronic component industry. The material of this paper has superior to mechanical properties, such as repair weldability, corrosion resistance and high temperature strength, required mold parts for semitransparent. Laser-induced surface hardening technology is widely adopted to improver fatigue life and wear resistance via localized hardening at the surface of mold parts. The objective of this research work is to investigate on the characteristics of surface hardening of the laser process parameters, such as beam travel speed, laser power and defocsued spot position, for the case of die steel for plastic molding. Lens for surface hardening of large area is plano-convex type with elliptical profile to maintain uniform laser irradiation. According to the experimental results, large size of hardened layer at the surface of die steel for plastic molding was achieved, and microstructure of this layer was lath martensite. Optimal surface status and mechanical property of hardened layer could be obtained at 1095Watt, $0.25{\sim}0.3m/min$, 0mm (focal length: 232mm) for laser power, beam travel speed, and focal position. Where, heat input was $0.793{\times}10^{3}J/cm^2$, and width of hardened layer was 27.58mm.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Journal of agricultural medicine and community health
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• v.28 no.2
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• pp.15-29
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• 2003

Objectives: This study was done to find out fatigue and self-reported physical symptoms of Vinylhouse farmers. The results of this study could be used as a basic data to develop health promotion program for Vinylhouse farmers who are suffering from fatigue and physical symptoms. Methods: The 166 respondents, who were working in Vinylhouse and were living in a remoted area where the primary health post located, were participated in this study. Thirty: 30 items of self-reported fatigue scale was used to evaluate the farmers fatigue level which made by Japanese industrial and hygenic association(1988). Twenty four: 24 items of index used by researcher for self-reported physical symptoms was from Lee In Bae's(1999) modified Index which was originated from Cornell Medical Index(1949). Another questionnaires used in this study were developed by researcher through related documents. Results: The results of this study were as follows; Fatigue scores were high in accordance with women(t=-2.212, p<0.05), worse recognized health state(F=20.610, p<.001), lack of sleeping hours(F=3.937, p<0.05), eat irregularly(t=-3.883, p<0.001), don't take a bath after application of chemical(t=-2.950, p<0.01), working time per a day(F=5.633, p<0.01) & working time per a day in Vinylhouse(F=5.247, p<0.01) were long. Subjective physical symptoms were high in accordance with women(t=-3.176, p<0.01), worse recognized health state(F=35.335, p<0.001), and low education(F=3.467, p<0.05). eat irregularly(t=-3.384, p<0.01), alcohol drinking(t=-2.389, p<0.05). When farmers don't take a bath after application of chemical show high(t=-3.188, p<0.01). As a result, the factors affecting to Vinylhouse worker's health were irregular diet habit, scarce exercise, lack of proper rest, symptoms oriented from Vinylhouse work in contaminated environment with high temperature and humidity. Conclusions: Based on this study, health promotion program is necessary for Vinylhouse workers. Also, the development of continuously practical strategy of healthy life style including exercise and comprehensive health promotion program considered the country's social and cultural background are needed.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.