• Sleep Medicine and Psychophysiology
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• v.21 no.2
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• pp.69-73
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• 2014

Objectives: This study was designed to assess the change of heart rate variability (HRV) at resting, upright, and psychological stress in anxiety disorder patients. Methods: HRV was measured at resting, upright, and psychological stress states in 60 anxiety disorder patients. We used visual analogue scale (VAS) score to assess tension and stress severity. Beck depression inventory (BDI) and state trait anxiety inventories I and II (STAI-I and II) were used to assess depression and anxiety severity. Differences between HRV indices were evaluated using paired t-tests. Gender difference analysis was accomplished with ANCOVA. Results: SDNN (Standard deviation of normal RR intervals) and low frequency/high frequency (LF/HF) were significantly increased, while NN50, pNN50, and normalized HF (nHF) were significantly decreased in the upright position compared to resting state (p < 0.01). SDNN, root mean square of the differences of successive normal to normal intervals, and LF/HF were significantly increased, while nHF was significantly decreased in the psychological stress state compared to resting state (p < 0.01). SDNN, NN50, pNN50 were significantly lower in upright position compared to psychological stress and nVLF, nLF, nHF, and LF/HF showed no significant differences between them. Conclusion: The LF/HF ratio was significantly increased after both physical and psychological stress in anxiety disorder, but did not show a significant difference between these two stresses. Significant differences of SDNN, NN50, and pNN50 without any differences of nVLF, nLF, nHF, and LF/HF between two stresses might suggest that frequency domain analysis is more specific than time domain analysis.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.285-285
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.103-103
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• 2002

• Korean Journal of Materials Research
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• v.6 no.1
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• pp.124-129
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• 1996

TiN 기판상에 CVD와 무전해 도금을 이용하여 구리막을 성장시킬 때 여러 가지 전처리에 따른 증착 양상의 변화에 관하여 조사하였다. Cu(hfac)2를 선재(precursor)로 사용하여 CVD 증착을 실시할 때 각 전처리에 따른 TiN상의 구리막의 덮힘성(coverage)향상은 Pd-HF 활성화 처리>>HF dip> RF remote plasma의 순이었다. 특히 Pd-HF 활성화 처리를 해줄 경우 거의 완전한 연속막을 얻을수 있었으며 scotch tape peel test 결과 매우 양호한 부착특성을 보였으나, 이에 비해 전처리를 해주지 않은 경우에는 오랜 시간이 경과되어도 연속막으로 성장하지 못하고 섬모양의 큰 결정립을 이룰 뿐이었다. 이러한 차이는 Pd-HF 활성화 처리에 의해 표면에 미세하게 형성된 Pd층이 구리의 핵생성과 부착특성을 크게 향상시켰기 때문인 것으로 사료되며 이러한 효과는 무전해 도금의 경우에도 마찬가지였다. 그리고 기판과 증착온도에 따른 선택성을 보면 35$0^{\circ}C$이하에서는 pd-HF 활성화 처리에 의해서 SiO2에 대하여 TiN으로의 선택성을 가지나 그 이상의 온도에서는 선택성이 상실되었다.

• Journal of the Korean institute of surface engineering
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• v.44 no.6
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• pp.255-259
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• 2011

The thickness dependence of magnetic properties was experimentally investigated in nanocrystalline Fe-Hf-N thin films fabricated by a RF magnetron sputtering method. In order to investigate the thickness effect on their magnetic properties, the films are prepared with different thickness ranges from 90 nm to 330 nm. It was revealed that the coercivity of the thin film increased with film thickness. On the contrary, the saturation magnetization decreased with film thickness. On the basis of the SEM and TEM, an amorphous phase forms during initial growth stage and it changes to crystalline structure after heat treatment at $550^{\circ}C$. Nanocrystalline Fe-Hf-N particles are also generated.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.641-644
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• 1995

We have studied the effect of the nitrogen on the microstructure, thermomagnetic properties and corrosion resistance of Fe-Hf-C-N nanocrystalline thin films with high permeability and high saturation magnetization. These films were fabricated by reactive sputtering in $Ar+N_{2}$ plasma using an rf magnetron sputtering apparatus. As $P_{N2}$ increases, the microstructure changes from amorphous to crystalline $\alpha$-Fe phase and again returns to amorphous one. Spin wave stiffness constant increases with $P_{N2}$ until 5% $P_{N2}$, and then decreases with the further increase. This trend corresponds well with that of the microstructure with increasing $P_{N2}$. The Fe-Hf-C-N films with over 3% $P_{N2}$ show higher corrosion resistance than the N-free Fe-Hf-C films. The Fe-Hf-C-N films are considered to have high potentials for the head core materials suitable for high density recording systems, owing to their excellent soft magnetic properties and corrosion resistance.

• Journal of the Korean Society of Food Science and Nutrition
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• v.17 no.1
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• pp.13-17
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• 1988

$HF_1$(1H KOH soluble hemicellulose fraction), $HF_2$(2H KOH soluble hemicellulose fraction) $HF_3$(3H KOH soluble hemicellulose fraction) and $HF_4$(4H KOH soluble hemicellulose fraction) were fractionated from Fuji crude cell wall and purified using Sephacryl S-500 to determine the effects of these hemicellulosic fractions on the Ca- pectate gel formation. By increasing of KOH concentration, from 1 to 4N, hexose peas became higher in led, and molecula weights, especially pentose peaks in high molecular weight. Hemicellulose fractions using gel filtration were composed of $8{\sim}10$ peaks which were $10^4{\sim}143{\times}10^4$ molecular weight. Higher values of hardness, adhesiveness and gumminess were found in low molecular weight than in high molecular weight, also in hexose and uronic acid contained than in hexose contained.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.29-35
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• 2004

Hafnium-oxide gate dielectric films deposited by a metal organic chemical vapor deposition technique on a $N_2-plasma$ treated SiNx and a hydrogen-terminated Si substrate have been investigated. In the case of $HfO_2$ film deposited on a hydrogen-terminated Si substrate, suppressed crystallization with effective carbon impurity reduction was obtained at $450^{\circ}C$. X-ray photoelectron spectroscopy indicated that the interface layer was Hf-silicate rather than phase separated Hf-silicide and silicon oxide structure. Capacitance-voltage measurements show equivalent oxide thickness of about 2.6nm for a 5.0 nm $HfO_2/Si$ single layer capacitor and of about 2.7 nm for a 5.7 nm $HfO_2/SiNx/Si$ stack capacitor. TEM shows that the interface of the stack capacitor is stable up to $900^{\circ}C$ for 30 sec.

• Korean Journal of Materials Research
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• v.29 no.8
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• pp.463-468
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• 2019

The electrical and interfacial properties of $HfO_2/Al_2O_3$ and $Al_2O_3/HfO_2$ dielectrics on AlN/p-Ge interface prepared by thermal atomic layer deposition are investigated by capacitance-voltage(C-V) and current-voltage(I-V) measurements. In the C-V measurements, humps related to mid-gap states are observed when the ac frequency is below 100 kHz, revealing lower mid-gap states for the $HfO_2/Al_2O_3$ sample. Higher frequency dispersion in the inversion region is observed for the $Al_2O_3/HfO_2$ sample, indicating the presence of slow interface states A higher interface trap density calculated from the high-low frequency method is observed for the $Al_2O_3/HfO_2$ sample. The parallel conductance method, applied to the accumulation region, shows border traps at 0.3~0.32 eV for the $Al_2O_3/HfO_2$ sample, which are not observed for the $Al_2O_3/HfO_2$ sample. I-V measurements show a reduction of leakage current of about three orders of magnitude for the $HfO_2/Al_2O_3$ sample. Using the Fowler-Nordheim emission, the barrier height is calculated and found to be about 1.08 eV for the $HfO_2/Al_2O_3$ sample. Based on these results, it is suggested that $HfO_2/Al_2O_3$ is a better dielectric stack than $Al_2O_3/HfO_2$ on AlN/p-Ge interface.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.409-413
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• 2010

We fabricated 10 nm-thick cobalt silicide($CoSi_2$) as a buffer layer on a p-type Si(100) substrate to investigate the possibility of GaN epitaxial growth on $CoSi_2/Si(100)$ substrates. We deposited 500 nm-GaN on the cobalt silicide buffer layer at low temperature with a PA-MBE (plasma assisted-molecular beam epitaxy) after the $CoSi_2/Si$ substrates were cleaned by HF solution. An optical microscopy, AFM, TEM, and HR-XRD (high resolution X-ray diffractometer) were employed to determine the GaN epitaxy. For the GaN samples without HF cleaning, they showed no GaN epitaxial growth. For the GaN samples with HF cleaning, they showed $4\;{\mu}m$-thick GaN epitaxial growth due to surface etching of the silicide layers. Through XRD $\omega$-scan of GaN <0002> direction, we confirmed the cyrstallinity of GaN epitaxy is $2.7^{\circ}$ which is comparable with that of sapphire substrate. Our result implied that $CoSi_2/Si(100)$ substrate would be a good buffer and substrate for GaN epitaxial growth.