• 제목/요약/키워드: Heating apparatus

검색결과 170건 처리시간 0.023초

조립과 확장이 가능한 반도체 제조용 기판 가열 장치 (An Assemble and Expandable Substrate Heating Apparatus for the Semiconductor Manufacturing)

  • 정순원;구경완
    • 전기학회논문지P
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    • 제58권1호
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    • pp.67-71
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    • 2009
  • This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.

직접 가열 방식을 이용한 반도체 제조용 히팅 장치 (A Heating Apparatus for Semiconductor Manufacturing using Direct Heating Method)

  • 정순원;구경완
    • 전기학회논문지P
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    • 제57권4호
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    • pp.408-411
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    • 2008
  • As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.

강판의 곡가공 자동화를 위한 수치제어 시스템의 개발 (Development of Numerical Control System for Plate forming Automation)

  • 이주성
    • 한국해양공학회지
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    • 제17권1호
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    • pp.72-79
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    • 2003
  • This paper deals with the development of an interface program for automatic plate forming, which can exchange information between the heating line information generation program and the automatic heating apparatus. In this paper, the performance of the developed interface program has been verified from the view point of numerical position control. By applying the interface program to the operation of the automatic heating apparatus, an experiment of line heating has been conducted for several steel plate models. Based on the experimental results, a simplified relation to estimate angular distortion has keen derived as a natural characteristic of the present automatic heating apparatus. As a result of the present study, the prototype of the automatic plate forming system has been constructed, and its application to the real surface models found in the ship will be presented in the near future.

Development of a PLD heater for continuous deposition and growth of superconducting layer

  • Jeongtae Kim;Insung Park;Gwantae Kim;Taekyu Kim;Hongsoo Ha
    • 한국초전도ㆍ저온공학회논문지
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    • 제25권2호
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    • pp.14-18
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    • 2023
  • Superconducting layers deposited on the metal substrate using the pulsed laser deposition process (PLD) play a crucial role in exploring new applications of superconducting wires and enhancing the performance of superconducting devices. In order to improve the superconducting property and increase the throughput of superconducting wire fabricated by pulsed laser deposition, high temperature heating device is needed that provides high temperature stability and strong durability in high oxygen partial pressure environments while minimizing performance degradation caused by surface contamination. In this study, new heating device have been developed for PLD process that deposit and growth the superconducting material continuously on substrate using reel-to-reel transportation apparatus. New heating device is designed and fabricated using iron-chromium-aluminum wire and alumina tube as a heating element and sheath materials, respectively. Heating temperature of the heater was reached over 850 ℃ under 700 mTorr of oxygen partial pressure and is kept for 5 hours. The experimental results confirm the effectiveness of the developed heating device system in maintaining a stable and consistent temperature in PLD. These research findings make significant contributions to the exploration of new applications for superconducting materials and the enhancement of superconducting device performance.

미세 임프린팅용 금속몰드의 급속가열을 위한 유도가열기구 개발 (Development of Induction Heating Apparatus for Rapid Heating of Metallic Mold)

  • 홍석관;이성희;허영무;강정진
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.199-204
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    • 2007
  • Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

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극저온 헬륨가스 가열장치 개발 (Heating Apparatus Development for Cryogenic Gaseous Helium)

  • 정용갑;권오성;조남경;조인현
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2009년도 제33회 추계학술대회논문집
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    • pp.363-367
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    • 2009
  • 산화제로 액체산소를 사용하고 산화제 탱크 내부에 가압제 용기가 설치된 액체추진기관의 가압시스템에서는 가압제 용기에서 극저온으로 토출되는 가압제가 가스발생기 후단의 열교환기를 통과하여 극저온에서 고온으로 온도가 상승되어 추진제 탱크의 얼리지로 공급된다. 이러한 가압시스템을 개발하기 위해서는 열교환기를 모사할 수 있는 가열장치를 적용하여 인증시험을 수행하여야 한다. 본 연구에서는 가압시스템 개발시험에 적용할 수 있는 극저온 헬륨가스 가열장치를 개발하였고 이에 대한 가열시험을 수행하였다.

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극저온 헬륨가스 가열장치 개발 및 시험 (Heating Apparatus Development and Tests for Cryogenic Gaseous Helium)

  • 정용갑;조남경
    • 한국추진공학회지
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    • 제15권1호
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    • pp.63-68
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    • 2011
  • 산화제로 액체산소를 사용하고 산화제 탱크 내부에 가압제 용기가 설치된 액체추진기관의 가압시스템에서는 가압제 용기에서 극저온으로 토출되는 가압제가 가스발생기 후단의 열교환기를 통과하여 극저온에서 고온으로 온도가 상승되어 추진제 탱크의 얼리지로 공급된다. 이러한 가압시스템을 개발하기 위해서는 열교환기를 모사할 수 있는 가열장치를 적용하여 인증시험을 수행하여야 한다. 본 연구에서는 가압시스템 개발시험에 적용할 수 있는 극저온 헬륨가스 가열장치를 개발하였고 이에 대한 가열시험을 수행하였다.

미세 패턴 성형용 판형 금형의 급속 가열을 위한 유도가열기구 (Induction Heating Apparatus for Rapid Heating of Flat-Type Metallic Mold in Hot Embossing)

  • 홍석관;이성희;허영무;강정진
    • 소성∙가공
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    • 제16권4호
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    • pp.282-287
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    • 2007
  • Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C\;to\;150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

유전가열장치에 의한 곡물 바구미 구제의 실험적 고찰 (The Experimental Consideration for Extermination of a Rice Weevil in Grain by Dielectric Heating Apparatus)

  • 한경희;김태진;조기연;이현우;백수현
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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    • pp.257-259
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    • 2002
  • With development of Circuit technology, accuracy of dielectric or induction heating apparatus was developed. This study aims at realization of food insecticidal apparatus using dielectric heating. Equipment to measure grain's permittivity or vermin's permittivity and expectation for heating temperature by computer simulation is necessary for construction of the system. And the effect of extermination of vermin for food was confirmed by experiment using the system.

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Sievert's type 자동장치에 의한 마그네슘 수소화합물의 열분석 (Thermal Analysis of Mg Hydride by Sievert's Type Automatic Apparatus)

  • 한정섭;박경덕
    • 대한금속재료학회지
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    • 제48권12호
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    • pp.1123-1129
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    • 2010
  • In order to apply the Sievert's type automatic apparatus to thermal analysis of hydrogen absorbing materials, the dehydrogenation of the Mg-H system was investigated. As the initial wt% of hydrogen was increased to 4.4, the peak temperature of evolution rate shifted to higher temperature. However, with the initial wt% of hydrogen higher than 4.4, peak temperature of evolution rate did not change. The peak temperatures of evolution rate obtained by automatic apparatus were almost the same as those measured by a manual apparatus. As the heating rate was increased, the peak temperatures increased; the peak temperatures for heating rates 1, 2 and 3 K/min were 664, 687 and 702 K, respectively. The activation energy for the decomposition of Mg hydride was 101 kJ/mol. The Sievert's type automatic apparatus can be successively applied to the thermal analysis of metal hydride.