• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.37.2-37.2
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• 2010

Electrostatic spray deposition is an innovative coating technique that produces fine, uniform, self-dispersive (due to the Coulombic repulsion), and highly wettable, atomized drops. Copper-indium salts are dissolved in an alcohol-based solvent, which is then electrostatically sprayed onto a moderately heated, molybdenum-coated substrate. Solvent flowrates range from 0.02 to 5 ml/hr under applied voltages of 1 to 20 kV yielding drop sizes around a few hundred nanometers. By comparing the scanning electron miscrscope images of coated samples, the substrate temperature, applied voltage, solvent flowrate, and nozzle-substrate distance are demonstrated to be the primary parameters controlling coating quality. Also, the most stable electrostatic spray mode that reliably produces uniform and fine drops is the cone-jet mode with a Taylor cone issuing from the nozzle.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.999-1003
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• 2009

In this paper, CdS thin films well-known to window layer for solar cell were fabricated by means of vacuum evaporation method treated with different substrate heating. During film fabrication the substrates were heated at 50, 75 and $100^{\circ}C$, respectively. The thin films were then annealed at $200^{\circ}C$ in atmosphere, and the electrical and optical properties were investigated. By annealing, the hexagonal structure of films was changed into cubic structure. Their transmissivity was also increased and moved to longer wave band. It was shown that the film fabricated with the substrate heat-treated at $50^{\circ}C$ had the lowest resistivity.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.42-44
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• 2003

The paper presents the method and apparatus for conformal photoresist spray coating on the 3D structured substrate. The system consists of a high-temperature-rotational chuck, ultrasonic spray nozzle module, angle control module and nozzle moving module. The coating uniformity is acquired by controlling the moving speed of the ultrasonic spray nozzle across the substrate which is rotated constantly. To coat the photoresist conformally the spray angle of the nozzle and the temperature of the substrate are controlled during spray coating. The rotational chuck can be heated up by hot air or $N_2$. The photoresist (AZ1512) has been coated on the 3D structured wafer by spray coating system and the characteristics have been evaluated.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.44-49
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• 1997

AIN thin films were deposited on silicon and glass substrates by sputtering Al target and introducing mixed gases of argon and nitrogen into reactive RF magnetron sputter. The substrate was not heated to protect the PC (polycarbonate) substrate and the micro-sized pregroove morphology on the surface of PC substrate. But its temperature was around $100^{\circ}C$ due to the self-heating by plasma. The crystallinity, cross-section morphology and refractive index were characterized by changing various deposition parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.77-79
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• 1999

Bi$_2$Sr$_2$CaCu$_2$O(Bi-2212) thick films were fabricated on Y211 substrate by screen printing method. The aim of the study was to fabricate superconducting thick films on Y211 substrate by MPMG process. For this study, patterned samples by screen printing method were heated with MPMG process. The thickness of Bi2212 on substrate was about 20 ${\mu}{\textrm}{m}$ and these samples showed many Bi- 2212 phases.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.428-433
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• 2000

The consolidation behavior of multicomponent particles prepared by the flame hydrolysis deposition process is examined to identify the effects of Si substrate temperature. To fabricate multi-component particles, a vapor-phase ternary mixture of $SiCl_4(100 cc/min),\;BCl_3(30cc/min)\;and\;POCl_3,(5cc/min)$ was fed into a coflow diffusion oxy-hydrogen flame burner. The doped silica soot bodies were deposited on silicon substrates under various deposition conditions. The surface temperature of the substrate was measured by an infrared thermometer. Changes in the chemical states of the doped silica soot bodies were examined by FT-IR(Fourier-transformed infrared spectroscopy). The deposited particles on the substrate were heated at $1300^{\circ}C$ for 3h in a furnace at a heating rate of 10K/min. Si-O-B bending peak has been found when surface temperature exceeds $720^{\circ}C$. Correspondingly, the case with substrate temperatures above loot produced good consolidation result.

• Transactions on Electrical and Electronic Materials
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• v.6 no.3
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• pp.106-109
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• 2005

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using polymer films. Especially, we studied in-situ photoalignment changing heating temperature from $50^{\circ}C\;to\;120^{\circ}C$ on the polymer film. The LC aligning capabilities and pretilt angle on the polymer substrates were better than those on the glass substrate using in-situ photoalignment method. It is considered that this increase in pretilt angle may be attributed to the roughness of the micro-groove substrate induced by the in-situ photoalignment. As temperature of heated subtrate and UV exposure time increase, pretilt angle of the cell used polymer film increased. It is considered that the heating temperature of substrate is attributed to generate pretilt angle. Also, electro-optical performances of the in-situ photoaligned TN cell using the polymer substrate are almost the same as that of the TN cell using the glass substrate.

• Proceedings of the KIEE Conference
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• 1991.11a
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• pp.299-303
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• 1991

A lamp heated LPCVD equipment has been made. Wafer is heated by an array of fifteen tungsten halogen lamps above the front side of a wafer and pyrometer views the back side of the wafer through $CaF_2$ window. Reactor which consisits of a quartz window and a water cooled-stainless steel plate can be evacuated to $5{\times}10^{-3}$ torr with a rotary vane pump. By pyrolysis of $SiH_4$ at about $600^{\circ}C$, polysilicon has been formed on the silicon dioxide film. The measured results show that thickness nonuniformity is 15% and temperature nonuniformity is 1.1%. Because activation energy of pyrolysis of $SiH_4$ is very high, about 1.8eV, small temperature variation will induce large thickness nonuniformity. The main cause of temperature nonuniformity is unsymmetry of lamp power and an unbalanced cooling structure. Charls & Evans' SIMS result shows that the oxygen content in the deposited polysilicon is comparable to that of silicon substrate but carbon content is ten times higher.

• Journal of ILASS-Korea
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• v.26 no.1
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• pp.1-8
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• 2021

Droplet evaporation has been known as a common phenomenon in daily life, and it has been widely used for many applications. In particular, the influence of the different heated substrates on evaporation flux and flow characteristics is essential in understanding heat and mass transfer of evaporating droplets. This study aims to simulate the droplet evaporation process by considering variation of thermal property depending on the substrates and the surface temperature. The commercial program of ANSYS Fluent (V.17.2) is used for simulating the conjugated heat transfer in the solid-liquid-vapor domains. Moreover, we adopt the diffusion-limited model to predict the evaporation flux on the different heated substrates. It is found that the evaporation rate significantly changes with the increase in substrate temperature. The evaporation rate substantially varies with different substrates because of variation of thermal property. Also, the droplet evaporates more rapidly as the surface temperature increases owing to an increase in saturation vapor pressure as well as the free convection effect caused by the density gradient.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.563-568
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• 2012

Indium tin oxide (ITO) films were prepared using radio frequency (RF) magnetron sputtering method, magnets were equipped near the target in the sputter to bring the plasma near the target. The effect of magnetic field that brings the plasma near the substrate was compared with that of substrate heating. The effect of substrate heating on the grain size of the ITO thin film was larger than that of the magnetic field. However, the grain size of the ITO thin film was larger when the magnetic field was applied near the substrate during the sputtering process than when the substrate was not heated and the magnetic field was not applied. If stronger magnetic field is applied near the substrate during sputtering, it can be expected that the ITO thin film with good electrical conductivity and high transparency is obtained at low substrate temperature. When magnetic field of 90 Gauss was applied near the substrate during sputtering, the mobility of the ITO thin film increased from 15.2 $cm^2/V.s$ to 23.3 $cm^2/V.s$, whereas the sheet resistivity decreased from 7.68 ${\Omega}{\cdot}cm$ to 5.11 ${\Omega}{\cdot}cm$.