• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.1 s.232
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• pp.16-26
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• 2005

Air-cooled heat sinks are employed in many electronic cooling applications since they provide significant heat transfer enhancement and operational flexibility. Strip-shaped fin heat sink is of interest and needs to be investigated as general cooling products for more applicability. The purposes of this study are to evaluate heat sink performance without bypass flow condition and to determine optimal heat sink geometries. The results show that the decreasing rate of thermal resistance of a heat sink decreases with increasing inlet air velocity, and the increasing rate of pressure drop increases with increasing inlet air velocity, but is not affected by input power. The increasing rate of optimal longitudinal fin spacing is larger than that of transverse fin spacing. The strip fin heat sink tested in this study showed better cooling performance compared to that of other plate fin type.matism. 2004; 50(11): 3504-3515.

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.829-832
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• 2005

Thermal analysis of new designed heat-sink models was carried out according to the natural ana the forced convection using computational fluid dynamics(CFD). Heat resistance of wave type, top vented wave type and plate type of heat sink was compared with each other As the direction of fin and air flow are vertical(z-axis), it is shown that radiant heat performance of all of heat sinks was superior than other experimental conditions. Especially, the heat resistance of top vented wave heat sink was $0.17^{\circ}C/W$(forced convection) and $0.48^{\circ}C/W$(natural convection). The radiant heat performance of heat sink was increased with increasing the height of fin and the width of fin pitch.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.2
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• pp.73-79
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• 2001

Experiment were carried out to investigate the heat transfer characteristics of an aluminum foam block as a porous heat sink on a heat source by a vertical air jet impingement that can be applied for electronics cooling. The performance of the aluminum foam heat sink was evaluated by the convective heat transfer coefficient on the heat source. At a fixed porosity, pore density ($\beta$) of the foam and Reynolds number Re were varied in the range of $\beta$a=10, 20, 40 PPI(Pore Per Inch) and $850\leqRe\leq25000$. A nozzle diameter and the nozzle-to-plate spacing were also varied. It was found that the convective heat transfer was enhanced by the aluminum foam heat sink with lower pore density due to relatively intensified flow through the foam block. The aluminum foam block with much reduced weight shows slightly better performance with larger Nusselt number, compared with the convectional heat sink.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.2
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• pp.142-148
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• 2017

The objective of this study is to investigate the cooling characteristics of a heat sink for an LED headlight used in passenger cars. To this end, this study conducts the experimental and numerical analysis of the heat sink heated at constant heat fluxes without air flow applied. In the experiments, heat was transferred at a constant heat flux through the bottom of a heat sink. The measured temperature on pre-selected locations of the heat sink was in good agreement with the numerically predicted one. The experimental and numerical results indicate that the convective heat transfer coefficient for the natural convection mode was decreased by increasing the heat flux applied to the bottom of heat sink, lowering the cooling capabilities.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1189-1194
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• 2004

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. For the various types of microchannel heat sink having different size of fin width and channel width, experimental study is conducted. Through the experiment, the tip clearance effect is investigated by increasing tip clearance from zero. As a result, it is shown that cooling performance of heat sink with tip clearance is better than that of heat sink without tip clearance. For the microchannel heat sink with tip clearance, the optimum conditions for cooling performance is also studied.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.728-740
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• 2004

Heat sink has extended surface area for enhanced heat transfer. The enhanced convection heat transfer has been used widely, such as cooling electronic chips in the electronics industry. Heat sink usually requires an increase in the heat transfer and a decrease in the pressure drop, and must improve the performance in the flow field of industrial plants. In this study, wing fin heat sink was studied and tests were conducted in a rectangular cross sectional channel with wing fin heat sinks. The leading and trailing ends of a wing fin have a sharp edge, simulating the airfoil feature. Empirical correlations have been developed for wing fin heat sink types. And wing fin heat sinks have better cooling performance than elliptic fin and square fin types.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.12-17
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• 2016

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.4
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• pp.271-287
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• 2001

This paper has been made to investigate the thermal performance characteristics for the several types of layered aluminum heat sinks with offset-strip fin. Heat sinks with different fin height, fin length, number of fin layer and slanted fin are prepared and tested for natural convection as well as forced convection. The experimental results for layered heat sink(LHS) are compared to those for advanced pin fin heat sink (PHS) so that the appropriate heat sink can be designed or chosen according to the heating conditions. The overall heat transfer performances for LHS are almost comparable to those of PHS under natural convection, and become 1.2∼1.5 times as high as those of PHS under forced convection situation. This study shows that fin height and number of fin layer re important parameters, which have a serious influence on thermal performance for layered heat sinks.

• Design & Manufacturing
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• v.12 no.1
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• pp.31-35
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• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.