• Title/Summary/Keyword: Heat spreader thickness

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A Study on the Heat Transfer Performance of a Heat Spreader (히트 스프레더의 열전달 성능에 관한 연구)

  • Kim, Hyun-Tae;Lee, Yong-Duck;Oh, Min-Jung;Jang, Sung-Wook
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1258-1263
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    • 2004
  • The present study proposes a new structure for a heat spreader which could embody a thin thickness, any shapes and high heat flux per unit area. It is on the structure for the formation of vapor passages and the support of the case of the heat spreader. A screen mesh is used as the one. To verify the validity of the one, the heat spreader of 1.4mm and 1.6mm thickness was made with 14 mesh and 100 mesh number. In this paper, The performance test of heat spreader conducted in order to compare with the heat transfer performance of conventional heat pipe. As the results, The heat spreader has excellent cooling and heat transfer performance.

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Numerical Investigation on the Thermal Performance of a Cooling Device for a CPV Module (고집광 태양광 모듈용 냉각 장치의 열성능에 대한 수치 해석적 연구)

  • Do, Kyu Hyung;Kim, Taehoon;Han, Yong-Shik
    • Journal of the Korean Solar Energy Society
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    • v.35 no.1
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    • pp.1-8
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    • 2015
  • In the present study, the effects of the heat spreader thickness and the heat sink size on the thermal performance of a cooling device for a concentrating photovoltaic (CPV) module were numerically investigated. Numerical simulation was conducted by using the simulation tool ICEPAK, commercial software based on the finite volume method. Numerical results were validated by comparing the existing experimental data. The thermal performance of a cooling device, which consisted of a heat spreader and a natural convective heat sink, was evaluated with varying the heat spreader thickness and the heat sink size. The geometric configuration of the natural convective heat sink, such as the fin height, the fin spacing, and the fin thickness, was optimized by using the existing correlation. The numerical results showed that the thermal performance of the cooling device increased as the heat spreader thickness or the heat sink size increased. Also, it was found that the spreading thermal resistance plays an important role in the thermal performance of the cooling device which has the localized heat source.

Experimental Investigation on the Thermal Performance of a Heat Spreader Module for the CPV Cooling (CPV 냉각용 열분산기 모듈의 열성능에 관한 실험적 연구)

  • Do, Kyu-Hyung;Han, Yong-Shik;Choi, Byung-Il;Kim, Myung-Bae
    • Journal of the Korean Solar Energy Society
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    • v.31 no.4
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    • pp.95-102
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    • 2011
  • In this paper, the thermal performance of a heat spreader module for CPV(Concentrating Photovoltaic) cooling is experimentally investigated. In order to evaluate the thermal performance of the heat spreader module which consists of a Metal PCB and an aluminum alloy heat spreader, experiments are conducted with varying the type of the metal PCB, the thickness of the heat spreader, the inclination angle, and the applied heat flux. To validate the experimental data, three dimensional numerical simulations are performed using the commercial simulation tool in the present work. The experimental results are compared with the corresponding numerical results and are in close agreement with the numerical results. From the experimental results, the temperature difference between the maximum temperature and the ambient temperature increases with decreasing the thickness of the heat spreader and with increasing the applied heat flux. Also, it is found that the inclination angle significantly affects the thermal performance of the heat spreader. the maximum temperature difference of the heat spreader with the horizontal orientation is much larger than that with the vertical orientation.

Characterization of a Thermal Interface Material with Heat Spreader (전자부품의 방열방향에 따른 접촉열전도 특성)

  • Kim, Jung-Kyun;Nakayama, Wataru;Lee, Sun-Kyu
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.1
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    • pp.91-98
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    • 2010
  • The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

Thick Graphene Embedded Metal Heat Spreader with Enhanced Thermal Conductivity

  • Park, Minsoo;Chun, Kukjin
    • Journal of Sensor Science and Technology
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    • v.23 no.4
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    • pp.234-237
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    • 2014
  • In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

THE EFFECTS OF THERMOCONDENSATION TECHNIQUE USING SYSTEM BTM ON THE PERIODONTIUM (System BTM를 이용한 열가압 충전시의 치주인대내에 미치는 영향)

  • Kim, Jae-Wook;Lee, Seung-Jong
    • Restorative Dentistry and Endodontics
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    • v.23 no.1
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    • pp.366-378
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    • 1998
  • Thermocondensation root canal filling technique have been used to fill accessary canals or to obtain homogeneous root caral fillings. But these thermocondensation technique inevitably produce heat in the canal which can be transmitted through the dentin and cementum and consequently damage periodontal ligamental cells and osteoblasts. In this study, System $B^{TM}$(Analytic technology, WA.D.S.A.) was used to evaluate the reaction of periodontal ligament tissue to "Continous Wave condensation technique" introduced by Buchanan, and the transmitted root surface temperature was measured according to measured root thicknesses. 12 Mandibular incisors of two adult dogs were used for the experiment. 6 controls were filled by lateral condensation technique with sealer.3 specimens were apically filled by Continuous Wave technique at $200^{\circ}C$ for 5 seconds and remaining 3 specimens were additionally backfilled using System $B^{TM}$(Analytic technology, WA.D.S.A.) was used to evaluate the reaction of periodontal ligament tissue to "Continous Wave condensation technique" introduced by Buchanan, and the transmitted root surface temperature was measured according to measured root thicknesses. 12 Mandibular incisors of two adult dogs were used for the experiment. 6 controls were filled by lateral condensation technique with sealer.3 specimens were apically filled by Continuous Wave technique at $200^{\circ}C$ for 5 seconds and remaining 3 specimens were additionally backfilled using System $B^{TM}$ at $100^{\circ}C$ for 20 seconds. Six weeks later, the dogs were sacrificed and the teeth stained with Hematoxylin and Eosin for histologic examination. 6 extracted human teeth were used to measure the transmitted temperature. After cutting off the crown, the canals were prepared and divided into 3 groups with root thickness of 1.5mm, 1.0mm, 0.5mm, 2 teeth in each group. Inside each root canal, System $B^{TM}$ was heated as with the temperature for the apically condensed and the back filled group, and the transmitted heat was measured on the external surface of the root. The temperature of System $B^{TM}$ heat spreader at $200^{\circ}C$ and $100^{\circ}C$ was also measured at root temperature. It can be concluded as follows: 1. In the thin area (200-$250{\mu}m$) of the root, root resorption could be seen even with heating at $200^{\circ}C$ for 5 seconds. 2. When the spreader was heated at $200^{\circ}C$ for 5 seconds and additionally at $100^{\circ}C$ for 20 seconds for backfill, all teeth showed root resorption regardless of their root thickness. 3. The transmitted external root surface temperature was higher as the root thickness decreased and as the heating time increased. In the thermocompaction technique using System $B^{TM}$, the spreader should be heated for the minimal time and used only in the apical area. The heated spreader shouldn't inserted to the binding point of the canal and backfilling should be done with other means of minimally heated gutta percha technique.

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Preparation and characterization of expanded graphite/Ag nanoparticle composites for the improvement of thermal diffusion

  • Hong, Seok Hwan;Lee, Won Gyu
    • Korean Chemical Engineering Research
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    • v.56 no.3
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    • pp.410-415
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    • 2018
  • Expanded graphite (EG)/Ag nanoparticle composites were synthesized by the chemical reduction of Ag ions, followed by the addition of expanded graphite into an Ag reducing solution. The prepared composites showed uniform dispersion of Ag nanoparticles on the surface of expanded graphite and exhibited relatively higher thermal conductivities than those of pure expanded graphite. In the case of 10% Ag content in the composite, the thermal conductivity in the thickness direction was 78% higher than the pure expanded graphite. We suggest that EG/Ag nanoparticle composites are a strong candidate for advanced heat spreading material.