• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.292-296
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• 2012

An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.612-617
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• 2001

This paper reports the cooling performance of a PDP(plasma display panel) with a heat spreader by means of numerical analysis. Due to the simplifications and assumptions inherent in the analysis, computed results are found to differ those of the experiment by 13%. Calculation shows a maximum temperature of $65^{\circ}C$ for the plasma glass, as opposed to the allowable temperature of $90^{\circ}C$, producing a temperature difference of $25^{\circ}C$ between the upper and lower regions. This is enough to cause cracks in the plasma glass. In order to avoid this, more ventholes are added at the upper center region of the back cover, thereby causing a $3^{\circ}C$ drop in the maximum temperature, which reduces the temperature difference to $12^{\circ}C$. The new design gives more uniform temperature distribution across the plasma glass.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.16.1-16.1
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• 2005

• Journal of Mechanical Science and Technology
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• v.18 no.4
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• pp.681-688
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• 2004

For use of the thermal cycle of the biochemical fluid sample, the isothermal temperature source with a large surface area was designed, fabricated and its thermal characterization was experimentally evaluated. The comprehensive overview of the technology trend on the temperature control devices was detailed. The large surface area isothermal temperature source was realized by using the vapor chamber heat spreader. The cost-effectiveness and simple manufacturing process were achieved by using the metal-etched wick structure. The temperature distribution was quantitatively investigated by using IR temperature imaging system at equivalent temperatures to the PCR thermal cycle. The standard deviation was measured to be within 0.7$^{\circ}C$ for each temperature cycle. This concludes that the presented isothermal temperature source enables no temperature gradient inside bio-sample fluid. Furthermore it can be applied to the cooling of the electronic devices due to its slimness and low thermal spreading resistance.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.60-65
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• 2007

According to the customers' demands, cellular phones are getting thinner and thinner in spite that their functions are getting more complex and flexible. Based on this trend, we are willing to propose new design of ultra slim cellular phone with multi-hinges which can provide thinner feature and wider active area than the current merchandised one. To make it come true, smaller and stronger mechanical parts would be necessary and more researches would be carried out in the near future. Moreover, the new frame of ultra slim cellular phone has the problem in heat propagation due to its thin feature and multi function. In this paper, slim heat-spreader would be proposed as a candidate to resolve the problem of heat transfer in the new cellular phone. To investigate the applicability of heat-spreader to cellular phones, prototypes were fabricated and verified.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.41.1-41.1
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• 2005

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.41.2-41.2
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• 2005

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.551-560
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• 2011

In this paper, a cooling system that includes a heat spreader and a natural convective heat sink is proposed for the cooling of a concentrating photovoltaic (CPV) module. The heat spreader and the natural convective heat sink are designed on the basis of previous analytical investigations. In order to evaluate the proposed cooling system, we conducted experimental investigations varying the heat rate and the inclined angle of the cooling system. From the experimental results, it is found that the proposed cooling system satisfies the design constraints for good operation of the CPV module. Finally, a correlation is suggested for estimating the effects of the heat rate and the inclined angle on the thermal performance of the natural convective heat sink is suggested.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.593-594
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• 2010

• Journal of Sensor Science and Technology
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• v.23 no.4
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.