• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.292-296
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• 2012

An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.870-875
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• 2004

Heat flow characteristics in the newly developed Wave Heat Sink were analyzed under natural and forced convections by Icepak program using the finite volume method. Temperature distribution and thermal resistance of Wave Heat Sink with/without air vent hole on the top of fin were compared with those of a commercial Al extruded heat sink(Intel Heat Sink). Under the natural convection, the maximum temperature was $45.1^{\circ}C$ in the air vent hole typed Wave Heat Sink, which was superior to that of Intel Heat Sink. The thermal resistance was $2.51^{\circ}C/W$ in the air vent hole typed Wave Heat Sink, and it changed to $2.65^{\circ}C/W\;and\;2.16^{\circ}C/W$ with changes of gravity direction and fin height, respectively. Under the forced convection, the maximum temperature became lower than that under the natural convection. In addition, the thermal resistance lowered in the air vent hole typed Wave Heat Sink with higher fin height and it decreased with increasing the air flux.

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1590-1603
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• 2004

In this study the optimization of plate-fin type heat sink with vortex generator for the thermal stability is performed numerically. The optimum solutions in the heat sink are obtained when the temperature rise and the pressure drop are minimized simultaneously. Thermal performance of heat sink is influenced by the heat sink shape such as the base-part fin width, lower-part fin width, and basement thickness. To acquire the optimal design variables automatically, CFD and mathematical optimization are integrated. The flow and thermal fields are predicted using the finite volume method. The optimization is carried out by means of the sequential quadratic programming (SQP) method which is widely used for the constrained nonlinear optimization problem. The results show that the optimal design variables are as follows; B$_1$=2.584 mm, B$_2$=1.741 mm, and t=7.914 mm when the temperature rise is less than 40 K. Comparing with the initial design, the temperature rise is reduced by 4.2 K, while the pressure drop is increased by 9.43 Pa. The relationship between the pressure drop and the temperature rise is also presented to select the heat sink shape for the designers.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1172-1176
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• 2009

In the present study, natural convection over a heat sink with a horizontal circular base and rectangular fins was numerically analyzed. To calculate natural convection heat transfer, the assumptions of ideal gas and laminar flow were made for air. Flow patterns around the heat sink were chimney-like. The resultant temperature distribution on the circular base appeared almost uniform. Parametric studies were performed to compare the effects of fin length, fin height, the ideal number of fins, and heat flux on the average temperature of a heat sink and the average heat transfer coefficient from the heat sink array. Correlation to predict the average Nusselt number was presented.

• Journal of Electrical Engineering and Technology
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• v.9 no.5
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• pp.1724-1728
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• 2014

Heat sink has been used to help an electrical device operate in normal temperature condition. But heat sink radiates unwanted electromagnetic wave, which may cause electromagnetic interference problem. A resistance loaded grounding technique is proposed to reduce electromagnetic wave radiation by a heat sink. Numerical simulations are accomplished to find optimal loading resistance. Also electromagnetic fields radiated by from a heat sink are measured and compared with the simulation results. The test results verify the usefulness of the proposed technique.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.12-17
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• 2016

In this study, numerical simulations for the conjugate heat transfer of air with a heat-sink of CPU were conducted. The heat-sink consisted of many fins of cylinder shape and the effect of the number of fins on the cooling performance of the heat sink was investigated. Grid independent solutions were obtained to compare the maximum temperature of the heat-sink for various conditions. It was found that maximum temperature of the heat-sink asymptotically approached 310K as the number of fins went to infinity. The energy exchange of air with the heat-sink was found to be nearly independent on the number of fins.

• International journal of advanced smart convergence
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• v.2 no.2
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• pp.19-22
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• 2013

As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4072-4080
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• 2014

The Peltier Module has been used to dissipate the heat from electronic devices and electronic components. In this module, a heat sink is used to release the operating heat into the air outside. This study addressed the heat transfer characteristics for a heat sink with an inner tunnel. Under forced and natural convection conditions, the heat transfer characteristics were different. Therefore, the cooling and heating performances were studied for the heat sink, which has an inner tunnel. The heat transfer conditions were also evaluated by performing an experimental test, which investigated the heat transfer characteristics related to the variance in time and temperature distribution. Experiments on the heat transfer characteristics of the heat sink were conducted based on the forced and natural convection and temperature distribution changes. In the cooling experiment, the A- and B-shaped cooling pin heat sinks decreased the temperature of the forced convection than the temperature of natural convection. In the forced and natural convection, the A- and B-shaped decreased to a minimum of $-15^{\circ}C$. Under the forced and natural convection conditions, A- and B-shaped cooling pin heat sinks decreased the temperature when the voltage was increased. In the heating experiment, the A- and B-shaped cooling pin heat sinks increased the temperature of the forced convection than the temperature of natural convection. In forced convection, when the voltage was $15^{\circ}C$, the temperature of the A-shaped cooling pin heat sink increased to $150^{\circ}C$, and the temperature of the B-shaped cooling pin heat sink increased to $145^{\circ}C$. Under forced and natural convection conditions, the A- and B-shaped cooling pin heat sinks showed an increase in temperature with increasing voltage.