• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.4
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• pp.733-737
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• 2007

The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.

• Korean Journal of Materials Research
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• v.13 no.12
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• pp.769-774
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• 2003

In this paper, we report on the DC characteristics of the AlGaN/GaN HFETs using physical models on piezoelectric and thermal effects. Employing the models was found to be essential for a realistic prediction of the DC current-voltage characteristics of the AlGaN/GaN HFETs. Though use of the implementation of the physical models, peak drain current, transconductance, pinch-off voltage, and most importantly, the negative slope in the current were accurately predicted. The importance of the heat sink effect was demonstrated by the comparison of the DC characteristics of AlGaN/GaN HFETs fabricated from different substrates including sapphire, Si and SiC. Highest peak current was achieved from the device with SiC by an effective suppression of heat sink effect.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.11-16
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously. The present experiment reveals that the cooling combination of the heat pipe and cooling fan is far superior to the conventional cooling device for the driving motor such as the fin-typed heat sink. When the driving voltage of 20V and 14V were supplied to the driving motor, the cooling performance of the rotary motor with heat pipe was 170% and 500%, respectively better than that without heat pipe on steady state condition.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.6
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• pp.571-578
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• 2012

In this paper, an experimental investigation is performed to estimate the thermal performance of a natural convective heat sink with plate fins subject to the uniform wall temperature condition. Extensive experiments are performed with various input powers, fin spacings, and heights of the natural convective heat sinks with plate fins. In particular, the effect of the inclination angle on the thermal performance of the heat sink is studied. In order to validate the experimental data, the experimental results are compared with results from previous studies. Based on the experimental results, the appropriate ranges of the previous correlations between the input power, the fin spacing, the fin height, and the inclination angle for the natural convective heat sink with plate fins are evaluated.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1168-1173
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.3410-3415
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• 2014

The heat generated by electronic devices can result in performance degradation. Therefore, a heat sink has been used to release the operating heat into the air outside. This study addressed a methodology for a heat sink with an inner tunnel. Under forced convection conditions, the heat transfer characteristics were different so the cooling and heating performances were studied for the heat sink with an inner tunnel. This was evaluated by performing the experimental test examining the heat transfer characteristics related to the variance in time and temperature distribution. In the cooling experiment, the temperature of the A-shape was lower than that of the B-shape, when the voltage was 10 V. These experimental results indicate the optimal cooling effect. In a heating experiment, the temperature of the A-shape was higher than that of the B-shape, when the voltage was 13 V. The experimental results showed that the temperature and efficiency of the A-shape were higher than those of the B-shape.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.346-357
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• 2008

Endothermic fuels are known as a probable fuel for hypersonic atmospheric flight vehicles and advanced propulsion systems, as well as cryogenic fuels. Especially, from the standpoint of the advanced regenerative cooling use, they are quite useful as a coolant fuel because of their large heat sink due to their chemical decompositions; so-called endothermic cooling effect. However, no heat transfer equations have been proposed taking into account such endothermic reactive behaviors concretely. This paper describes an analytical method for evaluation of the heat transfer rates between endothermic reacting coolant fuel and coolant-side wall in the regenerative cooling passages. Heat transfer mechanism is indicated based on a classical transport-phenomenological approach. A new relational expression of Nusselt number ratio for forcedconvective heat transfer with such endothermic reactions is also proposed by theoretical approaches using some classical hypotheses. Its applicability is assessed provisionally by comparison with confirmed results of heated tube tests for supercritical JP-7 fuel carried out at NASA Lewis Research Center, using its heat sink characteristics evaluated by United Technologies Research Center(UTRC). As a result, it has been suggested that the proposed relational equation is applicable to the evaluation of enhancement of Nusselt numbers due to such reactions in developed turbulent flows such as in the regenerative cooling passages.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1156-1161
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• 2006

This study is to evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital $LabView^{TM}$ measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.1
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• pp.170-178
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• 2019

Recently, as the interest in energy savings has increased, there has been increasing use of LED lighting, which is an eco-friendly device that replaces high energy consuming fluorescent lamps and incandescent lamps. In the case of a high output LED, however, the life time is shortened due to deterioration caused by heat generation. As a solution to this problem, this paper evaluated the LED life extension effect by increasing the convective heat transfer coefficient of the heat sink surface for LED packaging. A roughing process was carried out using sandpaper and sand blasting. The changes in surface roughness and surface area after each surface treatment process were evaluated quantitatively and the convective heat transfer coefficient was measured. When sandblasting and sandpaper were used to roughen the aluminum surface, a higher convection heat transfer coefficient was obtained compared to the untreated case, and a high heat dissipation efficiency of 82.76% was obtained in the sandblast treatment. Therefore, it is expected that the application of heat dissipation to the heat sink will extend the lifetime of the LED significantly and economically by increasing the heat efficiency.