• Corrosion Science and Technology
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• 제19권1호
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• pp.23-30
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• 2020

Heat sinks are most widely used in thermal management systems; however, the heat dissipation efficiency is usually limited. Therefore, in order to increase heat dissipation efficiency of the heat sink, the heat-dissipating paint using 2D materials (hexagonal boron nitride (h-BN) and graphene) as thermally conductive additive was designed and evaluated in the present study. The heat dissipation performance of the paint was calculated from temperature difference between the paint-coated and -uncoated specimens mounted on the heat source. The highest heat dissipation performance was obtained when the ratio of h-BN to resin was 1/10 in the paint. In addition, further reduction in the temperature of the test specimen by 6.5 ℃ was achieved. The highest heat dissipation performance of the paint prepared using graphene was achieved at a 1/50 ratio of graphene to the resin, and a 6.5 ℃ reduction was attained. In addition, graphene exhibited enhanced corrosion resistance property of heat-dissipating paint by inhibiting the growth of the paint blisters.

• 한국기계가공학회지
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• 제21권3호
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• pp.63-69
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• 2022

Compressor efficiency must be improved to reduce refrigerator power consumption. In this study, the heat dissipation rate through the compressor housing is increased via gap flow passages between the compressor body and housing. Four types of gap flow passages are considered for achieving the maximum heat-dissipation rate. In addition, thermal analysis is performed to examine the effect of increased heat dissipation rate on the energy efficiency ratio (EER). The results show that the heat dissipation rate, compressor superheat, and compressor EER increased by up to approximately 52%, 3 ℃, and approximately 1%, respectively.

• 한국산학기술학회논문지
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• 제20권1호
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• pp.170-178
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• 2019

최근 에너지 절감에 대한 관심도가 높아짐에 따라 에너지 소비가 높은 형광등과 백열등을 대체하는 친환경소재인 LED의 조명을 활용하는 움직임이 활발하다. 그러나, 고출력 LED의 경우 발열에 의한 열화현상 때문에 수명이 단축되는 현상이 발생하게 된다. 이에 대한, 해결방안으로 본 논문은 LED Packing중 방열판표면의 거칠기 처리를 통하여 열전달 계수를 증대시킴으로서 LED 수명연장 효과를 평가하였다. 거칠기 공정은 사포 및 샌드블라스트를 이용하여 진행하였다. 각 표면처리 공정에 따른 거칠기 및 표면적 변화를 정량적으로 평가하였으며, 열전달 계수를 측정하였다. 샌드블라스트, 사포를 이용하여 알루미늄 표면에 거칠기처리를 진행했을 경우 미 처리 시 보다 높은 대류 열전달 계수를 얻을 수 있었고, 샌드블라스트 처리 시 약 82.76%의 높은 방열 효율 향상을 얻을 수 있어, 이를 방열판에 적용할 시 큰 경제적 부담 없이 기존대비 더 높은 방열효율 증대를 통해 LED 수명을 대폭 연장 시킬 것으로 기대된다.

• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• 한국전자통신학회논문지
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• 제18권4호
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• pp.641-648
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• 2023

최근 4차 산업 혁명 중에서 인공지능의 급성장은 반도체의 성능 향상 및 회로의 집적을 기반으로 진보하였다. 전자기기 및 장비의 내부에서 연산을 돕는 트랜지스터는 고도화 및 소형화 되어 가며 발열의 제어 및 방열의 효율 개선이 새로운 성능의 지표로 대두되었다. DUT(Device Under Test) Shell은 트랜지스터의 검수를 위하여 정격 전류를 인가한 후, 임의의 발열 지점에서 전원을 차단한 상태에서, 방열을 통하여 트랜지스터의 내구도를 평가하여 불량 트랜지스터를 검출하는 장비이다. DUT Shell은 장비 내부의 방열 구조에 따라 동시에 더 많은 트랜지스터를 테스트할 수 있기 때문에 방열 효율은 불량 트랜지스터 검출 효율과 직접적인 관계를 갖는다. 이에 본 논문에서는 DUT Shell의 방열 최적화를 위하여 배치구조의 다양한 방법을 제안하고 전산유체역학을 이용하여 최적의 DUT Shell의 다양한 변형과 열 해석을 제안하였다.

• 한국전기전자재료학회논문지
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• 제26권12호
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• pp.915-919
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• 2013

This is the study on the development of fusion heat dissipation of carbon magnesium materials. The purpose of this study is for effective utilization of heat emission which is the core of LED lighting. The result of study enabled the derivation of side satisfying result of making the surface temperature of lighting to be below $70^{\circ}C$ (actual measurement: $58^{\circ}C$) using magnesium. The lighting products that use magnesium was made possible based on the result of this study. Also from the performance aspect such as light distribution, the measurement of light efficiency demonstrated the level of 90 lm/W. Therefore the commercialization of lighting was made possible and the efficiency could be further enhanced by supplementation of LED performance.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.110-114
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• 2020

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

• 한국기계가공학회지
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• 제20권6호
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• pp.70-75
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• 2021

Recently, several efforts have been made to improve the thermal efficiency of a refrigerant compressor. In this study, we attempted to improve energy efficiency ratio (EER) performance by reducing the superheat of the linear compressor. To this end, heat generated inside the compressor must be effectively dissipated. Therefore, heat dissipation was improved by processing ribs in the gap-flow region generated owing to the vibration of the compressor body. The results showed that the convective heat transfer coefficient becomes significantly high when ribs are used, increasing the heat dissipation rate. This helps improve EER by reducing the superheat of the compressor.

• Journal of Electrical Engineering and Technology
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• 제12권5호
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• pp.1934-1944
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• 2017

As a key component of high-voltage power conversion system for electric vehicles (EVs), bidirectional DC/DC (Bi-DC/DC) is required to have high efficiency and light weight. Conventional design methods optimize the Bi-DC/DC at the maximum power dissipation point (MPDP). For EVs application, the work condition of the Bi-DC/DC is not strict as the MPDP, where the design method using MPDP may not be optimal during travel of EVs. This paper optimizes the Bi-DC/DC converter targeting efficiency and weight based on the driving cycle. By analyzing the two-phase interleaved Bi-DC/DC for hybrid energy storage systems (HESS) of EVs, its power dissipation is calculated, and an efficiency model is derived. On this basis, weight models of capacitor, inductor and heat sink are built, as well as a dynamic temperature model of heat sink. Based on these models, a method using New European Driving Cycle (NEDC) for optimal design of Bi-DC/DC which simultaneously considered efficiency and weight is proposed. The simulation result shows that compare with conventional optimization methods revealed that the optimization approach based on driving cycle allowed significant weight reduction while meeting the efficiency requirements.

• 한국표면공학회지
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• 제48권2호
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.