• Corrosion Science and Technology
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• v.19 no.1
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• pp.23-30
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• 2020

Heat sinks are most widely used in thermal management systems; however, the heat dissipation efficiency is usually limited. Therefore, in order to increase heat dissipation efficiency of the heat sink, the heat-dissipating paint using 2D materials (hexagonal boron nitride (h-BN) and graphene) as thermally conductive additive was designed and evaluated in the present study. The heat dissipation performance of the paint was calculated from temperature difference between the paint-coated and -uncoated specimens mounted on the heat source. The highest heat dissipation performance was obtained when the ratio of h-BN to resin was 1/10 in the paint. In addition, further reduction in the temperature of the test specimen by 6.5 ℃ was achieved. The highest heat dissipation performance of the paint prepared using graphene was achieved at a 1/50 ratio of graphene to the resin, and a 6.5 ℃ reduction was attained. In addition, graphene exhibited enhanced corrosion resistance property of heat-dissipating paint by inhibiting the growth of the paint blisters.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.3
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• pp.63-69
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• 2022

Compressor efficiency must be improved to reduce refrigerator power consumption. In this study, the heat dissipation rate through the compressor housing is increased via gap flow passages between the compressor body and housing. Four types of gap flow passages are considered for achieving the maximum heat-dissipation rate. In addition, thermal analysis is performed to examine the effect of increased heat dissipation rate on the energy efficiency ratio (EER). The results show that the heat dissipation rate, compressor superheat, and compressor EER increased by up to approximately 52%, 3 ℃, and approximately 1%, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.1
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• pp.170-178
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• 2019

Recently, as the interest in energy savings has increased, there has been increasing use of LED lighting, which is an eco-friendly device that replaces high energy consuming fluorescent lamps and incandescent lamps. In the case of a high output LED, however, the life time is shortened due to deterioration caused by heat generation. As a solution to this problem, this paper evaluated the LED life extension effect by increasing the convective heat transfer coefficient of the heat sink surface for LED packaging. A roughing process was carried out using sandpaper and sand blasting. The changes in surface roughness and surface area after each surface treatment process were evaluated quantitatively and the convective heat transfer coefficient was measured. When sandblasting and sandpaper were used to roughen the aluminum surface, a higher convection heat transfer coefficient was obtained compared to the untreated case, and a high heat dissipation efficiency of 82.76% was obtained in the sandblast treatment. Therefore, it is expected that the application of heat dissipation to the heat sink will extend the lifetime of the LED significantly and economically by increasing the heat efficiency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.4
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• pp.641-648
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• 2023

Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.915-919
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• 2013

This is the study on the development of fusion heat dissipation of carbon magnesium materials. The purpose of this study is for effective utilization of heat emission which is the core of LED lighting. The result of study enabled the derivation of side satisfying result of making the surface temperature of lighting to be below $70^{\circ}C$ (actual measurement: $58^{\circ}C$) using magnesium. The lighting products that use magnesium was made possible based on the result of this study. Also from the performance aspect such as light distribution, the measurement of light efficiency demonstrated the level of 90 lm/W. Therefore the commercialization of lighting was made possible and the efficiency could be further enhanced by supplementation of LED performance.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.110-114
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• 2020

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.6
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• pp.70-75
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• 2021

Recently, several efforts have been made to improve the thermal efficiency of a refrigerant compressor. In this study, we attempted to improve energy efficiency ratio (EER) performance by reducing the superheat of the linear compressor. To this end, heat generated inside the compressor must be effectively dissipated. Therefore, heat dissipation was improved by processing ribs in the gap-flow region generated owing to the vibration of the compressor body. The results showed that the convective heat transfer coefficient becomes significantly high when ribs are used, increasing the heat dissipation rate. This helps improve EER by reducing the superheat of the compressor.

• Journal of Electrical Engineering and Technology
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• v.12 no.5
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• pp.1934-1944
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• 2017

As a key component of high-voltage power conversion system for electric vehicles (EVs), bidirectional DC/DC (Bi-DC/DC) is required to have high efficiency and light weight. Conventional design methods optimize the Bi-DC/DC at the maximum power dissipation point (MPDP). For EVs application, the work condition of the Bi-DC/DC is not strict as the MPDP, where the design method using MPDP may not be optimal during travel of EVs. This paper optimizes the Bi-DC/DC converter targeting efficiency and weight based on the driving cycle. By analyzing the two-phase interleaved Bi-DC/DC for hybrid energy storage systems (HESS) of EVs, its power dissipation is calculated, and an efficiency model is derived. On this basis, weight models of capacitor, inductor and heat sink are built, as well as a dynamic temperature model of heat sink. Based on these models, a method using New European Driving Cycle (NEDC) for optimal design of Bi-DC/DC which simultaneously considered efficiency and weight is proposed. The simulation result shows that compare with conventional optimization methods revealed that the optimization approach based on driving cycle allowed significant weight reduction while meeting the efficiency requirements.

• Journal of the Korean institute of surface engineering
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• v.48 no.2
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.