• 한국기계가공학회지
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• 제16권4호
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• pp.135-139
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• 2017

In recent years, the optical fiber laser has been widely used in industrial fields due to its excellent economical efficiency and its suitability for industrial applications. This usage has increased even further since the KW class Laser was developed. In this paper, structural analysis and heat transfer analysis of a 500W class optical fiber laser end cap module was performed. The stability of end cap housing with the efficient heat dissipation structure of a 500W-class end cap was evaluated. This research determined the optimal design that should be applied to the design and evaluation of future KW class laser output modules.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.89-93
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• 2018

1200V 이상 급의 전기자동차의 파워 모듈에 적용되는 세라믹 기판은 구동 전력으로 고전력이 인가되는 특성상 고열전도도, 고 전기절연성, 저열팽창계수, 급격한 온도 변화에 대한 저항성의 특성이 요구된다. 방열기판에 적용되는 세라믹 중 질화알루미늄과 질화규소는 그 요구를 충족하는 소재로서 고려되고 있다. 이에 따라 본 논문에서는 질화알루미늄과 질화규소의 방열기판 소재로서의 특성을 상용해석프로그램을 통해 비교하였다. 그 결과 질화규소는 질화알루미늄에 대해 각각 동일한 조건의 열을 부여하는 공정을 시물레이션으로 구현했을 때 스트레스와 휨이 덜 발생하여 더 우세한 내충격성, 내stress성을 보였다. 열전도도 측면에서는 질화알루미늄이 방열 소재로서 더 우수한 특성을 지니지만 신뢰성 측면에서는 질화규소가 더 우세함을 시물레이션을 통해 관찰하였다.

• 한국전기전자재료학회논문지
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• 제27권8호
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• pp.541-546
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• 2014

Korea Expressway Corporation established standard of LED lighting fixture in Dec. 2013. To raise compatibility, the standard requires a fixed form and it is applied to street lights and tunnel lights, etc. Because streetlight has different circumstance condition from tunnel light that is down light and exposed to constant wind velocity over height of 8 meters, in case of LED module which has the same shape, characteristic of radiant heat can be different. In this paper, we designed 25 [W] LED Module that is designated by standard of Korea Expressway Corporation and analyzed characteristics of radiant heat about natural convection and forced convection. It is dropped 10.12[$^{\circ}C$] that max temperature is decreased by increasing 20 mm of bended height of heatsink at the condition of natural convection. Radiant heat characteristic of bended height 35 mm became 78.08[$^{\circ}C$] at the condition of natural convection, 55.30[$^{\circ}C$] at the condition of forced convection so that 22.78[$^{\circ}C$] is decreased that is 29.1[%] decrease. Bended height 55mm became 67.96[$^{\circ}C$] at the condition of natural convection, 48.04[$^{\circ}C$] at the condition of forced convection so that 19.92[$^{\circ}C$] is decreased that is 29.3% decrease.

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• 조명전기설비학회논문지
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• 제28권7호
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• pp.19-25
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• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.59-65
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• 2011

소형화, 박형화 및 집적화의 경향에 따라 FCBGA가 휴대폰과 같은 전자제품에 활발히 사용되고 있다. 그러나, 플립칩은 전기적 저항에 의한 열이 필연적으로 발생하며, 발생된 열은 패키지의 소형화에 따라 열의 분산 면적 감소로 인하여 발열의 증가가 나타나게 된다. 발열은 온도와 응력에 민감하게 반응하는 소자의 수명을 저해하고, 시스템에 있어 고장의 발생을 가져올 수 있다. 따라서 본 논문에서는 플립칩의 발열문제를 해결하기 위하여 Comsol 3.5a의 heat transfer module을 이용하여 FCBGA의 발열 특성을 정량적으로 분석하였다. 그리고 열 문제를 해결하기 위하여 시뮬레이션을 통한 새로운 마이크로 구조가 부착된 플립칩을 제안하였다. 또한 마이크로 패턴 구조의 형상, 높이, 간격에 대한 열 소산을 분석함으로써, 기존 플립칩에 비하여 열소산 특성이 18% 향상됨을 확인하였다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.149-154
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• 2018

가로등 및 방폭등용 고출력 LED 조명 시스템의 광원으로서, 다수의 LED 칩이 실장된 50와트급 LED 어레이 모듈을 chip-on-board형 고방열 세라믹-메탈 하이브리드 기판을 사용하여 제작하였다. 고방열 세라믹-메탈 하이브리드 기판은 고열전도 알루미늄 금속 열확산 기판에 저온소결용 글라스-세라믹 절연 페이스트와 은 전극 페이스트를 후막 스크린 공정에 의해 도포한 다음, 건조 후 $515^{\circ}C$에서 동시소성하여 LED 칩을 실장할 세라믹 절연층과 은전극 회로층을 형성하여 제조하였다. 이 하이브리드 기판의 방열특성 평가를 위한 비교 샘플로서 기존의 에폭시 기반 FR-4 복합수지로 만든 써멀비아형 PCB 기판에도 동일한 디자인의 LED 어레이 모듈을 제작한 다음, 다중채널 온도측정장치와 열저항 측정기로 방열특성을 비교 분석하였다. 그 결과, $4{\times}9$ type LED 어레이 모듈에서 세라믹-메탈 하이브리드 기판의 열저항은 써멀비아형 FR-4 기판에 비하여 약 1/3로 나타났으며, 이것은 곧 방열성능이 적어도 3배 이상 높은 것으로 볼 수 있다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• 한국수소및신에너지학회논문집
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• 제26권2호
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• pp.184-191
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• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• 진공이야기
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• 제4권3호
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• pp.16-20
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• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.