• Advances in aircraft and spacecraft science
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• v.2 no.2
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• pp.169-182
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• 2015

Aeronautics engine cooling is one of the biggest problems that engineers have tried to solve since the beginning of human flight. Systems like radiators should solve this purpose and they have been studied extensively and various solutions have been found to aid the heat dissipation in the engine zone. Special interest has been given to air coolers in order to guide the air flow on engine and lower the high temperatures achieved by the engine in flow conditions. The aircraft companies need faster and faster tools to design their solutions so the development of tools that allow to quickly assess the effectiveness of an cooling system is appreciated. This paper tries to develop a methodology capable of providing such support to companies by means of some application examples. In this work the development of a new methodology for the analysis and the design of oil cooling systems for aerospace applications is presented. The aim is to speed up the simulation of the oil cooling devices in different operative conditions in order to establish the effectiveness and the critical aspects of these devices. Steady turbulent flow simulations are carried out considering the air as ideal-gas with a constant-averaged specific heat. The heat exchanger is simulated using porous media models. The numerical model is first tested on Piaggio P180 considering the pressure losses and temperature increases within the heat exchanger in the several operative data available for this device. In particular, thermal power transferred to cooling air is assumed equal to that nominal of real heat exchanger and the pressure losses are reproduced setting the viscous and internal resistance coefficients of the porous media numerical model. To account for turbulence, the k-${\omega}$ SST model is considered with Low- Re correction enabled. Some applications are then shown for this methodology while final results are shown in terms of pressure, temperature contours and streamlines.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• The Transactions of the Korean Institute of Power Electronics
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• v.25 no.5
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• pp.412-419
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• 2020

In this study, a 70 W buck converter using GaN metal-oxide-semiconductor field-effect transistor (MOSFET) is developed. This converter exhibits over 97 % efficiency, high power density, and 48 V-to-12 V/1.2 V/1 V (triple output). Three gate drivers and six GaN MOSFETs are placed in a 1 ㎠ area to enhance power density and heat dissipation capacity. The theoretical switching and conduction losses of the GaN MOSFETs are calculated. Inductances, capacitances, and resistances for the output filters of the three buck converters are determined to achieve the desired current, voltage ripples, and efficiency. An equivalent circuit model for the thermal analysis of the proposed triple-output buck converter is presented. The junction temperatures of the GaN MOSFETs are estimated using the thermal model. Circuit operation and temperature analysis are evaluated using a circuit simulation tool and the finite element analysis results. An experimental test bed is built to evaluate the proposed design. The estimated switch and heat sink temperatures coincide well with the measured results. The designed buck converter has 130 W/in³ power density and 97.6 % efficiency.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.331-337
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• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• Tribology and Lubricants
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• v.18 no.6
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• pp.384-388
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• 2002

The adequate design of a passenger car braking system, which is directly related to the safety of a car, is very important since the safety is an essential design parameter of a car to keep men and car from the damage. The thermal behaviors of the ventilated disk has been investigated based on the air cooling effects during repeat braking operations. In this study, the thermal behavior of ventilated disk brake system was investigated by numerical method. The 3-Dimensional unsteady model was simulated by using a general purpose software package “FLUENT” to obtain the temperature distributions of disk and pad. The model includes the more realistic braking method, which repeats braking and release. The effects of aspect ratio of ventilated hole on the heat dissipation was investigated.

• Proceedings of the KOSOMBE Conference
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• v.1995 no.11
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• pp.47-51
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• 1995

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.350-353
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• 1999

This Paper Presents the optimized design of micro-heaters using 501(Si-on-insulator) substrate and oxide-filled trench structure In order to justify a lumped model approximation and thermal boundary assumptions, two-dimensional FDM(finite difference among which conduction is the dominant heat dissipation path. Compared with no-trenchs on the SOI structure, the micro-heaters with trench structures has properties of low heater loss and good thermal isolation. The simulation results show that the heater loss decreases as the number. width and distance of trenchs increases.

• Journal of Power Electronics
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• v.19 no.1
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• pp.296-306
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• 2019

The flyback topology is being widely used in power adapters. The coupling capacitance between primary and secondary windings of a flyback transformer is the main path for common-mode (CM) noise conduction. A Y-cap is usually used to effectively suppress EMI noise. However, this results in problems in space, cost, and the danger of safety leakage current. In this paper, the CM noise behaviors due to the electric field coupling of the transformer windings in a flyback adapter with synchronous rectification are analyzed. Then a scheme with balance winding is proposed to reduce the CM noise with a transformer winding design that eliminates the Y-cap. The planar transformer has advantages in terms of its low profile, good heat dissipation and good stray parameter consistency. Based on the proposed scheme, with the help of a full-wave simulation tool, the key parameter influences of the transformer PCB winding design on CM noise are further analyzed. Finally, a PCB transformer for an 18W adapter is designed and tested to verify the effectiveness of the balance winding scheme.

• Journal of computational fluids engineering
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• v.13 no.2
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• pp.48-54
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• 2008

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and has been developing by KARI for communication, ocean and meteorological observations. It will be launched by ARIANE 5. Ka-band components are installed on South panel, where single solar array wing is mounted. Radiators, embedded heat pipes, external heat pipe, insulation blankets and heaters are utilized for the thermal control of the satellite. The Ka-band payload section is divided several areas based on unit operating temperature in order to optimize radiator area and maximize heat rejection capability. Other equipment for sensors and bus are installed on North panel. The ocean and meteorological sensors are installed on optical benches on the top floor to decouple thermally from the satellite. During the transfer orbit operation, satellite will be under severe thermal environments due to low dissipation of components, satellite attitudes and LAE(Liquid Apogee Engine) firing. This paper presents temperature and heater power prediction and validation of thermal control design during transfer orbit operation.

• 한국전산유체공학회:학술대회논문집
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• 2007.10a
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• pp.227-231
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• 2007

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and has been developing by KARI for communication and ocean and meteorological observations. It will be launched by ARIANE 5. Ka-band components are installed on South panel, where single solar array wing is mounted. Radiators, embedded heat pipes, external heat pipe, insulation blankets and heaters are utilized for the thermal control of the satellite. The Ka-band payload section is divided several areas based on unit operating temperature in order to optimize radiator area and maximize heat rejection capability. Other equipment for sensors and bus are installed on North panel. The ocean and meteorological sensors are installed on optical benches on the top floor to decouple thermally from the satellite. During the transfer orbit operation, satellite will be under severe thermal environments due to low dissipation of components, satellite attitudes and LAE(Liquid Apogee Engine) firing. This paper presents temperature and heater power prediction and validation of thermal control design during transfer orbit operation.