• International journal of advanced smart convergence
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• v.2 no.2
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• pp.19-22
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• 2013

As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

• Journal of the Korean institute of surface engineering
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• v.46 no.5
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• pp.208-215
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• 2013

The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

• Journal of the Korean Geosynthetics Society
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• v.12 no.1
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• pp.83-92
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• 2013

Backfill material with thermal resistivity which has $50^{\circ}C$-cm/Watt in wet and $100^{\circ}C$-cm/Watt in dry is requested to improve the power transfer capability for dissipation of heat production in underground power cables. In the field test performed by buried cable backfills, the backfill material developed from this study is compared with river sand and weathered soil (native soil) to investigate the effect of heat transfer in various seasons and locations of thermal sensors. As a result, the developed backfill material is faster approaching yielding temperature (critical heat) than that of river sand and weathered soil, and it has good dissipation capacity rather than other materials by keeping moisture content at dry season.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.12
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• pp.1-9
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• 2008

This paper is about l00[W] discrete LED floodlight lighting system, light color and color temperature to be controlled using the 3[W] RGBA LED, is developed the product with optical, heat dissipation, circuit, luminaire and system design. The result, color temperature is changed corresponding to black body locus from 2,000[K] to 10,000[K] and The Color Rendering Index(C.R.I) is achieved from 71 to 91 by high C.RI. Driving voltage is $90{\sim}250[Vac]$, circuit efficiency is 87[%], P.F is more than 93. moreover the LED lens is designed to achieve narrow, middle, wide beam angle, heat dissipation design is executed to minimize variation of luminous output by the surroundings temperature and to ensure reliability.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.35-39
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• 2023

ESG (Environment, Social, Governance) has become a major guideline for many companies to improve corporate value and enable sustainable management. Among them, the environment requires a technological approach. This is because technological solutions are needed to reduce or prevent environmental pollution and save energy. Semiconductor package technology has been developed to better satisfy the essential roles of semiconductor packaging: chip protection, electrical/mechanical connection, and heat dissipation. Accordingly, technologies have been developed to improve heat dissipation effect, improve electrical/mechanical properties, improve chip protection reliability, stacking and miniaturization, and reduce costs. Among them, heat dissipation technology increases thermal efficiency and reduces energy consumption for cooling. Also, technology to improve electrical characteristics has had an impact on the environment by reducing energy consumption. Technologies that recycling or reducing material consumption reduce environmental pollution. And technologies that replace environmentally harmful substances contribute to environmental improvement, in particular. In this paper, I summarize trends in semiconductor package technologies to prevent pollution and improve environment.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.5
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• pp.530-536
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• 2021

This paper presents the performance measurement results of a hybrid sheet with both shielding and heat dissipation functions developed by laminating copper mesh sheets and natural graphite sheets, which are used widely as electromagnetic shielding and heat-dissipating materials in electronic devices, without a pressure-sensitive adhesive (PSA). The results were compared by measuring the vertical and horizontal thermal conductivity with two other products to confirm the heat dissipation performance. A radiation emission test confirmed the electromagnetic shielding performance using a 3m electromagnetic anechoic chamber according to the CISPR 11 standard. In the case of vertical thermal conductivity, the proposed hybrid sheet was approximately 8.63 times higher than that of an aluminum sheet with heat dissipation coating and 18.7 times higher than that of a copper sheet laminated with artificial graphite with PSA. The proposed hybrid sheet was approximately 0.64 times that of the sheet, and approximately 1.76 times that of the heat-dissipated aluminum sheet in case of horizontal thermal conductivity. Measurements after applying each sheet in the same heat source revealed the proposed hybrid sheet to have the best heat dissipation performance. The radiation emission test showed that significantly radiation noise had been removed.

• Journal of Magnetics
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• v.21 no.1
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• pp.153-158
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• 2016

This paper aims to discuss the Non Darcy boundary layer flow of non-conducting viscous fluid with magnetic ferroparticles over a permeable linearly stretching surface with ohmic dissipation and mixed convective heat transfer. A magnetic dipole is applied "a" distance below the surface of stretching sheet. The governing equations are modeled. Similarity transformation is used to convert the system of partial differential equations to a system of non-linear but ordinary differential equations. The ODEs are solved numerically. The effects of sundry parameters on the flow properties like velocity, pressure, skin-friction coefficient and Nusselt number are presented. It is deduced the frictional resistance of Lorentz force decreases with stronger electric field and the trend reverses for temperature. Skin friction coefficient increase with increase in ferromagnetic interaction parameter. Whereas, Nusselt number decrease.

• Nuclear Engineering and Technology
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• v.49 no.8
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• pp.1654-1659
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• 2017

The boundary layer of a two-dimensional forced convective flow along a persistent moving horizontal needle in an electrically conducting magnetohydrodynamic dissipative nanofluid was numerically investigated. The energy equation was constructed with Joule heating, viscous dissipation, uneven heat source/sink, and thermal radiation effects. We analyzed the boundary layer behavior of a continuously moving needle in Blasius (moving fluid) and Sakiadis (quiescent fluid) flows. We considered Cu nanoparticles embedded in methanol. The reduced system of governing Partial differential equations (PDEs) was solved by employing the Runge-Kutta-based shooting process. Computational outcomes of the rate of heat transfer and friction factors were tabulated and discussed. Velocity and temperature descriptions were examined with the assistance of graphical illustrations. Increasing the needle size did not have a significant influence on the Blasius flow. The heat transfer rate in the Sakiadis flow was high compared with that in the Blasius flow.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.269-273
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• 2003

In this paper the HTS current lead for superconducting device is studied numerical method. The current lead is cooled by surrounded He gas by natural convection. To find wall heat flux, the linearization method is adopted Numerical results using natural convection cooling are compared with conventional cooling methods such as conduction cooling and vapor cooling. The results shows that the minimum heat dissipation is much smaller than conduction cooling. Also, the minimum heat dissipation is obtained for the non-zero gradient of temperature at warm end. HTS current lead operating current sharing mode is reduce heat flow to superconducting system.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.