• Korean Journal of Materials Research
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• v.23 no.12
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• pp.672-679
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• 2013

$Fe_4[Fe(CN)_6]_3$ coated on a mica or $TiO_2$/mica surface as infrared reflective blue pigment was prepared by a hydrothermal method. $Fe_4[Fe(CN)_6]_3$, used as coloring agent, was uniformly coated on mica or $TiO_2$/mica under the optimized condition of a 1.2 : 1 weight ratio between iron(III) chloride hexahydrate and potassium ferrocyanidetrihydrate at the initial pH level of 4.5 at $70^{\circ}C$. The infrared (IR)-reflective pigments were characterized by SEM, Zeta-potenial, FT-IR, and UV-VIS NIR spectrophotometry. Especially the CIE color coordinate and total solar reflectance(TSR) properties of the pigments were investigated in relation to variation of the coating and coated substrate thicknesses. Isolation-heat paint was prepared with 20 wt% blue pigments fully dispersed in acryl-urethane resin and several additives to coat the film uniformly. The films were also measured with CIE color coordinate, TSR, and the surface temperature was recorded by an isolation-heat measuring system. The pigments and films of $Fe_4[Fe(CN)_6]_3$ coated on mica and $TiO_2$/mica showed high TSR values compared with the TSR value of $Fe_4[Fe(CN)_6]_3$ itself. According to the increase of TSR value, the property of isolation-heat is effective. To realize the optimal blue color, we applied the the pigment to $TiO_2$ coated mica(TM(b)) which has blueish interference color. The pigment of $Fe_4[Fe(CN)_6]_3$ coated on TM(b) shows a strong blue color compared with that of $Fe_4[Fe(CN)_6]_3$ coated on $TiO_2$/Mmca(TM(w)), which has a whitish interference color.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Applied Chemistry for Engineering
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• v.23 no.1
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• pp.71-76
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• 2012

Biofouling by marine organisms such as algae and barnacles causes lots of significant problems in marine systems such as a rise of the maintenance-repair cost for the ship and the marine structures. In this work, a fluoropolymer, perfluoropolyether (PFPE), was applied as an anti-biofouling coating material that prevents the adhesion of marine organisms and facilitates the removal of them. Water contact angles of various surfaces were tested to examine the hydrophobicity of the PFPE-modified surface. The PFPE-modified surface showed the water contact angle of $64.5^{\circ}$ which is a remarkable rise from $46.7^{\circ}$ of amine-treated surface. When the substrate was treated with PFPE, the adhesion on the of the barnacle and other marine organisms were repressed around 15% by the enhanced hydrophobicity. In addition, the removal the of the adhered marine organisms were better comparing to that of the surface prepared by PDMS. Surfaces of the substrate treated by PFPE were characterized through physical and chemical methods to analyze the biofouling results. Degree of biomolecular adhesion to the substrate was quantified by the measurement the fluorescence intensity of marine organisms dyed with green fluorescence. PFPE is expected to be applicable not only to anti-biofouling systems but also to medical devices where the prevention of protein adhesion is required.

• The Journal of Korean Academy of Prosthodontics
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• v.45 no.5
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• pp.589-600
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• 2007

Statement of Problem: Titanium has many advantages of high biocompatibility, physical porperties, low-weight, low price and radiolucency, but it is incompatible with conventional dental porcelain due to titanium's oxidative nature. Many previous studies have shown that they used the method of sandblast surface treatment prior to porcelain application, the researchs are processing about the method of acid etching or surface coating. Purpose: The purpose of this research is to study the effect on bond strength between titanium and porcelain when using macro-surface treatment and micro-surface treatment and macro and micro surface treatment. Material and method: In this study, we evaluated the bond strength by using 3-point bending test based on ISO 9693 after classified 7 groups-group P : polished with #1200 grit SiC paper, group SS : sandblasted with $50{\mu}m$ aluminum oxides, group LS : sandblasted with $250{\mu}m$ alumium oxides, group HC : treated with 10% hydrochloric acid, group NF : treated with 17% solution of fluoric acid and nitric acid, group SHC : treated with 10% hydrochloric aicd after sandblsting with $50{\mu}m$ alumium oxides, group SNF treated with 17% solution of fluoric acid and nitric acid. Results : Within the confines of our research, the following results can be deduced. 1. Group SS which was sandblasted with $50{\mu}m$ aluminum oxides showed the highest bond strength of 61.74 MPa and significant differences(P<0.05). The bond strengths with porcelain in groups treated acid etching after sandblasting decreased more preferable than the group treated with sandblasting only. It gives significant differences(P<0.05). 2. After surface treatments, the group treated with sandblasting showed irregular aspect formed many undercuts, in the SEM photographs. The group treated with hydrochloric acid had the sharp serrated surfaces, the group treated with the solution of fluoric acid and nitric acid had the smooth surfaces, the group with sandblasting and hydrochloric acid had irrigular and porous structure, the group with sandblasting and the solution of fluoric acid and nitric acid had crater-like surfaces. But all of the groups treated with acid etching was not found and undercut. Conclusion: In above results, average surface roughness increase, bond strength also increase, but surface topographs influences more greatly on bond strengths.

• Journal of the Korean Chemical Society
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• v.52 no.1
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• pp.57-65
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• 2008

are nanometer or micrometer scale vesicles that can be used as drug delivery carriers. However, plain liposomes are plagued by rapid opsonization, making their circulation time in bloodstream be shortened. In this study, model protein, bovine serum albumin (BSA)-coated liposomes were prepared by coating cationic liposomes with BSA molecules at higher pH than isoelectric point of BSA. The BSA molecules coated on the liposomal surface were denatured by thermal treatment at above 60oC. While both plain and cationic liposomes had about mean particle diameter of 1041 nm, BSA-coated cationic liposomes (BCL) had mean particle diameter of 1091 nm. Encapsulation of model drug, doxorubicin (DOX), in liposomes were carried out by using remote loading method and the loading efficiency of DOX to liposomes was about 90%. The mean particle diameter of BCL did not increase in blood plasma and adsorption of plasma protein was much less than plain or cationic liposomes. These results suggest that BCL can be used as a long-circulating liposomes in bloodstream.

• Bulletin of the Korean Chemical Society
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• v.30 no.8
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• pp.1719-1723
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• 2009

The LiFeP$O_4$ powder was synthesized by using the solid state reaction method with Fe($C_2O_4){\cdot}2H_2O,\;(NH_4)_2HPO_4,\;Li_2CO_3$, and chitosan as a carbon precursor material for a cathode of a lithium-ion battery. The chitosan added LiFePO4 powder was calcined at 350 ${^{\circ}C}$ for 5 hours and then 800 ${^{\circ}C}$ for 12 hours for the calcination. Then we calcined again at 800 ${^{\circ}C}$ for 12 hours. We characterized the synthesized compounds via the crystallinity, the valence states of iron ions, and their shapes using TGA, XRD, SEM, TEM, and XPS. We found that the synthesized powders were carbon-coated using TEM images and the iron ion is substituted from 3+ to 2+ through XPS measurements. We observed voltage characteristics and initial charge-discharge characteristics according to the C rate in LiFeP$O_4$ batteries. The obtained initial specific capacity of the chitosan added LiFeP$O_4$ powder is 110 mAh/g, which is much larger than that of LiFeP$O_4$ only powder.

• Korean Journal of Optics and Photonics
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• v.24 no.5
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• pp.224-230
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• 2013

Laser Lift-Off (LLO) is a process that removes a GaN or AIN thin layer from a sapphire wafer to manufacture vertical-type LEDs. It consists of a light source, an attenuator, a mask, a projection lens and a beam homogenizer. In this paper, we design an attenuator and a projection lens. We use the 'ZEMAX' optical design software for analysis of depth of focus and for a projection lens design which makes $7{\times}7mm^2$ beam size by projecting a beam on a wafer. Using the 'LightTools' lighting design software, we analyze the size and uniformity of the beam projected by the projection lens on the wafer. The performance analysis found that the size of the square-shaped beam is $6.97{\times}6.96mm^2$, with 91.8 % uniformity and ${\pm}30{\mu}m$ focus depth. In addition, this study performs dielectric coating using the 'Essential Macleod' to increase the transmittance of an attenuator. As a result, for 23 layers of thin films, the transmittance total has 10-96% at angle of incidence $45-60^{\circ}$ in S-polarization.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.58 no.1
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• pp.8-14
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• 2013

The newly developed fertilizer is the slow-releasing fertilizer which can be used as a basal fertilizer without no additional fertilization at tillering stage. It has 30-4-6% of $N-P_2O_5-K_2O$ and was coated with mixture of LDPE (Low density polyethylene), EVA (Ethylene vinyl acetate), BDP (Bio degraded polymer), TALC and nonionic surfactant for the controlled release up to 50 days after application. Coating materials were designed to be decomposed naturally. This fertilizer can be applied directly to the seedling tray mechanically just before transplanting, resulting in significant labor saving effect. The developed slow-release fertilizer, which can replace both basal fertilization and top dressing at tillering stage by single application directly to seedling tray, showed the highest release at 14~21 days after transplanting. Considering the plant growth at different growth stages and yield, the optimal application rate of developed slow-release fertilizer was 300 g per rice nursery tray and the yield of rice at this application rate was 5.25 MT/ha. Rice quality in terms of head rice grain ratio, amylose content, whiteness, and taste value decreased as fertilization rate increased from 200 g to 500 g per nursery tray. Fertilization rate based on quantity of fertilizer ingredients (N, P, K) was reduced by 49.3% compared to the standard application rate and there was 49.2% reduction in labor input for fertilization.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.32 no.4
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• pp.420-426
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• 1999

We examined the immune response in flounder, Paralichthys olivaceus, with immunization of formalin killed Edwardsiella tarda as an antigen. The ELISPOT-assay (enzyme-linked immunospot assay) was optimized technically and applied to count the number of total and specific antibody secreting cells (TASC and SASC) in lymphocytes of different lymphatic organs. Incubation of lymphocytes on 96 well plate for more than 2.5hrs came out enough time in ELISPOT-assay for counting the antibody secreting cells in the anterior kidney and spleen. However, too much of plate-coated antigen or rabbit anti-flounder immunoglobulin for SASC or TASC counting, respectively, was appeared to decrease the sensitivity of the assay system. Specificity of the system was also confirmed by the absence of TASC in lymphocytes treated with cycloheximide to prevent protein synthesis. The peak numbers of SASC appeared at wk 3 post immunization after that there was a sharp decrease and reached to almost zero at wk 7. In the spleen and kidney, the timing and numbers of SASC on peak response were concurrent without preferential organ distribution. The specific antibody level in the sera increased rapidly between wk 2 and 3 after immunization, i.e. like the specific cellular response found with ELISPOT-assay on that period, However, the remained high level of specific serum antibody from wk 5 after immunization until the end of experiment was clearly distinguishable from the kinetics of SASC response decreased sharply.

• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.9-14
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• 2019

The change of three different reagents for electrical conductive paint using aircraft coating with elapsing time of exposure to different condition was investigated. Three different reagents were poured into the vial bottles, stored in air condition and room temperature and observed with elapsing days. In addition, adhesion property of paint was tried using cross cut tape test after storage of $N_2$ atmosphere. The weight of each different reagent was measured along with elapsing time. To confirm the change of chemical component with exposure of air atmosphere, FT-IR was performed. The weight of part A and Part B decreased slightly whereas the weight of part C decreased rapidly and the precipitation was remained. The part B was cured after exposure of $N_2$ atmosphere and the 2250 cm-1 from FT-IR peak decreased slowly at the same time. It was considered that the water contained in air accelerated the reaction of -NCO functional groups and it caused the curing whereas $N_2$ atmosphere not contained water and it resulted in the retardancy of curing.