• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.58-58
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• 1999

The diamond films which can be applied to SOD (silicon-on-diamond) structure were deposited on Si(100) substrate using CO/H2 CH4/H2 source gases by microwave plasma chemical vapor deposition(MPCVD), and SOD structure have been fabricated by poly-silicon film deposited on the diamond/Si(100) structure y low pressure chemical vapor deposition(LPCVD). The phase of the diamond film, surface morpholog, and diamond/Si(100) interface were confirmed by X-ray diffraction(XRD), scanning electron microscopy(SEM), atomic force microscopy(AFM), and Raman spectroscopy. The dielectric constant, leakage current and resistivity as a function of temperature in films are investigated by C-V and I-V characteristics and four-point probe method. The high quality diamond films without amorphous carbon and non-diamond elements were formed on a Si(100), which could be obtained by CO/H2 and CH4/H2 concentration ratio of 15.3% and 1.5%, respectively. The (111) plane of diamond films was preferentially grown on the Si(100) substrate. The grain size of the films deposited by CO/H2 are gradually increased from 26nm to 36 nm as deposition times increased. The well developed cubo-octahedron 100 structure nd triangle shape 111 are mixed together and make smooth and even film surface. The surface roughness of the diamond films deposited by under the condition of CO/H2 and CH4/H2 concentration ratio of 15.3% and 1.5% were 1.86nm and 3.7 nm, respectively, and the diamond/Si(100) interface was uniform resistivity of the films deposited by CO/H2 concentration ratio of 15.3% are obtained 5.3, 1$\times$10-9 A/cm, 1 MV/cm2, and 7.2$\times$106 $\Omega$cm, respectively. In the case of the films deposited by CH4/H2 resistivity are 5.8, 1$\times$10-9 A/cm, 1 MV/cm, and 8.5$\times$106 $\Omega$cm, respectively. In this study, it is known that the diamond films deposited by using CO/H2 gas mixture as a carbon source are better thane these of CH4/H2 one.

• Korean Journal of Materials Research
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• 제8권11호
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• pp.1067-1073
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• 1998

High quality diamond films of the silicon on diamond (SOD) structure are deposited using CO and $H_2$ gas mixture in microwave plasma chemical vapor deposition (CVD), a SOD structure is fabricated using low pressure CVD polysilicon on diamond/ Si(100) substrate. The crystalline structure of the diamond films which composed of { 111} and {100} planes. were changed from octahedral one to cubo-octahedron one as the CO/$H_2$ ratios are increased. The high quality diamond films without amorphous carbon and non-diamond elements were deposited at the CO/$H_2$ flow rate of 0.18. and the main phase of the diamond films shows (111) plane. The diamond/Si(lOO) structure shows that the interface is flat without voids. The measured dielectric constant. leakage current and breakdown field were $5.31\times10^{-9}A/cm^2$ and $9\times{10^7}{\Omega}cm$ respectively.

• Korean Journal of Crystallography
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• 제3권2호
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• pp.98-110
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• 1992

B-SiC thin films were fabricated on Si(100) substrate under 1 atom by fVD. The effects of deposition conditions on the growth and the properties especially crystallinity and prefer ential alignment of these thin films were investigated. SiH4 and CH4 were used as source gases and H2 as Carrier gas. Th9 growth Of B-SiC thin films with changing parameters such as the growth temperature, the ratio of source gases (SiH4/CH4 ) and the total amount of source gases. The grown thin films were characterized by using SEM, a -step, XRD, Raman Spectro- scopy and TEM. Chemical conversion process improved the quality of thin films due to the formation of SiC buffer layer. The crystallinity of SiC thin films was improved when the growth temperature was higher than l150t and the amount of CH4 exceeded that of SiH4. The better crystallinity, the better alignment to the crystalline direction of substates. TEM analyses of the good quality thin films showed that the grain size was bigger at the surface than at the interface and the defect density is not depend on the ratio of the source gases.

• Bulletin of the Korean Chemical Society
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• 제28권4호
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• pp.533-537
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• 2007

This paper describes the heteroepitaxial growth of single-crystalline 3C-SiC (cubic silicon carbide) thin films on Si (100) wafers by atmospheric pressure chemical vapor deposition (APCVD) at 1350 oC for micro/nanoelectromechanical system (M/NEMS) applications, in which hexamethyldisilane (HMDS, Si2(CH3)6) was used as a safe organosilane single-source precursor. The HMDS flow rate was 0.5 sccm and the H2 carrier gas flow rate was 2.5 slm. The HMDS flow rate was important in obtaing a mirror-like crystalline surface. The growth rate of the 3C-SiC film in this work was 4.3 μm/h. A 3C-SiC epitaxial film grown on the Si (100) substrate was characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), reflection high energy electron diffraction (RHEED), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and Raman scattering, respectively. These results show that the main chemical components of the grown film were single-crystalline 3C-SiC layers. The 3C-SiC film had a very good crystal quality without twins, defects or dislocations, and a very low residual stress.

• Journal of the Korean Magnetics Society
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• 제11권4호
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• pp.146-150
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• 2001

The effect of H$_2$ content in Ar sputtering gas on exchange coupling field(H$_{ex}$) for NiFe/FeMn interface was studied. When NiFe layer of Si(100)/Ta(50 $\AA$)/NiFe(60 $\AA$)/FeMn(250 $\AA$)Ta(50 $\AA$) was deposited at 8% H$_2$ in sputtering gas, the maximum exchange coupling field(H$_{ex}$) and minimum coercivity(H$_{c}$) were obtained. When Si(100)/Ta(50 $\AA$)/NiFe(60 $\AA$)/FeMn(250 $\AA$)/NiFe(70 $\AA$)/Ta(50 $\AA$) was deposited at 5% H$_2$ in sputtering gas, the maximum exchange coupling field(H$_{ex}$) of 148 Oe was obtained. The (111) preferred orientation and grain size of underlayer NiFe were increased and the internal stress was reduced by H$_2$ in sputtering gas. And the (111) preferred orientation and grain size of FeMn layer were also increased.d.ased.

• Journal of the Korean Vacuum Society
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• 제2권3호
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• pp.360-367
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• 1993

텅스텐 박막 증착의 메카니즘을 밝히기 위하여 먼저 SiH4와 WF6의 열분해 반응에 관한 열역학적 결과들과 표면 촉매 반응에 대한 이론적인 결과들을 고찰하였다. 실험적으론 저압 화학기상 증착법을 이용하여 WF6를 SiH4로 환원시켜 텅스텐 박막을 Si(100) 기판위에 증착하였으며 증착반응 중의 기판 표면의 변화를 in-situ로 측정하였다. 증착 메카니즘을 밝히기 위하여 반응기체를 WF6, SiH4, WF6＋SiH4, WF6$\longrightarrow$SiH4$\longrightarrow$WF6＋SiH4로 달리하여 반응시켰으며 그 때의 박막 특성과 표면 및 단면 형상을 측정하였다. 이론적인 고찰과 실험적인 결과들로부터 텅스텐 박막은 먼저 Si 기판에 의한 WF6의 환원반응으로 인한 증착과 이어서 SiH4에 의한 WF6의 환원으로 증착됨을 밝혔다.

• Journal of the Korean Institute of Telematics and Electronics
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• 제23권6호
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• pp.754-757
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• 1986

Boron monophosphide(100) was eitaxially grown on Si(100) substrate by thermal reaction of B2H6 and PH3 in hydrogen ambient. In an LPCVD system, the growth condition was studied as a function of gas mixture composition and temperature. For the growth temperature of 950\ulcorner in the constant flow rate (partial pressure) of B2H6, n-BP with c(2x2) surface structure was obtained in the PH3 partial pressure of 300-500 cc/min. On the other hand, for the growth temperature of 1080\ulcorner, p-BP with surface structure was observed for the PH3 partial pressure of 400-500cc/min.

• Journal of the Korean Crystal Growth and Crystal Technology
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• 제8권1호
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• pp.29-35
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• 1998

Substrates, SiC raw materials and graphite crucibles were purified for growing the high quality 6H-SiC single crystal ingot. Especially, XRD data of raw materials were analyzed before and after purification. We have grown 6H-SiC single crystal ingot up to 33 mm in diameter and 11 mm in length and SiC wafer for using the substrate and observing the internal defects was about 33 mm in diameter and 0.5 mm in thickness. Utilizing optical microscpe and Raman spectroscopy, internal defects density and crystallinity of the SiC wafer obtained by purification processes before crystal growth were measured. As a result, micropipe density and planar defect density were 100/$\textrm{cm}^2$ and 30/$\textrm{cm}^2$ respectively. Therefore, high quality 6H-SiC single crystal could be grown because internal defects density of 6H-SiC single crystal ingot was decreased by the purification processes before crystal growth.

• Proceedings of the Materials Research Society of Korea Conference
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• 한국재료학회 2002년도 추계학술발표강연 및 논문개요집
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• pp.88-88
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• 2002

• Electrical & Electronic Materials
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• 제16권9호
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• pp.63.2-64
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• 2003

Epitaxial yttrium-stabilized HfO$_2$ thin films were deposited on p-type (100) Si substrates by pulsed laser deposition at a relatively lower substrate temperature of 550. Transmission electron microscopy observation revealed a fixed orientation relationship between the epitaxial film and Si; that is, (100)Si.(100)HfO$_2$ and [001]Si/[001]HfO$_2$. The film/Si interface is not atomically flat, suggesting possible interfacial reaction and diffusion, X-ray photoelectron spectrum analysis also revealed the interfacial reaction and diffusion evidenced by Hf silicate and Hf-Si bond formation at the interface. The epitaxial growth of the yttrium stabilized HfO$_2$ thin film on bare Si is via a direct growth mechanism without involoving the reaction between Hf atoms and SiO$_2$ layer. High-frequency capacitance-voltage measurement on an as-grown 40-A yttrium-stabilized HfO$_2$ epitaxial film yielded an dielectric constant of about 14 and equivalent oxide thickness to SiO$_2$ of 12 A. The leakage current density is 7.0${\times}$ 10e-2 A/$\textrm{cm}^2$ at 1V gate bias voltage.