• Title/Summary/Keyword: Grinding rate

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Optimal Control System of Traverse Grinding (트래버스 연삭의 최적 제어시스템)

  • Choi, Jeongju
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.12
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    • pp.5704-5708
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    • 2012
  • In this paper, the algorithm to determine the optimal condition of traverse grinding is proposed by using differential evolution algorithm(DEA). The cost function to determine the optimal grinding condition is designed with considering process cost, production rate, surface roughness. Also, the constraint conditions for grinding such as thermal damage effect, machine tool stiffness, wear parameter of grinding wheel, surface roughness are considered. The algorithm is implemented with LabView software which is widely used at the industrial field. The performance of proposed algorithm is verified by comparing with the result of genetic algorithm(GA) through computer simulation.

Optimum Grinding Condition for Electroplated Diamond Wheel in Form Grinding of Ferrite (페리이트의 총형 연삭에서 전착 다이아몬드 연삭숫돌의 최적 연삭조건)

  • 김성청;이재우;김관우;한상욱;황선희
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.29-33
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    • 1996
  • This paper aims to clatify the potimum grinding condition for the electroplated diamond wheel in form grinding of Sr-ferrite. The main conclusions obtained were as follows. (1) The flexural strength and surface roughness of ferrite became the highest at the peripheral wheel speed of 1700m/min. (2) In the case of depth of cut larger than 0.4mm, crack layers is induced in the ground surface, the fracture type of chips exhibits slight ductile mode in the depth of cut smaller than 0.2mm. (3) When the depth of cut exceed 0.6mm, the tool life becomes extermely short due to large chipping and brackage. However, at the depth of cut .geq. 0.05mm, the diamond grain shows abrasive wear. (4) The flexural strength and surface roughness increases in proportion to the feed rate.

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Properties of Mirror-surface Grinding for Metal Matrix Ceramic Composites (금속기지 세라믹 복합소재의 경면연삭 가공 특성)

  • Kwak, Tae-Soo
    • Journal of the Korean Ceramic Society
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    • v.49 no.1
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    • pp.90-94
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    • 2012
  • This study has been focused on properties of mirror surface grinding technology by ELID(Electrolytic In-process Dressing) for metal matrix ceramic composites using in high precision mirror for optics. The experimental studies have been carried out to get mirror surface by grinding for composites, Al-SiC, Al-graphite and Mg-SiC. Grinding process is carried out with varying abrasive mesh type, depth of cut and feed rate using diamond wheel. The machining result of the surface roughness and condition of ground surface, have been analyzed by use of surface roughness tester and SEM measurement system. ELID grinding technology could be applied successfully for the mirror-surface manufacturing processes in spite of ductility of metal matrix material. As the results of experiments, surface roughness of Al-SiC(45 wt%) has been the most superior in these experimental work-pieces as 0.021 ${\mu}m$ Ra.

Trouble Diagnostic Method in Grinding Process (연삭가공의 이상상태 진단 기법)

  • 곽재섭
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.20-27
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    • 2000
  • A chatter vibration and a workpiece burn are the main phenomena to be monitored in modern grinding processes. This study describes a trouble diagnosis of the cylindrical plunge grinding process using the power and acoustic emission (AE) signals. The raw signals of the power and the AE occurred during the grinding operation were sampled and analyzed to determine the relationship between each fault and change of signals. A neural network that has a high success rate of the fault detection was used. Furthermore, an analysis on the influence of parameters to the chatter vibration and the grinding burn was conducted.

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Effect of Polishing Grinding Conditions on Alkali-free Glass (무 알칼리 유리의 연마 조건에 따른 영향)

  • Park, Younghee;Hong, Minsung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.6
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    • pp.440-444
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    • 2016
  • Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.

Grindability of Ti-10%Zr-X%Cr(X=0,1,3) Alloys for Dental Applications (치과용 Ti-10%Zr-X%Cr(X=0,1,3)합금의 연삭성)

  • Jung, Jong-Hyun;Shin, Jae-Woo
    • Journal of Technologic Dentistry
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    • v.35 no.4
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    • pp.295-302
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    • 2013
  • Purpose: The grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys in order to develop Ti alloys for dental applications with better machinability than unalloyed titanium has been evaluated. Methods: Experimental Ti-10%Zr-X%Cr(X=0,1,3) alloys were made in an argon-arc melting furnace. Slabs of experimental alloys were ground using a SiC abrasive wheel on an electric handpiece at one of the four rotational speeds of the wheel (12000, 18000, 25000 or 30000rpm) by applying a force(100gf). Grindability was evaluated by measuring the amount of metal volume removed per minute(grinding rate) and the volume ratio of metal removed compared to the wheel material lost, which was calculated from the diameter loss (grinding ratio). Experimental datas were compared the results with those of cp-Ti(commercially pure titanium) Results: It was observed that the grindability of Ti-10%Zr-X%Cr(X=0,1,3) alloys increased with an increase in the Cr concentration. More, they are higher than cp-Ti, particularly the Ti-10%Zr-3%Cr alloy exhibited the highest grindability at all rotational speeds except 12000rpm. There was significant difference in the grinding rate and grinding ratio between Ti-10%Zr-3%Cr alloy and cp-Ti at all rotational speeds(p<0.05). Conclusion: The Ti-10%Zr-3%Cr alloy exhibited better grindability at high rotational speeds, great potential for use as a dental machining alloy.

Development of Ultrasonic Grinding Wheel for Hybrid Grinding System (하이브리드 연삭시스템 초음파 공구 개발)

  • Kim, Kyeong Tae;Hong, Yun Hyuck;Park, Kyung Hee;Lee, Seok Woo;Choi, Hon Zong;Choi, Young Jae
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.11
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    • pp.1121-1128
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    • 2013
  • Ultrasonic grinding system is that the ultrasonic vibration by ultrasonic actuator is applied on conventional grinding system during grinding process. The Ultrasonic vibration with a frequency of over 20kHz can reduce grinding forces and increase surface quality, material removal rate (MRR) and grinding wheel life. In addition, ultrasonic vibration assisted grinding can be used for the materials that are difficult to cut. In this paper, methodology for ultrasonic tools is studied based on finite element method, and in turn the ultrasonic tools are designed and fabricated. It is found that the ultrasonic tool can vibrate with a frequency of 20kHz and amplitude of $25{\mu}m$. In order to verify the machining performance, the grinding experiment is performed on titanium alloy. By applying ultrasonic vibration, the grinding force and temperature are reduced and MRR is increased compared with the conventional grinding.

A Study on the Machining Characteristics of CVD-SiC (CVD-SiC 소재의 가공 특성에 관한 연구)

  • Park, Hwi-Keun;Lee, Won-Seok;Kang, Dong-Won;Park, In-Seung;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.5
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    • pp.40-46
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    • 2017
  • A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

Cut-off Grinding Characteristics of the Carbon Fiber Epoxy Composite Materials (탄소 섬유 에폭시 복합재료의 절단 연삭 특성)

  • Kim, Po-Jin;Choe, Jin-Gyeong;Lee, Dae-Gil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.2 s.173
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    • pp.338-346
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    • 2000
  • Although the net-shape molding of composites is generally recommended, molded composites are frequently required cutting or grinding due to the dimensional inaccuracy for precision machine elements . During the composite machining operations such as cutting and grinding, the temperature at the cutting point may increase beyond the allowed limit due to the low thermal conductivity of composites, which might degrade the matrix of composite. Therefore, in this work, the temperature at the cutting point during cut-off grinding of carbon fiber epoxy composites was measured. The cutting force and surface roughness were also measured to investigate the cut-off grinding characteristics of the composites. The experiments were performed both under dry and wet grinding conditions with respect to cutting speed and feed rate. From the experimental investigation, the optimal conditions for the composite cut-off grinding were suggested.

A Study on the Ultrasonic In-Process Dressing Method of CBN Grinding Wheel (CBN 연삭숫돌의 초음파 인프로세스 드레싱 기법)

  • 이석우;정해도;최헌종
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.2
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    • pp.43-50
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    • 2000
  • A CBN wheel was used for the highly efficient and precision grinding of the mold material(STD11). The grinding form accuracy by a CBN wheel is very excellent due to its low wheel wear, but grinding fragments resemble fine powders rather chips. A fine powders by this fragmentation can easily get attached to the wheel surface and therefore causing a loading. In order to prevent this fragmentation phenomena, the alumina stick is use to processing. Because the dressing with alumina stick should be interrupted for a processing, the automation of the processing and high productivity was very difficult. The investigation on the effect of Ultrasonic In-Process Dressing(ULID) on the grinding characteristics focuses in this Paper. This ULID method is that ultrasonic vibration in my Position of wheel is used to remove impurities on the wheel surface. Finally, the rate of surface roughness change in grinding by the ULID method was less than grinding without ultrasonic vibration. Loading phenomena by the ULID method were more prevented than grinding without ultrasonic vibration.

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