• Journal of Electrical Engineering and Technology
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• v.13 no.2
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• pp.761-768
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• 2018

In this paper, the performance analysis of a control topology based on the direct output power control (DPC) for robust and inexpensive permanent magnet-assisted synchronous reluctance generator (PMa-SynRG) system is presented. The PMa-SynRG might be coupled to an internal combustion engine running at variable speed. A three-phase PWM rectifier rectifies the generator output and supplies the dc link. A single-phase PWM inverter supplies constant ac voltage at constant frequency to the grid. The overall control algorithm is implemented on a TMS320F2812 digital signal processor board. Simulations results and experimental results verify the operation of the proposed system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• Korean Institute of Interior Design Journal
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• v.20 no.6
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• pp.218-227
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• 2011

Korean commercial architecture is based on two distinctive characteristics of western modern architecture: grid frame structure and free facade. However, the original facade of the building disappears as numbers of commercial advertisements and signboards representing inner programs cover up the original facade. This is a unique feature of commercial architecture in Korea which I would call the surface phenomena of Korean commercial architecture. Common criticism on this type of building is that too many and too big signboards infringe upon the original pure facade of the architecture. Underlying assumption here is that signboards and commercial ads are inessential and decorative elements simply attached to the original pure facade of modern architecture. However, in this paper, I argue that commercial decorations is an essential aspect of korean commercial architecture rather than an inessential decorative element attached later to the essential facade of architecture and that it reflects the historical specificity of cultural and architectural modernity of Korea And thus, the surface phenomena of Korean commercial architecture should not be judged based upon the aesthetic paradigms of either western modern or postmodern architecture. Rather, it can be argued that surface phenomena of Korean commercial architecture is a reflection of a modernity beyond the paradigm of western modernism and postmodernism. The agenda of Korean commercial architecture is then not simply to restrict or to control signboards on the building facades with the intention to clean up facade of the building but rather to integrate the signs and commercial ads with the structure of architectural surface.

• Journal of Korea Society of Industrial Information Systems
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• v.27 no.1
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• pp.27-35
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• 2022

In the most IPS (Indoor Positioning System), it is available to specify the user's movement by sending a specific signal from a tag such as a beacon to multiple receivers. This method is very efficiently used in places where the number of people is limited. On the other hand, in large commercial facilities, it is nearly difficult to apply the existing IPS method because it is necessary to attach a tag to each customer. In this paper, we propose a system that uses an external sensor grid to identify people's movement without using tags. Each sensor node uses both an ultrasonic sensor and an infrared sensor to monitor people's movements and sends collected data to the main server through wireless transmission for easy system maintenance. The operation was verified using the FPGA board, and we designed a VLSI circuit in 180nm process.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

• Journal of Advanced Navigation Technology
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• v.26 no.3
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• pp.172-178
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• 2022

In this paper, water meter AMR(automatic meter reading), one of the core technologies of smart water grid, using LoRa IoT network is studied. The main content of the research is to develop the network system and show the test results that one PC server receives the readings of water meters from multiple households through LoRa communication and stores them in the database, and at the same time sends the data to the web server database through internet. The system also allows users to monitor the meter readings using their smartphones. The hardware and firmware of the main board of the digital water meter are developed. For a PC server program, MDMS(meter data management system) is developed using Visual C#. The app program running on the user's smartphone is also developed using Android Studio. By connecting each developed parts, the total network system is mounted on a flow test bench in the laboratory and tested. For the fields test, 5 places around the university are selected and the transmission distances are tested. The test result show that the developed system can be applied into the real field. The developed system can be expanded to various social safety nets such as monitoring the living alone or elderly with dementia.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.4
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• pp.815-821
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• 2013

In this paper, application layer protocol of C12.22 node, defined by ANSI C12.22 is implemented. ANSI C12.22 defines application layer only among the OSI 7 layers and recommends using the existing protocols for the 1~4 layer to transmit the information. TCP/IP which is one of the generally used protocols has been applied for the transport and network layer protocol in this paper. ANSI C12.19 defines the parameters for the watt-hour meter, and C12.22 application layer defines the network services and data structures networking the watt-hour meter parameters at a minimum. This kind of services and data structures are used for the configuration, programming, monitoring of the networked watt-hour meter or collecting information of the watt-hour meter. A embedded board has been used to implement the C12.22 application layer and a test program for the AMI application server has been developed for the functional test.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.1
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• pp.49-57
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• 2019

The International Maritime Organization is developing a maritime safety system called eNavigation in order to effectively respond to accidents occurring on board vessels. Korea is actively participating in the development of eNavigation and is developing Korean eNavigation by adding its own concept to eNavigation of the IMO. eNavigation is designed to provide various functions for marine safety. The data required for each function is various such as spatial data, relational data, file, weather grid. Therefore, there is a need for a system that can appropriately provide heterogeneous data suitable for eNavigation to each eNavigation's service system. In this paper, we analyzed the kinds of data needed for e-Navigation and designed the architecture of heterogeneous data service system that could provide these data properly.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.50 no.1
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• pp.67-74
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• 2022

To analyze the motion of aircraft through computing the dynamics equations, true airspeed is essential for obtaining aerodynamic loads. Although the airspeed is measured by on-board instruments such as pitot tubes, measurement data are difficult to obtain for commercial flights because they include sensitive data about the airline operations. One of the commonly available trajectory data, Automatic Dependent Surveillance-Broadcast data, provide aircraft's speed in the form of ground speed. The ground speed is a vector sum of the local wind velocity and the true airspeed. This paper present a method to estimate true airspeed by combining the trajectory, meteorological, and topology data available to the public. To integrate each data, we first matched the coordinate system and then unified the altitude reference to the mean sea level. We calculated the wind vector for all trajectory points by interpolating from the lower resolution grid of the meteorological data. Finally, we calculate the true airspeed from the ground speed and the wind vector. These processes were applied to several sample trajectories with corresponding meteorological data and the topology data, and the estimated true airspeeds are presented.