• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Journal of the Korea Society of Computer and Information
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• v.21 no.5
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• pp.127-133
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• 2016

In this paper, an intelligent dimming control system is designed and implemented with the human visual response function using CDS sensor, PIR sensor and temperature sensor, etc. The proposed system is designed to detect a moving object by PIR sensor and to control the LED dimming considering the human visual response. Also, the dimming of LED light can modulate on the app, and simultaneously control dimming in real-world environments with smart phone app. A high-temperature warning or a fire hazard information is transmitted to user's smart phone according to sensor values and Data graph are provided as part of data visualization. Connecting the hardware controller, the proposed intelligent smart dimming control system is expected to contribute to the power reduction interior LED, smart grid building and saving home combining with internet of things.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.1-6
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• 2017

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

• Proceedings of the KIPE Conference
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• 2013.11a
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• pp.37-38
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• 2013

This paper presents an intuitive and powerful way to study and design motor drive control. The control of induction motors, as most widely used machines, is discussed. Thanks to ultra low latency and high fidelity Hardware-in-the-Loop systems, different aspects of up-to-date drive regulation are examined. A power stage, comprised of a grid voltage source, a rectifier, a VSC inverter and an induction motor, is emulated on the HIL platform in real time. A digital signal controller is plugged into the interface board and connected to the HIL emulation platform, without any hardware modifications. For motor control and power electronics applications, a dedicated Texas Instruments TMS320F2808 DSP is chosen. The same controller can drive an emulation platform and a real device with no modifications. Current and speed control loop test results are presented and discussed.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Proceedings of the KIEE Conference
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• 2006.10c
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• pp.151-153
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• 2006

When distributed powers are interconnected to the grid, lack of source stability may cause some events that should be measured and stored as soon as they occur. This paper presents a real-time hardware system that has been developed for quick and reliable monitoring of the distributed powers quality. The system is composed of a digital signal processor (MPC7410, Motorola) and a 16 bits A/D board (VMIVME3122, GE). To guarantee the real time operation, it is based on a real time OS (VxWorks). Hardware tests of the embedded system have been made to check the performances of the proposed system. Test signals of several events are generated by using a LabView (hardware) system. The tests show that the system complies with the desired IEEE standard for power quality monitoring.

• Proceedings of the KIEE Conference
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• 2005.05a
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• pp.90-92
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• 2005

In this paper, we design a digital protection IED(Intelligent Electric Device) for a distributed power system in connection with power grid. The device can measure various elements for protection and communicate with another devices through network. The protection IED is composed of specific function modules: signal process module which converts analog signal from PT and CT handle algorithm to digital one; communication module for connection with another IEDs; input/output module for user-interfaces; main control module for control the whole modules. A general purpose DSP board with TMS320C2812 is used in the IED. Experiments with the power system simulator DOBLE have been made to verily the proposed hardware system.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.324-327
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• 2002

For the characterization of arbitrary shaped printed circuit board, lossy transmission line grid model based on SPICE netlist and analytical plane model based on the segmentation method are proposed in this paper. Two methods are compared with an arbitrary shaped power/ground plane. Furthermore, design considerations for the complete power distribution network structure are discussed to ensure the maximum value of the PDN impedance is low enough across the desired frequency range and to guide decoupling capacitor selection.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.257-260
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• 2001

Routing region modeling methods for PCB auto-routing system in Shape based type(non-grid method) used region process type and the shape located in memory as a individual element, and this element consumed small memory due to unique data size. In this paper we design PCB(Printed Circuit Board) auto-routing system using the auction algorithm method that 1) Could be reached by solving the shortest path from single original point to various destination, and 2) Shaped based type without any memory dissipation with the best speed. Also, the auto-routing system developed by Visual C++ in Window environment, and can be used in IBM Pentium computer or in various individual PC system.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.