• Journal of the Korean Ceramic Society
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• v.19 no.2
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• pp.127-132
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• 1982

This experiment has been carried out for the purpose of investigating the effect of additives on densification and grain growth in magnesium oxide by a two-step process; hot pressing and heat treating. MgO powder has been obtained by calcining extra reagent grade MgCO3 at 90$0^{\circ}C$ for 30 minutes, and additives have been added to $MgCO_3$ in the form of soluble salts-Al$(NO_3)_3$$. $9H_2O$ and $Cr(NO_3)_3$.9H_2O$. The hot pressing has been carried out with changes of soaking time at 125$0^{\circ}C$ under the pressure of 250kg/$\textrm{cm}^2$, and the heat treating also at same temperature. The initial particle size of MgO measured by particle size analyzer was 0.86 microns. Densification rate obeyed the equation D=K lnt + C, and grain growth rate obeyed the equation G-G0=kt1/2. It was vaporization of some $Cr_2O_3$ and formation of solid solution that had an influence on desification of MgO containing $Cr_2O_3$. Activation energy for grain growth of pure MgO was 62.4 kcal/mole, therefore grain growth was supposed to be diffusioncontrolled process. But after heat treatmeat, excess additives were expected to slow down the grain growth by the formation of second phase or the solute atoms at grainboundary.

• Journal of the Korean Ceramic Society
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• v.19 no.4
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• pp.287-292
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• 1982

Nonohmic properties of ZnO ceramics with various small amounts of additives were studied in relation to experimental methods, additive contant and sintaring temperature. The kinds of additives used to following chemicals were basic additives ($0.5Bi_2O_3$, $0.3BaCO_3$, $0.5MnCO_3$, $0.5Cr_2O_3$, $0.1KNO_3$), $TiO_2$ and $Al(OH)_3$. Expecially, this study has focused on the effectsof $TiO_2$ and $Al(OH)_3$ in ZnO ceramics with the basic additives. SEM studies indicated that the addition of TiO2 promoted grain growth but retarded grain growth with the addition of $Al(OH)_3$. Also, in the case of calcination of ZnO with $TiO_2$ and ZnO with $Al(OH)_3$ previously, grain size of ZnO with $TiO_2$ was larger and that of ZnO with Al(OH)3 was smaller in comparison to the case with out calcination. From the viewpoint of nonohmic exponent and nonohimic resistance, electrical characteristics of ZnO, $TiO_2$ and the basic additives was more effective than that of ZnO, $Al(OH)_3$ and the basic additives. Nonohmic exponent and nonohmic resistance of ZnO, $TiO_2$ and the basic additives was 11-13 and 40-65 respectively.

• Journal of the Korean Ceramic Society
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• v.36 no.11
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• pp.1252-1260
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• 1999

The defect chemistry and electrical characteristics of the grain boundaries of semiconducting SrTiO3 ceramics synthesized with wet-chemically surface-coated powders were investigated. The starting powders were separated into groups of 1-10${\mu}{\textrm}{m}$ 10-20${\mu}{\textrm}{m}$ etc by sedimentation and sieving methods. Na+ ions were absorbed on the powder surfaces by wet chemical-treatment method. The width of the grain boundary ranged up to several nm and the intergranular materials was amorphous. The additives coated on the surface of the powders were observed to be present at the grain boundaries of the ceramics. The diffusion depth of the additives into grains was about 30nm for the SrTiO3 ceramics synthesized with 5w/o coated materials, The threshold voltage grain boundary resistance and boundary potential barrier of the ceramics increased from 0.67V/cm 2.27k$\Omega$ and 0.05eV to 80.9V/cm 13.0k$\Omega$ 1.44eV with increasing the amount of the additives from 0 to 5 w/o respectively .

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.349-352
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• 2004

The improvement of critical temperature $(T_c)$, critical magnetic field $(H_c)$, and critical current density $(J_c)$ of superconductor is important for practical applications. In this study, the additives such as metal oxides were used to improve the preparation conditions of $YBa_2Cu_3O_x$ superconducting bulk samples and depending on additives the properties of $YBa_2Cu_3O_x$ superconductor were studied. The effects of additives to the density, grain alignment, and porosity of samples that affect the critical current density of superconductor also have been investigated.

• Journal of the Korean Ceramic Society
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• v.37 no.7
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• pp.660-664
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• 2000

Effect of various kinds of additive such as AlOOH, Al(OH)3, Al2Si2O5(OH)4, Nb2O5, TiO2 and MgO on the properties and microstructures of UO2 pellet has been examined. All the tested dopants had played a role to reduce sintered density and open porosity. It was revealed that the addition of TiO2 made pellet more stable thermally. UO2 pellet doped with 0.2wt% TiO2 was swelled rather than densified after annealing for 24 hrs at 1$700^{\circ}C$. It was attributed to large pore with spherical shape. Titinia and silicon coexisted with Al element were more effective to increase grain size than other additives. It could be also revealed that the formation of liquid phase was the main cause of grain growth.

• Journal of Korea Foundry Society
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• v.39 no.4
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• pp.61-74
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• 2019

The effects of Sr and (Ti-B) additives on the impact and fatigue properties of recycled (35% scrap content) AC4A aluminum alloy are investigated here. The acicular morphology of the eutectic Si phase of as-cast specimens was converted to the fibrous one with Sr additives. The grain size of the α-solid solution decreased by the addition of (Ti-B) additives. The crack initiation energy (E_i) of the impact absorption energy decreased due to the incorporation of an oxide film and inclusions depending on the scrap used. The modification of the eutectic Si morphology by Sr additives is considered as the main factor of the increase of the average impact absorption energy (E_t). The addition of (Ti-B) additives contributed to an increase in the occurrence of crack deflections due to the refining of α-Al grains, resulting in improved fatigue properties.

• Journal of Surface Science and Engineering
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• v.55 no.4
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• pp.222-230
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• 2022

The electroplating for copper foils has many advantages in economics. During the electroplating, the selection of appropriate additives is needed to manufacture copper foils with various properties. Therefore, it is investigated the initial plating voltage and the properties of copper foil electroplated in the electrolyte with benzothiazole as additives. The addition of benzothiazole without any additives decreased effectively the initial plating voltage. However, the initial voltage increased when the additives was used in combination with an inhibitor and a leveler along with benzothiazole. Moreover, the voltage tends to increase with the concentration of benzothiazole except for 40 ppm group. The mixed additives could change not only the initial voltage but also the morphology of crystals on the surface. When benzothiazole is added at 20 ppm or less, it was observed that the clustered crystals existed on the surface, which result in ununiform surface and high roughness value. In addition, the grain size increased with the amount of benzothiazole, but the resistivity decreased. However, when the leveler was added in 20 ppm, the grain size was decreased with the amount of benzothiazole. The size of the crystals could be influenced by the mixing ratio of additives. Therefore, it is necessary to study on the effect of concentration ratio of additives in the future.

• Transactions on Electrical and Electronic Materials
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• v.15 no.5
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• pp.284-289
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• 2014

The effects of additives (Nb, Bi and Cr) on the microstructure, varistor properties, and aging behavior of V/Mn/Co/ La/Dy co-doped zinc oxide ceramics were systematically investigated. An analysis of the microstructure showed that all of the ceramics that were modified with various additives were composed of zinc oxide grain as the main phase, and secondary phases such as $Zn_3(VO_4)_2$, $ZnV_2O_4$, and $DyVO_4$. The $Bi_2O_3$-modified samples exhibited the lowest density, the $Nb_2O_5$-modified sample exhibited the largest average grain size, and the $Cr_2O_3$-modified samples exhibited the highest breakdown field. All additives improved the non-ohmic coefficient (${\alpha}$) by either a small or a large margin, and in particular an $Nb_2O_5$ additive noticeably increased the non-ohmic coefficient to be as large as 36. The $Bi_2O_3$-modified samples exhibited the highest stability with variation rates for the breakdown field and for the non-ohmic coefficient (${\alpha}$) of -1.2% and -26.3%, respectively, after application of a DC accelerated aging stress of 0.85 EB/$85^{\circ}C$/24 h.

• Transactions on Electrical and Electronic Materials
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• v.10 no.1
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• pp.31-34
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• 2009

The improvement of preparation process of ${YBa_2}{Cu_3}{O_x}$ superconductor and its conducting properties is important for practical applications. In this study, the additives such as $Ag_{2}O$ and PbO were used to improve the preparation conditions of ${YBa_2}{Cu_3}{O_x}$ superconducting bulk samples and the properties of ${YBa_2}{Cu_3}{O_x}$ superconductors prepared with powders using sol-gel method and solid state reaction method were studied. The effects of the different powders and the additives to the density, grain alignment, and porosity of samples, that affect the critical current density of superconductor, also have been investigated. It is found that the properties of ${YBa_2}{Cu_3}{O_x}$ prepared with sol-gel synthesized powder and the additives showed better superconductivities than those of conventionally prepared superconductors.

• Journal of Surface Science and Engineering
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• v.36 no.2
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• pp.168-175
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• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.