• 한국지반환경공학회 논문집
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• 제16권3호
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• pp.35-39
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• 2015

Dowex 21K XLT 수지를 이용하여 산업폐수 내에 존재하는 금과 납-시안 착화합물에 대한 연속흡착 및 회수 특성을 조사하였다. 충전층에 충진된 Dowex 21K XLT 수지는 0.5mL/min의 유입유속에서 금-시안 착화합물을 520 bed volume까지 95% 이상 연속적으로 제거할 수 있지만, 납-시안 착화합물은 전혀 제거할 수 없었다. Dowex 21K XLT 수지에 흡착된 금-시안 착화합물은 HCl과 Acetone을 7:3의 비율로 섞은 혼합액을 탈착제로 이용하였을 때, 8 bed volume 내에서 96% 탈착되어졌다. 또한 두 번 재사용된 Dowex 21K XLT 수지의 금-시안 착화합물에 대한 bed volume이 490을 유지하여 향후 금 이온을 포함하고 있는 산업폐수 처리공정에 충분히 적용될 수 있을 것으로 판단된다.

• 청정기술
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• 제19권4호
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• pp.487-491
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• 2013

Dowex21K XLT 수지에 흡착된 금과 구리-시안 착화합물을 효과적으로 탈착시키기 위하여 쌍극성의 반 양성자성 용매의 일종인 아세톤을 염산과 섞은 혼합용매를 탈착제로 이용하였다. 염산과 아세톤의 혼합비율(부피비)이 7:3일 때 금-시안 착화합물의 탈착율은 약 94%로서 가장 높았으나 아세톤의 비율이 증가할수록 금-시안 착화합물의 탈착율은 감소하였다. 구리-시안 착화합물의 경우는 염산의 비율이 아세톤의 비율보다 상대적으로 높았을 때 거의 대부분을 탈착시켰으나 아세톤의 비율이 증가할수록 탈착율은 감소하였다. 또한, 0.6 M의 염산을 사용하였을 때(염산과 아세톤의 혼합비율은 7:3으로 고정) 금과 구리-시안 착화합물의 탈착율은 각각 94%와 100%였으며 더 높은 염산 농도를 사용하여도 금-시안 착화합물의 탈착율은 증가하지 않았다. 그리고 고체와 액체의 비(ratio of solid and liquid)가 1.0보다 작을 때는 금과 구리-시안 착화합물 모두 100%의 탈착율을 보여주었으나 1.0보다 클 때에는 금-시안 착화합물의 탈착율이 약 20~29%로서 아주 낮았다. 또한, 금과 구리-시안 착화합물에 대한 대부분의 탈착공정은 120분 내에 이루어졌다.

• Corrosion Science and Technology
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• 제21권2호
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• pp.89-99
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• 2022

A versatile method for performing non-cyanide electroless gold plating using thiomalic acid (TMA) as a complexing agent and 2-aminoethanethiol (AET) as a reducing agent was investigated. It was found that TMA was an excellent complexing agent for gold. It can be used in electroless gold plating baths at a neutral pH with a high solution stability, makes it a potential candidate to replace conventional toxic cyanide complex. It was found that one gold atomic ion could bind to two TMA molecules to form the [2TMA-Au⁺] complex in a solution. AET can be used as a reducing agent in electroless gold plating solutions. The highest current density was obtained at electrode rotation rate of 250 to 500 rpm based on anodic and cathodic polarization curves with the mixed potential theory. Increasing AET concentration, pH, and temperature significantly increased the anodic polarization current density and shifted the plating potential toward a more negative value. The optimal gold ion concentration to obtain the highest current density was 0.01 M. The cathodic current was higher at a lower pH and a higher temperature. The current density was inversely proportional to TMA concentration.

• Corrosion Science and Technology
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• 제6권6호
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.337-341
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• 2001

A new method to extract gold from pyrite roster cinder, which combines ultra-fine-grinding with resin-in-pulp, has been studied in this paper. Compared with traditional leaching technology, it can short leaching time, avoid complex filter process, lower sodium cyanide consumption and increase gold recovery by 35%. During leaching, aluminium oxide ball was used as stirred medium, hydrogen peroxide as leaching aid and sodium hexametaphosphate as grinding aid. With the high efficiency and chemistry effect of ultra-fine-grinding, the leaching process was developed and the gold leaching rate may reach 88%. With AM-2 Б resin as abosorber and sulfocarbamide (TU) as eluent, gold was recovered from cyanide pulp by resin-in-pulp. AM-2 Б resin has good adsorbability in cyanide solution(pH=10). It was easy to elude gold from the loaded resin with 0.1㏖/L cholhydric acid and 1㏖/L sulfocabamide. The effect of contact time, temperature and acidity etc. on the gold absorption had been examined with static methods. The results showed that the adsorption and desorption of gold could both reach over 98%. The effects of flow rate of solution on dynamic adsorption and elution of gold had been examined with dynamic methods. Breakthrough curve and elution curve had been drawn in this paper. A mild condition was determined through a number of experiments: leaching time 2 hours, liquid solid ratio 4:1, sodium cyanide 3kg/t, hydrogen peroxide 0.05%, sodium hexametaphosphate 0.05%; adsorption time 30 minutes, temperature 10-3$0^{\circ}C$, resin($m\ell$) solid(g) ratio 1:10, eluent resin ratio 10-20:1, velocity of eluent $1.5m\ell$/min. Under the mild condition, the gold recovery may reach 85%.

• 한국표면공학회지
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• 제29권6호
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• pp.714-719
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• 1996

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium remains on the resin and it causes the extraneous deposition. We confirmed that selectivity was greatly improved by the treatment with the strong reducing agents such as SBH or DMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Stabilizers in the electroless gold plating were also influenced the bonding strength. The baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. The gold deposits having strong orientation with Au(220) and Au(311) showed good bond ability.