• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• 대한치과교정학회지
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• 제4권1호
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• pp.57-61
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• 1974

The patient, a girl of 19 years in good health, had a class I malocclusion. The maxillary left centra1 incisors and both lateral incisors had already erupted. But the space for the right central incisor was partially closed by the mesial drifting of the neighboring teeth. The caused a shift in the midline and a cross-bite relation on the incisors. X-ray examination revealed the presence of the right central incisor in the alveolar bone and odontoma just above the crown of the right central incisor. After enough space for the impacted incisor was created in the dental arch with a open-coil spring the rectangular incision was made. Removing the odontoma uncovered the flat surface of the labial aspect of the incisor. During the tooth had erupted of its own accord, any unnecessary force had been imposed on the tooth. When it was decided that the tooth should be brought out by the mechanical device, the gold cast onlay with hook was used and run a light elastic between this hook and the main arch wire. Finally the tooth was brought down to the arch level. The result was excellent. Fortunately the esthetic problem and any detrimental effects on the psychological make-up could be avoided.

• 한국기계가공학회지
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• 제19권4호
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• pp.65-70
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• 2020

While the demand for robots in the manufacturing industry has dramatically increased, the industrial robots' functionality is mainly determined by the effector attached to the end of their arms. They need a flexible gripping system that can act as a human hand and easily grasp a variety of objects, which requires resilient sensors. This study clarifies the electrical output characteristics of elastic tactile sensors according to contact terminals because the output characteristics of the tactile sensors vary greatly, depending on the contact material and the method of contact with the conductive wire. Our research considers the Three Roll Mill and Paste Mixer as the dispersion medium, and a nickel- and gold-plated brass electrode as the contact terminal.

• 대한기계학회논문집A
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• 제35권5호
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• pp.495-501
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• 2011

나노간극에서 발생하는 전기방전에 대해서 실험적으로 연구하고 그 결과를 분석하였다. Pt-Ir 합금으로 구성된 음극과 금으로 박막코팅된 양극사이에 전기방전을 하였다. 음극과 양극에서 전기장을 10V~80V 범위에서 제어하였으며, 간극은 50nm 에서 800nm 로 제어하였다. 이때 발생된 전기방전신호, 쇼트신호 등은 간접적으로 나노간극에서 발생하는 현상들을 이해할 수 있었다. 실험결과 전기방전은 전기장과 음극의 전극첨단의 반경에 매우 밀접하게 관련이 있었다. 작은 간극에서 발생하는 전기방전은 비교적 산포도가 크고 랜덤한 형태를 보였으며 음극 전극첨단의 반경에 민감하게 반응하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 대한기계학회논문집B
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• 제25권2호
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• pp.164-170
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• 2001

The influence of unsteady wake on the flow and heat transfer characteristics in a four-vane linear cascade was experimentally investigated. The unsteady wake was generated with four rotating rectangular plates located upstream of the cascade. Tested inlet Reynolds number based on chord length was set to 66,000 by controlling free-stream velocity. A hot-wire anemometer system was employed to measure turbulent velocity components. For the convective heat transfer coefficients measurement on turbine blade surface, thermochromic liquid crystal and gold film Intrex were used. It was found that the unsteady wake enhances the turbulent motion in the cascade passage and accordingly promotes the development and transition of boundary layer. It was found that the heat transfer coefficients on the blade surface increase as the plate rotating speed increases. However, the increasing of heat transfer coefficients is not significant in the case that Strouhal number is higher than 0.503.

• 대한기계학회논문집B
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• 제25권12호
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• pp.1869-1878
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• 2001

Experiments are carried out to investigate the effect of pulsations on the flow and heat transfer characteristics of an axisymmetric impinging jet on a flat plate heated by using a gold coated aim. Vertex motion in the impinging jet is visualized using a fog generator, and a thermochromatic liquid crystal (TLC) technique is used to measure the time averaged local temperature distributions on the impingement plate. In addition, the quantitative data for mean velocity and turbulence intensity are obtained employing hot-wire anemometer. Parameters such as pulsating frequency (f = 0, 10 and 20 Hz) and the nozzle-to-palate spacing (H/D = 2, 10) are considered at the jet Reynolds number of 20,000. Consequently, the significant changes of flow structure and local Nusselt number distribution due to pulsations are observed. In the case of H/D = 2, the enhanced heat transfer coefficient exceeding 30 % is observed at the stagnation point. At the high H/D, heat transfer rate increases with pulsation frequency.

• 대한기계학회논문집B
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• 제23권7호
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• pp.864-870
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• 1999

An experimental study Is conducted in a four-vane linear cascade in order to examine the influence of the wake behind rectangular bars on the flow and heat transfer characteristics. Flow and heat transfer measurements are made for the inlet Reynolds number of 66000(based on chord length and free-stream velocity). Turbulent intensity and stress are measured using a hot-wire anemometer, and to measure the convective heat transfer coefficients on the blade surface liquid crystal/gold film Intrex technique is used. Each of experimental cases is characterized by the unsteadiness measured at the entrance of the cascade. The wake behind the rectangular bars enhances the turbulent motion of the flow in the cascade passage. It also promotes the boundary layer development and transition. The results show that heat transfer coefficients on the blade surface increase with increasing unsteadiness.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권3호
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.