• Title/Summary/Keyword: Glassy Polymer

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Acid-Sensitivity and Physical Properties of Polymethylmethacrylate and Polyurethane Films Containing Polymeric Styryl Dye

  • Cho, Jae-Whan;Lee, Sun-Hwa;So, Jung-Hyun;Jaung, Jae-Yun;Yoon, Kee-Jong
    • Fibers and Polymers
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    • v.5 no.3
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    • pp.239-244
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    • 2004
  • Solution-cast films of polymethylmethacrylate (PMMA) and polyurethane (PU) containing polymeric styryl dye up to 5 % by weight were prepared to investigate their acid-sensitivity and mechanical and thermal properties. Original red samples due to styryl dye turned out yellow very rapidly as they were exposed to acid vapor of hydrochloric acid or p-toluenesulfonic acid. According to UV/VIS spectroscopic measurements, characteristic peak intensities near 430 nm and 520 nm increased or decreased relatively with exposed amounts of acid, respectively. Both PMMA and PU samples showed uniform color distribution due to a good miscibility between polymer and dye which can be evidenced by measurements of glass transition temperature. No significant difference in acid-sensitivity was found between PU and PMMA except relative absorbance. However, dependence of their mechanical properties on dye content was somewhat different with PU or PMMA. In case of PMMA, modulus and breaking stress increased up to about 50 % with increasing dye content, whereas those of PU samples showed only slight increase. It was ascribed to whether the matrix polymer was in the glassy or rubbery state.

Review on Membrane Materials to Improve Plasticization Resistance for Gas Separations (가소화 저항 향상을 위한 기체분리막 소재 개발 동향)

  • Jo, Jin Hui;Chi, Won Seok
    • Membrane Journal
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    • v.30 no.6
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    • pp.385-394
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    • 2020
  • In the gas separation process, the separation membranes have to not only show high gas transport and selectivity but also exhibit exceptional stability at high temperature and pressure. However, when the polymeric membranes (particularly, glassy polymers) are exposed to the condensable gases (i.e., CO2, H2S, hydrocarbon, etc.), the polymer chains are prone to swell, leading to low stability. As a result, the plasticization behavior reduces the gas selectivity in the separation of mixture gases at high pressures and thus results in limited applications to the separation processes. To address these issues, many strategies have been studied such as thermal treatment, polymer blending, thermally rearrangement, mixed-matrix membranes, cross-linking, etc. In this review, we will understand the plasticization behavior and suggest potential methods based on the previously reported studies.

Effect of Temperature on the Micro-scale Adhesion Behavior of Thermoplastic Polymer Film (열가소성 폴리머 필름의 마이크로 점착 거동에 대한 온도의 영향)

  • Kim, Kwang-Seop;Heo, Jung-Chul;Kim, Kyung-Woong
    • Tribology and Lubricants
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    • v.25 no.2
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    • pp.86-95
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    • 2009
  • Adhesion tests were carried out in order to investigate the effect of temperature on the adhesion behavior between a PMMA film and a fused silica lens in the micro scale. For the tests, a microtribometer system was specially designed and constructed. The pull-off forces on the PMMA film were measured under atmospheric condition as the temperature of the PMMA film was increased from 300 K to 443 K and decreased to 300 K. The contact area between the PMMA film and the lens was observed during the test. The adhesion behavior was changed with the change of the PMMA surface state as the temperature increased. In glassy state below 363 K, the pull-off force did not change with the increase of temperature. In rubbery state from 383 K to 413 K, the pull-off force increased greatly as the temperature increased. In addition, the area of contact was enlarged. In viscous state above 423 K, the fingering instability was observed in the area of contact when the PMMA film contacted with the lens. It was also found that the adhesion behavior can be varied with the thermal history of the PMMA film. The residual solvent in the PMMA film could emerge to the PMMA surface due to the heating and reduced the pull-off force.

Effects of Temperature on the Tribological Characteristics of Thermoplastic Polymer Film (열가소성 폴리머 필름의 트라이볼로지 특성에 대한 온도의 영향)

  • Kim, Kwang-Seop;Heo, Jung-Chul;Kim, Kyung-Woong
    • Tribology and Lubricants
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    • v.25 no.4
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    • pp.207-216
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    • 2009
  • Friction tests were carried out in order to investigate the effects of temperature on the friction and wear behaviors between a PMMA film and a fused silica lens using a microtribometer. The friction forces on the PMMA film were measured under atmospheric condition as the temperature of the film was increased from 300 K to 443 K. The contact area between the film and the lens was observed. The tribological characteristics of the film were significantly changed as the temperature increased. The changes were discussed with the change of the film state from glassy to viscous flow. In addition, the results showed that the friction behavior can be varied with the thermal history of the PMMA film. Residual solvent in the PMMA film could emerge to the PMMA surface due to an additional heating and the solvent on the film surface decreased the friction force.

Synthesis and Electrochemical Properties of Polymeric Pentadentate Schiff Base Co (Ⅱ), Ni (Ⅱ), and Cu (Ⅱ) Complexes (Polymer 다섯자리 Schiff Base Co(Ⅱ), Ni(Ⅱ) 및 Cu(Ⅱ) 착물들의 합성과 전기화학적 성질)

  • Choe, Yong Guk;Choe, Ju Hyeong;Park, Jong Dae;Sim, U Jong
    • Journal of the Korean Chemical Society
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    • v.38 no.2
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    • pp.136-145
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    • 1994
  • Polymeric complexes such as M(Ⅱ)(PVPS)(SND), M(Ⅱ)(PVPS)(SOPD) have been prepared with monomeric complexes, M(Ⅱ)(SND) and M(Ⅱ)(SOPD)[M: Co(Ⅱ), Ni(Ⅱ), and Cu(Ⅱ)] and polymer PVPS. These complexes have been indentified by elemental analysis, spectroscopy, and T.G.A. From the results, it was found that M(Ⅱ)(PVPS)(SND), M(Ⅱ)(PVPS)(SOPD) complexes were penta-coordinated configuration. Electrochemical properties of these complexes studied by cyclic voltammetry and differential pulse polarography in 0.1 M TEAP-DMF solution at glassy carbon electrode. Co(Ⅱ)(PVPS)(SND) and Co(Ⅱ)(PVPS)(SOPD) showed irreversible two step reduction, such as Co(Ⅲ)/Co(Ⅱ) and Co(Ⅱ)/Co(Ⅰ), and Ni(Ⅱ)(PVPS)(SND), Ni(Ⅱ)(PVPS)(SOPD), Cu(Ⅱ)(PVPS)(SND), and Cu(Ⅱ)(PVPS)(SOPD) complexes showed irreversible one step reduction, such as Ni(Ⅱ)/Ni(Ⅰ) and Cu(Ⅱ)/Cu(Ⅰ), respectively.

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Effect of Phenyl Vinyl Methyl Silicone (PVMQ) on Low Temperature Sealing Performance of Fluorosilicone Composites

  • Lee, Jin Hyok;Bae, Jong Woo;Choi, Myoung Chan;Yun, Yu-Mi;Jo, Nam-Ju
    • Elastomers and Composites
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    • v.56 no.4
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    • pp.209-216
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    • 2021
  • In this study, we observed the mechanical properties, thermal stability, and low temperature sealing performance of fluorosilicone elastic composites. When the blend ratio of Phenyl vinyl methyl silicone (PVMQ) was increased, the tensile strength, modulus at 100%, and compression set were decreased. The thermal stability of fluorosilicone elastic composites showed a similar tendency. These were caused by poorer green strength of PVMQ than Fluorosilicone rubber (FVMQ). The change in the tensile strength and elongation at -40℃ showed a decreasing tendency with increasing PVMQ blend ratio. By increasing the PVMQ blend ratio, low-temperature performance was improved. The Dynamic mechanical analysis (DMA) results showed that Tg was decreased and low-temperature performance was improved with increasing PVMQ blend ratio. However tanδ was decreased becaused of the poor green strength and elasticity of PVMQ. From a hysteresis loss at -40℃, the hysteresis loss value was increased and fluorosilicone elastic composites showed the decreasing tendency of elasticity with increasing PVMQ blend ratio. From the TR test, TR10 was decreased with increasing PVMQ blend ratio. FS-4 (45% PVMQ blended composites) showed a TR10 of -68.0℃ that was 5℃ lower than that of FS-1 (100% FVMQ). The gas leakage temperature was decreased with increasing PVMQ blend ratio. The gas leakage temperature of FS-4 was -69.2℃ that was 5℃ lower than that of FS-1. Caused by the polymer chain started to transfer from a glassy state to a rubbery state and had a mobility of chain under Tg, the gas leakage temperature showed a lower value than Tg. The sealing performance at low temperature was dominated by Tg that directly affected the mobility of the polymer chain.

Glass Transition Behavior of Dendritic Polymers Containing Mobile Aliphatic Polyether Cores and Glassy Peripheral Polystyrenes

  • Song, Jie;Cho, Byoung-Ki
    • Bulletin of the Korean Chemical Society
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    • v.29 no.6
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    • pp.1167-1172
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    • 2008
  • We investigated the glass transition temperatures ($T_g$) of dendrons consisting of conformationally mobile aliphatic polyether dendritic cores plus glassy peripheral polystyrenes (PSs), and linear PSs in the molecular weight range of 1000-8500 g/mol. We compared their $T_g$ behavior depending on their polymeric architecture. The linear PSs show a typical growth of $T_g$ up to 92.5 ${^{\circ}C}$ as the molecular weight increases to 8300 g/mol, while the dendrons display nearly constant $T_g$ values of 58-61 ${^{\circ}C}$, despite the increase of molecular weight with each generation. The striking contrast of Tg behavior would be mainly attributed to the fact that the dendrons keep the ratio of $N_e$/M ($N_e$: number of peripheral chain ends, M: molecular weight) over all the generations. Additionally, for the influence of dendritic spacers on glass transition temperature we prepared dimeric PSs with different linkage groups such as aliphatic ether, ester and amide bonds. We found that the dimer with the ether spacer exhibited the lowest glass transition at 55.4 ${^{\circ}C}$, while the amide linked dimer showed the highest glass transition temperature at 74.2 ${^{\circ}C}$. This indicates that the peripheral PS chains are effectively decoupled by the conformationally flexible ether spacer. The results from this study demonstrated that polymeric architecture and dendritic core structures play a crucial role in the determination of glass transition behavior, providing a strategy for the systematic engineering of polymer chain mobility.

Fabrication Methods of Porous Ceramics and Their Applications in Advanced Engineering - Large Flat Precision Plate for Flat Display Industries

  • Matsumaru, Koji;Ishizaki, Kozo
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.3.1-3.1
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    • 2009
  • Normal sintering process of producing porous ceramics is not to sinter perfectly, i.e., stop sintering in middle-process. Our porous ceramic materials are a product of complete sintering. For example if one want to make a porous carborundum, raw carborundum powder is sintered at either lower temperatures than normal sintering temperature or shorter sintering periods than normal sintering time to obtain incompletely sintered materials, i.e., porous carborundum. This implies normally sintered porous ceramic materials can mot be used in high vacuum conditions due to dust coming out from uncompleted sintering. We could produce completely sintered porous ceramic materials. For example, we can produce porous carborundum material by using carborundum particles bonded by glassy material. The properties of this material are similar to carborundum. We could make quasi-zero thermal expansion porous material by using carborundum and particles of negative thermal expansion materials bonded by the glassy material. We apply to sinter them also by microwave to sinter quickly. We also use HIP process to introduce closed pores. We could sinter them in large size to produce $2.5m{\times}2.5m$ ceramic plate to use as a precision plate for flat display industries. This flat ceramic plate is the world largest artificial ceramic plate. Precision plates are basic importance to any advanced electronic industries. The produced precision plate has lower density, lower thermal expansivity, higher or similar damping properties added extra properties such as vacuum vise, air sliding capacity. These plates are highly recommended to use in flat display industries. We could produce also cylindrical porous ceramics materials, which can applied to precision roller for polymer film precision motion for also electronic industries.

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Experimental and Numerical Study on the Viscoelastic Property of Polycarbonate near Glass Transition Temperature for Micro Thermal Imprint Process (열방식 마이크로 임프린트 공정을 위한 고분자 재료의 수치적 모델링)

  • Lan, Shuhuai;Lee, Hey-Jin;Lee, Hyoung-Wook;Song, Jung-Han;Lee, Soo-Hun;Ni, Jun;Lee, Moon-G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.05a
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    • pp.70-73
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    • 2009
  • The aim of this research is to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature. An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model from the test data. Further validation of the model and parameters was performed by comparing the analysis of FE model results to the experimental data.

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Characteristics in Separation of CCl2F2/Air Gas Mixture by Polyimide Membrane (폴리이미드 분리막에 의한 CCl2F2/Air 기체혼합물의 분리특성)

  • Lee, Kwang-Rae
    • Journal of Industrial Technology
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    • v.14
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    • pp.141-153
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    • 1994
  • 폴리이미드 분리막에 의한 $CCl_2F_2/Air$ 혼합물의 분리특성에 관하여 온도, 압력, stage cut(${\theta}$), 주입기체 조성등의 영향을 규명하였다. 본 연구의 실험범위 내에서 이상분리인자(ideal separation factor)는 600-200이었으며, glassy polymer인 폴리이미드 분리막에 대하여 투과도가 높은 air의 투과도는 $CCl_2F_2$ (dichlorodifluoromethane, CFC-12)에 의하여 상당히 감소함을 알 수 있었다. 그러나, 폴리이미드 분리막에 대한 투과도가 낮은 $CCl_2F_2$의 투과도는 air에 의하여 투과도가 증가하였다. 또한, 수학적 모델에 의한 예측치가 실험치와 잘 일치됨을 알 수 있었다.

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