• 제목/요약/키워드: Glass-to-metal contact

검색결과 40건 처리시간 0.309초

접합유리와 쾌삭강간의 Wetting 현상 (Wetting Phenomena between Sealing Glass and Free Cutting Steel)

  • 김흥;김종희
    • 한국세라믹학회지
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    • 제19권1호
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    • pp.24-34
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    • 1982
  • The effect of the several variables on wetting of AISIB1113 steel by molten glass was studied by Sessible-drop method. Experimental variables were temperature, firing atmospheres, Fe2O3 addition to the sealing glass and steel surface conditions. The degree of wetting in terms of contact angles between molten glass and metal tested at different test conditions was analyzed by using Young's equation. The results showed that contact angles in H2 atmosphere in the glass metal systems were high but in N2 atmosphere, were small for studied glass metal systems. Especially, when the glass drop was in contact with oxidized steel in N2 atmosphere, The best adherence with contact angle of approximately 9°was obtained. In the case of Fe2O3 addition in glass contact angles subtantially increased due to the increase of surface tension of glass. Wetting phenomena were also discussed under the basis of these experimental results.

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석영 유리의 파괴 거동에 관한 연구(II) (A Study on the Fracture Behavior of Quartz Glass(II))

  • 최성대;정선환;권현규;정영관;홍영배
    • 한국산업융합학회 논문집
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    • 제10권4호
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    • pp.213-219
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    • 2007
  • Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.

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중금속 창연산화납계 저온유리 분말을 이용한 세라믹스/금속의 접합거동 (Joining Behavior of Ceramics to Metal by Using Lead-bismate Heavy Metal Glass Frit)

  • 최진삼
    • 한국세라믹학회지
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    • 제51권4호
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    • pp.312-316
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    • 2014
  • The joining behavior of forsterite ceramics to SUS304 alloy using $8PbO-78Bi_2O_3-8B_2O_3-4ZnO-2SiO_2$ (wt%) system glass frit was investigated. The contact angle was smaller than $90^{\circ}$ at a temperature of $460^{\circ}C$. Redox reaction at the interface between forsterite and SUS304 was found to appear when the electrons in the metal part moved toward the glass part and the oxygen ions in glass moved to the metal side. The decrease of the surface tension due to the PbO solubility on the forsterite side contributed to the better wetting behavior at low temperature.

석영 유리의 파괴 거동에 관한 연구(I) (A Study on the Fracture Behavior of Quartz Glass(I))

  • 최성대;정선환;정영관;김기만;홍영배
    • 한국산업융합학회 논문집
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    • 제10권3호
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    • pp.179-185
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    • 2007
  • Quartz glass are used in semiconductor industries as the reaction furnace, wafer carrier and accessaries. During the process the quartz glass received compression by direct contact with other quartz glass ware and metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process. Even as the other ceramic materials quartz glass have high compressive strength but often there happened crack and breakage of quartz glass resulted in a great damage in the process. In this paper investigation will be carried out on fracture behavior of quartz glass under local load to give guideline to prevent unintended fracture of quartz glass.

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Preparation and characterization of green adsorbent from waste glass and its application for the removal of heavy metals from well water

  • Rashed, M. Nageeb;Gad, A.A.;AbdEldaiem, A.M.
    • Advances in environmental research
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    • 제7권1호
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    • pp.53-71
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    • 2018
  • Waste glass disposal causes environmental problems in the cities. To find a suitable green environmental solution for this problem low cost adsorbent in this study was prepared from waste glass. An effective new green adsorbent was synthesized by hydrothermal treatment of waste glass (WG), followed by acidic activation of its surface by HCl (WGP). The prepared adsorbent was characterized by scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), and BET surface measurement. The developed adsorbent was used for the removal of heavy metals (Cd, Cu, Fe, Pb and Zn) from well water. Batch experiments were conducted to test the ability of the prepared adsorbent for the removal of Cd, Cu, Fe, Pb and Zn from well water. The experiments of the heavy metals adsorption by adsorbent (WGP) were performed at different metal ion concentrations, solution pH, adsorbent dosage and contact time. The Langmuir and Freundlich adsorption isotherms and kinetic models were used to verify the adsorption performance. The results indicated high removal efficiencies (99-100%) for all the studied heavy metals at pH 7 at constant contact time of 2 h. The data obtained from adsorption isotherms of metal ions at different time fitted well to linear form of the Langmuir sorption equation, and pseudo-second-order kinetic model. Application of the resulted conditions on well water demonstrated that the modified waste glass adsorbent successfully adsorbed heavy metals (Cd, Cu, Fe, Pb and Zn) from well water.

단결정 실리콘 태양전지의 후면 전극형성에 관한 비교분석 (Analysis of the Formation of Rear Contact for Monocrystalline Silicon Solar Cells)

  • 권혁용;이재두;김민정;이수홍
    • 한국전기전자재료학회논문지
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    • 제23권7호
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    • pp.571-574
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    • 2010
  • Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

결정질 실리콘 태양전지에 적용하기 위한 후면전극 형성에 관한 연구 (An Analysis on rear contact for crystalline silicon solar cell)

  • 권혁용;이재두;김민정;이수홍
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.91.1-91.1
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    • 2010
  • There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

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귀금속(금, 은)-유리계의 젖음성과 부착성 (Wettability and Adhesion of Noble Metal (Au, Ag)-Glass Systems)

  • 김종희
    • 한국세라믹학회지
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    • 제32권4호
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    • pp.405-412
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    • 1995
  • In order to estimate the wettability of the borosilicate glasses with different composition on the noble metals of gold and silver, the measurements of the contact angle between the solid and the liquid were made at various temperatures and holding times using the sessil-drop method. The wetting behavior and the adhesion of the phases were strongly influenced by the thermal or the physical characteristics of the materials. The dependence of wetting angle ($\theta$) on the holding time (t) could be represented by the relation of $\theta$=a.tb, whereby the wettability of the systems was quantitatively compared. Also with increasing content of borosilicate glass in the glass-gold matrix composite, the tensile strength was decreased whereas the elastic modulus was increased.

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4H-SiC기판 위의 자기구조화된 Ag/Ti 나노입자 제어를 위한 열처리 분석 (Annealing Effect on controlling Self-Organized Ag/Ti Nanoparticles on 4H-SiC Substrate)

  • 김소망;오종민;구상모
    • 전기전자학회논문지
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    • 제20권2호
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    • pp.177-180
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    • 2016
  • 본 연구에서는 4H-SiC(0001)기판 위에서 형성되는 나노구조화를 제어하기 위해 상지층과 하지층으로 구성된 이중층 금속을 증착하고 두께, 열처리 시간을 변화하였다. 또한 표면에너지와 응집현상의 상관관계를 분석하기 위해 SiC와는 다른 표면에너지를 갖는 Glass와 Si기판에도 같은 조건으로 실험하였다. FE-SEM을 통하여 금속이 나노구조화를 형성하는 두께가 Ag=20nm, Ti=2nm임을 확인 했으며 두께가 두꺼울 수록 나노 입자가 형성되지 않았다. 세기판의 표면에너지를 구하기 위해 접촉각 측정기를 통해 정접촉각법으로 측정하였다. 그 결과 표면에너지 값이 가장 높은 Glass(53.89 mN/m) 기판에서 나노 입자가 가장 고르게 분포된 형태를 보였으며 SiC(41.13 mN/m)에서 나노구조화 되는 양상을 보였고, Si(32.96 mN/m)에서는 NPs 형성이 되지 않았다. 표면에너지가 작을수록 나노 입자형성이 고르게 분포되는 현상을 Young equation으로 분석하였다.

Improved Field Emission Currents of Carbon Nanotubes after Laser Irradiation

  • Lee, Jung-Woo;Park, Jae-Hong;Yi, Whi-Kun
    • Bulletin of the Korean Chemical Society
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    • 제27권10호
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    • pp.1651-1654
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    • 2006
  • Field emission (FE) currents were measured for silver-pasted and glass-pasted single-walled carbon nanotubes (SWNTs) after illuminating the tubes with a pulsed 532 nm laser. A very low turn-on field of approximately 0.4 V/m m and a high current density ~1700 $\mu A/cm^2$ at 3.5 V/m m was obtained for the silver-pasted SWNTs after laser irradiation but on the whole, no improvements were found for the glass-pasted SWNTs. Two roles of laser irradiation for the silver-pasted SWNTs were proposed. First, the embedded SWNTs and SWNT bundles inside the silver paste were immerged on the outer surface due to an instantaneous melting or annealing of the silver metals by the laser resulting in an increase of the field emission sites. Second, the laser irradiation was thought to improve the electrical contact between SWNTs and the silver metal by reducing the contact resistance via laser-induced thermal annealing, which was responsible for increasing the FE currents.