• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.292-293
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• 2006

$ZnNb_2O_6$ ceramics were sintered under the presence of zinc-borosilicate(ZBS) glass and resultant microwave dielectric properties were investigated with a view to applying the composition to LTCC technology. The addition of 10~30 wt% ZBS glass ensured successful sintering below $900^{\circ}C$. In general, increased addition of ZBS glass increased sinterability but it decreased the dielectric properties significantly due to the formation of an excessive liquid and second phases. The sintered $ZnNb_2O_6$ ceramics at $900^{\circ}C$ with 25 wt% ZBS glass demonstrated 15.8 in dielectric constant(${\varepsilon}_r$), 5,400 in quality factor($Q{\times}f_0$), and $-98\;ppm/^{\circ}C$ in temperature coefficient of resonant frequency(${\tau}_f$).

• Korean Journal of Materials Research
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• v.31 no.8
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• pp.471-479
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• 2021

The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/glass. Finally, the confidence interval is 95 ± 1.95₉ %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.256-259
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• 1999

The purpose of this study is to develop the material for multiayer piezoelectric ceramic transformer because multiayer piezoelectric transformer must need low sintering temperature. So that PMN-PSN-PZT family ceramics were added with glass brit(SiO$_2$ $.$ PbO). The dielectric and piezoelectric properties were increased with increasing it until the amounts of additive 0.8wt%. Sintering temperature were low about 100[$^{\circ}C$]. Accordingly, This material could be used to multiayer piezoelectric transformer .

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.567-572
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• 2013

In houses that use heating and cooling system, most of heat loss occurs through the windows, so that low-E glass, double-layered glass, and vacuum glazing are used to minimize the heat loss. In this paper, an encapsulating process that is a final process in manufacturing the vacuum glazing has been studied, and bonding in a vacuum chamber rather than atmospheric bonding was considered. For the efficiency of the encapsulating process, frit-melting temperature and bonding time were optimized with heater temperature, and the glass preheating temperature was optimized to prevent glass breakage due to thermal stress. Thus the vacuum glass was successfully manufactured based on these results and heat transmission coefficient measured was about $5.7W/m^2K$ which indicates that the internal pressure of the vacuum glazing is $10^{-2}$ torr.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.427-435
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• 1994

Cu-metallized low firing temperature substrates were synthesized by cofiring green sheet of cordierite-based glass with Cu. By Sol-Gel method, Cu powder was coated with borosilicate gel which should act as a glass frit in Cu paste during cofiring. Theoretical weight ratios of Glass/Cu were controlled to be 2.5, 5, 10 and 15% by varying alkoxide concentrations. Average particle size of coated Cu was 0.629~0.674 ${\mu}{\textrm}{m}$ in comparison to that of as-received Cu(0.596 ${\mu}{\textrm}{m}$), which increased with alkoxide concentration but did not increase above certain concentration. The weight ratios of coated layer were 2.11~5.37%. The properties of Cu-metallized low firing temperature substrate, cofired at 90$0^{\circ}C$ for 1h under H2/N2 atmosphere, were as follows; sheet resistance was 13~43 m{{{{ OMEGA }}/$\square$, adhesion strength was 1.0~2.1 kgf/$\textrm{mm}^2$. From the observations of SEM photographs, the gel coated on Cu performed excellently as a glass frit.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.60-60
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• 1999

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.302-302
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• 2008

다층 세라믹 기판은 내열성, 내마모성 및 우수한 전기적 특성으로 인하여 기존의 PCB의 대체품으로 많이 이용되며 그 수요가 점점 늘어가고 있는 추세이다. 이에 고집적 다층 세라믹 기판을 보다 다기능화, 고밀도화, 고성능화하기 위해서는 세라믹 층간 정밀도가 아주 중요한 요소로 부각되고 있으며, 무수촉 기판 소성기술을 이용한 층간 정밀도를 높이는 연구가 진행되어지고 있다. 그러나 무수축 기판에서 이러한 정밀도를 유지하기 위해서는 전극의 수축률을 기판의 수축율과 같은 0%에 가깝게 제어하여야 하며 이를 위해서 여러 가지 Frit을 이용하여 수축율을 제어를 시도되고 있다. Ag 전극은 낮은 비저항 우수한 접착성 등의 장점을 가지고 있을 뿐 아니라 가격이 저렴하여 전극재료로서 많은 연구가 이루어졌다. 특히 Infiltration법에 의한 무수축소성의 경우 Glass가 Ag paste로 Infiltration되어 Ag paste와 세라믹의 matching성 확보에 많은 문제가 발생하였다. 이에 본 실험에서는 제조된 Ag conductor paste 에 첨가되는 frit이 무수축 기판과의 매칭성에 어떠한 영향이 있는지에 대하여 고찰하였다. 시편의 준비는 frit이 첨가된 Ag paste를 기판에 screen printing 한 후 $900^{\circ}C$에서 소결한 것을 사용하였으며 Ag 전극의 미세구조를 관찰하고 전기적 특성과 미세구조와의 연관성에 관해 고찰하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1248-1251
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• 2005

In PDP, a transparent dielectric is formed on a front glass substrate so as to cover bus electrodes (Ag). During the fabrication process, sometimes, a transparent dielectric reacts with bus (Ag) electrode in the range of $560-600^{\circ}C$, and the reaction gives the dielectric its yellow coloration, what is called "yellowing phenomena". In this paper, we investigated the reaction between bus electrode and transparent dielectric covered with different frit content in Ag paste.

• Journal of Powder Materials
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• v.9 no.1
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• pp.38-42
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• 2002

Effects of chemical compositions on the sintering behavior of the lead borosilicate glass developed for barrier ribs of plasma display panels were investigated in this study. Formation of pores during sintering of the glass was noted and their formation mechanism was investigated using XPS, TG/DTA, and XRD. The results indicated that pores are formed by the oxygen released from Pb-oxides during sintering.

• Journal of the Korean Ceramic Society
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• v.56 no.2
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• pp.167-172
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• 2019

Silicate glasses with varying SiO₂ and Na₂O contents were prepared and their viscous flow property at the elevated temperature was studied. When the glass powders were packed and sintered at 550℃ to examine their feasibility as a low sintering temperature glass frit, contrary to expectations, glasses with lower SiO₂ content than 60 mol% showed no vitrification after sintering. High temperature microscopy revealed the viscous flow change of the silicate glasses with varying temperature and duration time and also indicated that the viscous flow was limited at low SiO₂ content. X-ray diffraction (XRD) on the sintered samples and Raman spectroscopy were carried out to shed light on the compositional dependency of viscous flow of silicate glasses.