• Journal of Welding and Joining
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• 제20권3호
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• pp.116-121
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• 2002

For the accumulation of a fundamental knowledge about the behavior of glass solder during the joining of ceramics, the wettability of solder on silicon nitride have been measured by sessile drop method. $SiO_2-MgO-Al_2O_3$ g1ass solder and oxynitride glass solders were selected as examples while silicon nitride which were used as substrates. Contact angle of solder on silicon nitride didn't decrease with time at high nitrogen content in the solder, but low nitrogen content in solders have the time-dependent property. Reason which contact angle of low nitrogen content in solders decrease on silicon nitride was that diffusion of nitrogen take place between solder and silicon nitride.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2004년도 정기학술대회
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• pp.147-151
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• 2004

In this study, an optical fiber assembly directly coupled with a laser diode or a photo diode is designed to confirm high reliable optical coupling efficiency of optical transmitter(Tx) and receiver(Rx). The optical fiber assembly is fabricated by soldering an optical fiber and a Kovar ferrule using a glass solder after inserting an optical fiber through a Kovar ferrule. The Kovar which has good welding characteristics is applied to introduce laser welding technique. The glass solder has excellent thermal characteristics such as thermal shift delamination compared with PbSn, AuSn solder previously used usually. Furthermore, the glass solder doesn't need fiber metalization and this enables low cost fabrication. However, the glass soldering is high temperature process over 35$0^{\circ}C$ and the convex shape after solidification due to surface tension causes the stress concentration on optical fiber. The stress concentration on the optical fiber increases the optical insertion loss and possibility of crack formation. The shape of glass solder was designed referring to 2-D Axi-symmetric FEM simulation. To test the mechanical reliability, mechanical vibration test and shock test were done according to Telcorida GR-468-Core protocol. After each test, the optical loss of the stress distributed fiber assembly didn't exceed 0.5 dB, which passes the test.

• Journal of Welding and Joining
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• 제21권1호
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• pp.107-113
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• 2003

Joining of $Si_3N_4$ to $Si_3N_4$ with crystallized glass solder was studied. $SiO_2-Al_2O_3-MgO$ glass with $P_2O_5$ as a crystallizing reagent was used as a solder. To improve the hish temperature toughness of joined specimen, two stage heat treatment was applied to Joined sample for the crystallization of joined layer, Two factors, i.e. thickness of soldered layer and crystallization were taken and thier effects on joining strength were investigated by a SEM-EDX observation of joined interface and bending strength both at room and elevated temperatures. Obtained results are summarized as follows: (1) Nitrogen diffused from $Si_3N_4$ to solder during the Joining process. Average amount of nitrogen in soldered layer depended on the thickness of the soldered layer and increased with decrease of the thickness. (2) Joining strength of the specimen having a thinner soldered layer was stronger than that of thicker layer. This can be mainly attributed to the difference of the nitrogen content in the soldered layer. (3) Higher content of nitrogen in solder brought forth higher viscosity of the solder. Hence the crystallization of the solder become more difficult in thinner layer of the solder than thicker one. (4) Thus, the effect of crystallization was evaluated mostly by the thicker layer specimen. Crystallization of soldered layer improved markedly the fracure strength of joining at higher temperatures than the softening temperature of glass solder.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Journal of Welding and Joining
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• 제19권3호
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• Journal of Welding and Joining
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• 제21권2호
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• pp.35-41
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• 2003

Sintered alumina ceramics were joined by 2 kinds of SiO$_2$-CaO-A1$_2$O$_3$ glass solders having a similar expansivity as alumina. Wetting of glass/alumina was examined by sessile drop method. The observation of interface and bending strength related to alumina/glass/alumina systems were investigated by means of SEM/EDX and 4-point bending test. the result are summarized as follow: (1) Wetting of glass solders on alumina was good at temperatures higher than 145$0^{\circ}C$. (2) When the joining temperature wan high, diffusion and/or reactions between solder md alumina took place at the interface. These diffusions and reactions occurring at the interface greatly affected the bending strength of joining body. (3) Highest strength corresponding to 80% that of alumina was obtained by the solder of 35SiO$_2$-35CaO-30A1$_2$O$_3$(wt%) glass.

• ETRI Journal
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• 제37권2호
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• 한국산학기술학회논문지
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• 제19권10호
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• pp.31-36
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• 2018

전기 소자 중의 하나인 퓨즈는 전기 부품에 비정상적으로 흐르게 되는 과전류로 인한 전로나 기기 보호를 위하여 사용 및 개발되고 있다. 대표적인 형태로는 유리관퓨즈가 많이 사용 되고 있는데, 최근 납이 함유된 솔더의 사용에 대한 국내 및 국제 규제가 강화 되면서 무연 솔더로의 변경으로 인한 문제가 대두 되고 있다. 본 연구에서는 유리관퓨즈의 솔더링 공정에서 솔더를 기존의 납이 함유된 솔더에서 무연 솔더로 변경 한 후, 퓨즈캡을 가용체와 솔더링할 때 용융된 솔더가 퓨즈 바깥으로 넘쳐흐르는 현상을 수치해석으로 모사하였고, 해석 결과를 바탕으로 솔더의 넘침 현상을 막을 수 있는 방안을 찾아 그 효과를 검증하였다. 검증 결과, 솔더링 실시 전에 유리관 내부의 온도를 충분히 증가시키는 것이 솔더의 넘침을 예방하는데 도움이 되며, 중력이 솔더가 흘러나가는 반대방향으로 작용하도록 솔더링을 하게 되면 넘침을 막는 데 효과가 있음을 확인하였다.