• Journal of the Korean Ceramic Society
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• v.50 no.1
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• pp.57-62
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• 2013

We investigated the thermal and electrical properties of the $B_2O_3-ZnO-Bi_2O_3$ glass system as a sealing material in sheath heater modules. A composition with over 90 wt% $Bi_2O_3$ in the $B_2O_3-ZnO-Bi_2O_3$ system was glassified by controlling the cooling rate. The glass transition temperature and thermal expansion coefficient in bismate glass could be controlled by the minor ingredients of ZnO, $SiO_2$, $BaO_2$, and $K_2O$. The $B_2O_3-ZnO-Bi_2O_3$ glass system bonded well to metal, and bismate glass insulating properties were comparable to those of bismate glass $B_2O_3-ZnO-PbO$ glass system in a sheath heater module.

• Journal of Sensor Science and Technology
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• v.29 no.5
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• Journal of the Korean Ceramic Society
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• v.20 no.1
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• pp.70-78
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• 1983

This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.149-154
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• 1999

Alumina substrate was sealed by PbO-ZnO-$B_2O_3$glass using microwave heating. The crystallization behaviour of sealing glass and the state of sealing joint were investigated and were compared with those of conventionally sealed one. Compared to the conventional one, the microwave heat-treated sample had well-grown $\textrm{PbTiO}_3$ crystals and high degree of crystallinity even though it had shorter heat-treatment time and lower heat-treatment temperature. Also, the microwave sealed sample exhibited relatively a good sealing state and almost same bending strength.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.11a
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• pp.87-95
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• 2005

Laser sealing/cutting technique, one of the 4 core technologies to manufacture self-luminous glass tubes (SLGTs) has been developed. Through the analysis of commercial products it is found that Pyrex Is used for SLGTs. A CO2 laser, which is commonly used for glass work was used for the study The factors affecting the sealing/cutting were laser intensity, duration. Irradiation method, and pressure inside the tube. The whole Process is composed of 2 stages. In the first stage. both ends of the tubes are sealed while tritium is insected in the tubes. And the tritium sealed tubes are cut in the desired size in the second stage. Defocused beam was used for seal ing and focused beam was used for cutting. After the sealing/cutting, the tubes were heat treated to prevent fracture due to the residual heat stress.

• Korean Journal of Materials Research
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• v.8 no.12
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• pp.1121-1126
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• 1998

For vacuum seated panel, stresses and displacements in the glass plate were calculated. The geometric variables for our experiment were the thickness of glass plate, the size of panel and the width of sealing line. The fracture behaviors and displacements of its under the vacuum were measured. From the measurement of strains and fracture, it was considered that the maximum stress acted at the middle of the sides of the panel. The stresses and displacement distribution of manufactured panels were greatly dependent on the width of the sealing line in the panel. The measured values are more similar to the values which were calculated from the condition of built-in edge as the width of the sealing line is larger. The measured displacement of the panel, made of 3mm thick glass plate, with size of $80\Times120\textrm{mm}^2$ and 20mm sealing line was $57\mu\textrm{m}$. This value is similar to calculated value, $54\mu\textrm{m}$, from built- in edge condition in the finite element method.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.5
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• pp.29-35
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• 2009

Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{\times}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.162-167
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• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1189-1190
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• 2013

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.1-7
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• 2001

In order to form a uniform oxidation layer of spinel phase on Kovar which helps the strong bonding in Kovar-to-glass sealing, the humidified $N_2/H_2$ was used as an oxidation atmosphere. The oxidation of Kovar was controlled by diffusion mechanism and the activation energy was 31.61 kacl/mol at 500~$800^{\circ}C$. After oxidation at $600^{\circ}C$, the external oxidation layer was below 0.5 $\mu \textrm{m}$ thick. According to TEM analysis, oxidized Kovar was spinel its lattice parameter of 7.9 $\AA$. Oxidation of under $600^{\circ}C$ and in a humidified $N_2/H_2$ atmosphere, Kovar was found to be appropriate for the Kovar-to-glass sealing.