• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.95-99
• /
• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

• Applied Chemistry for Engineering
• /
• v.22 no.1
• /
• pp.104-108
• /
• 2011

In the non-conductive adhesives (NCAs) for adhesion of micro electro mechanical system (MEMS), there are some problems such as delamination and cracking resulting from the large differences of coefficients of thermal expansion (CTE) between NCAs and substrates. So, the addition of inorganic particles such as silica and nano clay to the CTEs composit have been applied to reduce the CTEs of the adhesives. Additions of the flexibilizers such as siloxanes have also been performed to improve the flexibility of epoxy composite. Amino modified siloxane (AMSs) were used to improve compatibility between epoxy and siloxane. In this study, glass transition temperatures (Tg) and moduli of those composites were measured to confirm the effects of AMS with two different equivalents on thermal/mechanical properties of AMS/epoxy composites. Tg of KF-8010/epoxy composites decreased from 148 to $122^{\circ}C$ and those of X-22-161A/epoxy composites decreased from 148 to $121^{\circ}C$. Moduli of KF-8010/epoxy composites decreased from 2648 to 2143 MPa by adding KF-8010 and moduli of X-22-161A/epoxy composites decreased from 2648 to 2014 MPa. In short, using long Si-O chain AMS leads to a greater decrease in moduli. However, haven't showed significant differences in Tg's.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.8 no.4
• /
• pp.498-505
• /
• 2020

Aggregate occupies about 70-85% of the concrete volume and is an important factor in reducing the drying shrinkage of concrete. However, when constructing high-rise buildings, it acts as a problem due to the high load of natural aggregates. If the load becomes large during the construction of a high-rise building, creep may occur and the ground may be eroded. Material costs increase and there are financial problems. In order to reduce the load on concrete, we are working to reduce the weight of aggregates. However, artificial lightweight aggregates affect the interface between the aggregate and the paste due to its higher absorption rate and lower adhesion strength than natural aggregates, affecting the overall strength of concrete. Therefore, in this study, in order to grasp the interface between natural aggregate and lightweight aggregate by type, we adopted a method of measuring electrical resistance using an EIS measuring device, which is a non-destructive test, and lightweight bone. The change in the state of the interface was tested on the outside of the material through a blast furnace slag coating. As a result of the experiment, it was confirmed that the electric resistance was about 90% lower than that in the air-dried state through the electrolyte immersion, and the electric resistance differs depending on the type of aggregate and the presence or absence of coating. As a result of the experiment, the difference in compressive strength depending on the type of aggregate and the presence or absence of coating was shown, and the difference in impedance value and phase angle for each type of lightweight aggregate was shown.

• Membrane Journal
• /
• v.32 no.5
• /
• pp.292-303
• /
• 2022

An eco-friendly energy conversion device without the emission of pollutants has gained much attention due to the rapid use of fossil fuels inducing carbon dioxide emissions ever since the first industrial revolution in the 18th century. Polymer electrolyte membrane fuel cells (PEMFCs) that can produce water during the reaction without the emission of carbon dioxide are promising devices for automotive and residential applications. As a key component of PEMFCs, polymer electrolyte membranes (PEMs) need to have high proton conductivity and physicochemical stability during the operation. Currently, perfluorinated sulfonic acid-based PEMs (PFSA-PEMs) have been commercialized and utilized in PEMFC systems. Although the PFSA-PEMs are found to meet these criteria, there is an ongoing need to improve these further, to be useful in practical PEMFC operation. In addition, the well-known drawbacks of PFSA-PEMs including low glass transition temperature and high gas crossover need to be improved. Therefore, this review focused on recent trends in the development of high-performance PFSA-PEMs in three different ways. First, control of the side chain of PFSA copolymers can effectively improve the proton conductivity and thermal stability by increasing the ion exchange capacity and polymer crystallinity. Second, the development of composite-type PFSA-PEMs is an effective way to improve proton conductivity and physical stability by incorporating organic/inorganic additives. Finally, the incorporation of porous substrates is also a promising way to develop a thin pore-filling membrane showing low membrane resistance and outstanding durability.

• Journal of the Society of Disaster Information
• /
• v.19 no.3
• /
• pp.532-544
• /
• 2023

Purpose: To identify and evaluate the risk of chemical fire causative substances by using thermal analysis methods (DSC, TGA) for the hazards and physical property changes that occur when newly used biofuels are mixed with existing fuels It is to use it for identification and evaluation of the cause of fire by securing data related to the method and the hazards of the material according to it. Method: The research method used in this experiment is the differential scanning calorimeter (DSC: Difference in heat flux) through quantitative information on the caloric change from the location, shape, number, and area of peaks. flux) was measured, and the weight change caused by decomposition heat at a specific temperature was continuously measured by performing thermogravimetric analyzer (TGA: Thermo- gravimetric Analyzer). Result: First, in the heat flux graph, the boiling point of the material and the intrinsic characteristic value of the material or the energy required for decomposition can be checked. Second, as the content of biodiesel increased, many peaks were identified. Third, it was confirmed through analysis that substances with low expected boiling points were contained. Conclusion: It was shown that the physical risk of the material can be evaluated by using the risk of biodiesel, which is currently used as a new energy source, through various physical and chemical analysis techniques (DSC + TGA).In addition, it is expected that the comparison of differences between test methods and the accumulation and utilization of know-how on experiments in this study will be helpful in future studies on physical properties of hazardous materials and risk assessment of materials.

• Applied Chemistry for Engineering
• /
• v.34 no.3
• /
• pp.285-290
• /
• 2023

Poly-lactic acid (PLA) is the most promising polymer in additive manufacturing as an alternative to acrylonitrile butadiene styrene (ABS). Since it is produced from renewable resources such as corn starch and sugar beets, it is also biocompatible and biodegradable. However, PLA has a couple of issues that limit its use. First, it has a comparatively low glass transition temperature of around 60 ℃, such that it exhibits low thermal resistance. Second, PLA has low impact strength because it is brittle. Due to these problems, scientists have found methods to improve the crystallinity and ductility of PLA. Polyethylene glycol (PEG) is one of the most studied plasticizers for PLA to give it chain mobility. However, the blend of PLA and PEG becomes unstable, and phase separation occurs even at room temperature as PEG is self-crystallized. Thus, it is necessary to investigate the optimal mixing ratio of PLA-PEG at the molecular scale. In this study, molecular dynamics will be conducted with various ratios of L-type PLA (PLLA) or DL-type PLA-PEG (PDLA-PEG) systems by using BIOVIA Materials Studio.

• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.26 no.4A
• /
• pp.761-766
• /
• 2006

Polymer composite are increasingly considered as structural components for use in civil engineering, on account of their enhanced strength-to-weight ratios. Unsaturated polyester (UP) resin have been widely used for the matrix of composites such as FRP and polymer composite, due to its excellent adhesive. Polymer nanocomposites are new class of composites derived from the nano scale inorganic particles with dimensions typically in the range of 1 to 1000 nm that are dispersed in the polymer matrix homogeneously. Owing to the high aspect ratio of the fillers, mechanical, thermal, flame, retardant and barrier properties are enhanced without significant loss of clarity, toughness or impact strength. To prepare the MMT (Montmorillonite)-UP exfoliated nanocomposites, UP was mixed with MMT at $60^{\circ}C$ for 3 hours by using pan mixer. XRD (X-ray diffraction) pattern of the composites and TEM (Transmission Electron Micrographs) showed that the interlayer spacing of the modified MMT were exfoliated in polymer matrix. The mechanical properties also supported these findings, since in general, tensile strength, modulus with modified MMT were higher than those of the composites with unmodified MMT. The thermal stability of MMT-UP nanocomposite is better than that of pure UP, and its glass transition temperature is higher than that of pure UP. The polymer concrete made with MMT-UP nanocomposite has better mechanical properties than of pure UP. Therefore, it is suggested that strength and elastic modulus of polymer concrete was found to be positively tensile strength and tensile modulus of the MMT-UP nanocomposites.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.3
• /
• pp.40-50
• /
• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Journal of the Microelectronics and Packaging Society
• /
• v.31 no.3
• /
• pp.1-9
• /
• 2024

This paper addresses the significance of Cu/Polymer Hybrid Bonding technology in the advancement of semiconductor packaging. As the demands of the AI era increase, the semiconductor industry is exploring heterogeneous integration packaging technologies to achieve high I/O counts, low power consumption, efficient heat dissipation, multifunctionality, and miniaturization. The conventional Cu/SiO₂ Hybrid Bonding structure faces limitations such as achieving compatibility with CMP processes to attain surface roughness below 1nm and the occurrence of bonding defects due to particles. However, Cu/Polymer Hybrid Bonding technology, utilizing polymers, is gaining attention as a promising alternative to overcome these challenges. This study focuses on the deposition, patterning, and material properties of polymers essential for Cu/Polymer Hybrid Bonding, highlighting the advantages and potential applications of this technology compared to existing methods. Specifically, the use of polymers with low glass transition temperatures (Tg) is discussed for their benefits in low-temperature bonding processes and improved mechanical properties due to their high coefficients of thermal expansion. Furthermore, the study explores surface property modifications of polymers and the enhancement of bonding mechanisms through plasma treatment. This research emphasizes that Cu/Polymer Hybrid Bonding technology can serve as a critical breakthrough in developing high-performance, low-power semiconductor devices within the industry.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.100-101
• /
• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.