• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2556-2558
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• 1998

2-D microwell arrays for micro ELISA (Enzyme-Linked Immuno Solvent Assay) system were fabricated using micromachining technology. The materials for the bottom plate, top plate and sidewall of the microwell were used a #7740 glass, gold and silicon respectively considering bio-compatibility and easy fabrication. Cylindrical or groove shape microwells, which have about $100{\mu}m$ depth and $50{\sim}500{\mu}m$ diameter or width, were arrayed. The fabricated microwell array can be applied to the essential part of a biochip when surface modification is made to immobilize cells or biomolecules on the microwell bottom.

• 반도체디스플레이기술학회지
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• 제1권1호
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• pp.15-19
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• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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• pp.481-485
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• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.366-369
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• 2005

Electrochemical discharge machining (ECDM) has been found to be potential fur the micro-machining of non-conductive materials such as ceramics or glass. However this machining process has its own inherent problem that the reproducibility is too low to get the available geometric accuracy fur micromachining applications. One main challenge in reaching this goal is the control of the hydrogen built around the tool-electrode in which happen the discharges. This paper proposes the methods to improve the geometric accuracy using powder-mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy by averaging and decreasing the concentration of spark energy.

• 한국레이저가공학회지
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• 제17권1호
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• pp.1-6
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• 2014

Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.59.1-59.1
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• 2010

Aluminum-induced crystallization (AIC) of amorphous silicon (a-Si) is studied with the structure of a glass/Al/$SiO_2$/a-Si, in which the $SiO_2$ layer has micron-sized laser holes in the stack. An oxide layer between aluminum and a-Si thin films plays a significant role in the metal-induced crystallization (MIC) process determining the properties such as grain size and preferential orientation. In our case, the crystallization of a-Si is carried out only through the key hole because the $SiO_2$ layer is substantially thick enough to prevent a-Si from contacting aluminum. The crystal growth is successfully realized toward the only vertical direction, resulting a crystalline silicon grain with a size of $3{\sim}4{\mu}m$ under the hole. Lateral growth seems to be not occurred. For the AIC experiment, the glass/Al/$SiO_2$/a-Si stacks were prepared where an Al layer was deposited on glass substrate by DC sputter, $SiO_2$ and a-Si films by PECVD method, respectively. Prior to the a-Si deposition, a $30{\times}30$ micron-sized hole array with a diameter of $1{\sim}2{\mu}m$ was fabricated utilizing the femtosecond laser pulses to induce the AIC process through the key holes and the prepared workpieces were annealed in a thermal chamber for 2 hours. After heat treatment, the surface morphology, grain size, and crystal orientation of the polycrystalline silicon (pc-Si) film were evaluated by scanning electron microscope, transmission electron microscope, and energy dispersive spectrometer. In conclusion, we observed that the vertical crystal growth was occurred in the case of the crystallization of a-Si with aluminum by the MIC process in a small area. The pc-Si grain grew under the key hole up to a size of $3{\sim}4{\mu}m$ with the workpiece.

• 대한기계학회논문집B
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• 제33권10호
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• pp.778-782
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• 2009

Recently, we developed a simple thermopneumatic micropump having neither a membrane nor a valve. This micropump discharges liquid by a thermopneumatic pressure and refill by a capillary attraction. In case of the micropump driven by the capillary attraction, the flow characteristic depends mainly on the geometry of the micropump. In this paper, we investigated the influence of the geometry of the micropump on the performance of the micropump to illustrate the properness of the micropump shape. We analyzed the micropump characteristics of six types having different geometries by FVM simulation with a commercial CFD tool. Also we fabricated the micropumps with PDMS and glass by micromachining, and tested the performances. The simulation and the test results illustrate that the discharge volume and the discharge time depend on the chamber volume. The expansion angle of the inlet channel location has influence on the refill time, while the front air channel direction has influence on the backward flow loss.

• Journal of information and communication convergence engineering
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• 제6권1호
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• pp.38-42
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• 2008

Highly sensitive and mechanically stable gas sensors have been fabricated using the microfabrication and micromachining techniques. The sensing materials used to detect the offensive $CH_3SH$ and $(CH_3)_3N$ gases are 1 wt% Pd-doped $SnO_2$ and 6 wt% $Al_2O_3$-doped ZnO, respectively. The optimum operating temperatures of the devices are $250^{\circ}C$ and $350^{\circ}C$ for $CH_3SH$ and $(CH_3)_3N$, respectively and the corresponding heater power is, respectively, about 55mW and 85mW. Excellent thermal insulation is achieved by the use of a double-layer membrane: i.e. $0.2{\mu}m$-thick silicon nitride and $1.4{\mu}m$-thick phosphosilicate glass. The sensors are mechanically stable enough to endure the heat cycles between room temperature and $350^{\circ}C$, at least for 30 days.

• 한국정밀공학회지
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• 제27권3호
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• pp.18-26
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• 2010

Diffraction gratings with precise spatial periods of 2 ${\mu}m$ and 5 ${\mu}m$ have been fabricated by using a femtosecond laser which does not have limits on materials of micromachining and small thermal effects due to high peak power. Diffraction angle and diffraction efficiency of those were measured. Simulation results of diffraction angle and diffraction efficiency of the diffraction grating calculated with the parameters such as line width, depth, and spatial period of the fabricated gratings were compared with experimental results measured with a He-Ne laser. Besides these, Fresnel Zone Plates (FZPs) with focal distances of 50 mm and 25 mm were fabricated and focal distances of fabricated FZP were measured. Those experimental results for diffraction gratings and FZPs match well with experimental results.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.110-110
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• 2000

Cantilever-shaped lateral field emitters were fabricated and their electrical characteristics were tested. As shown in Fig.1, poly-silicon cantilevers were fabricated by the surface micromachining and they were used to the vacuum magnetic field sensors. The tunneling devices were vacuum sealed with the tubeless packaging method, as shown in Fig.2 and Fig.3. The soda-lime glasses were used for better encapsulation, so the sputtered silicon and the glass layers on the soda-lime glasses were bonded together at 1x10$^{-6}$ Torr. The getter was activated after the vacuum sealing fur the stable emissions. The devices were tested outside of the vacuum chamber. Through vacuum packaging, the tunneling sensors can be utilized. Fig.4 shows that the sensor operates with the switching of the magnetic field. When the magnetic field was applied to the device, the anode currents were varied by the Lorentz force. The difference of anode currents can be varied with the strength of the applied magnetic field.